AMD XC4VLX25-11FFG676C
- Part No.:
- XC4VLX25-11FFG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC4VLX25-11FFG676C.pdf
- Description:
- IC FPGA 448 I/O 676FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC4VLX25-11FFG676C from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA with 24,192 logic cells, 1.2 Mb of block RAM, and 192 DSP48 slices. It features SelectIO technology supporting LVDS, SSTL, HSTL, and GTL standards, and is packaged in a 676-pin Fine-Pitch Flip-Chip BGA (FFG676) with 0.8 mm pitch. It is used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC4VLX25-11FFG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, embedded memory capacity, DSP slice count, I/O voltage flexibility, and timing grade (-11 speed grade).
Technical Context
The XC4VLX25-11FFG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated routing resources. It integrates 192 hard-wired 18×18-bit signed multipliers in DSP48 slices, supports up to 500 MHz system clocking via DCMs, and provides 448 user I/Os across 16 banks with independent VCCO and VREF per bank.
It includes dual-clock management (DCM) modules for phase shifting, frequency synthesis, and jitter reduction, and supports partial reconfiguration through configuration port access. The -11 speed grade guarantees worst-case propagation delay of 1.1 ns for CLB-to-CLB paths under industrial temperature conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,192 - total programmable logic capacity for combinatorial and sequential logic implementation |
| Block RAM | 1,244,160 bits (1.2 Mb) - dedicated on-chip memory for FIFOs, buffers, and lookup tables |
| DSP Slices | 192 × 18×18-bit multipliers - fixed-function arithmetic acceleration for filtering and FFT |
| I/O Count | 448 user-configurable pins - supports mixed-voltage interfaces across 16 banks |
| Speed Grade | -11 - fastest timing bin for this device, enabling 500 MHz DCM output and sub-2 ns CLB delays |
| Package | FFG676 - 676-ball fine-pitch flip-chip BGA, 27×27 mm, 0.8 mm pitch, RoHS-compliant |
| Operating Temp | 0°C to 85°C (Commercial) - validated thermal performance for non-extended environments |
Pinout & Package
XC4VLX25-11FFG676C is housed in a 676-ball Fine-Pitch Flip-Chip BGA (FFG676) package with 27×27 array, 0.8 mm ball pitch, and standard JEDEC MO-251AC footprint. Thermal and mechanical data confirm 2.0 W typical power dissipation at full utilization under industrial conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.2 V ±3% required for internal logic and CLBs; decoupling critical for signal integrity |
| VCCAUX | Auxiliary supply | 2.5 V ±5% powers DCMs, SelectIO, and configuration circuitry |
| VCCO | I/O bank supply | 1.2–3.3 V per bank; sets output swing and input threshold for that bank |
| PROGRAM_B | Configuration control | Active-low asynchronous reset for configuration state machine; pulls high via external resistor |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and initialization completion |
Key Features
| Feature | Design Value |
|---|---|
| Dual DCMs per device | Enables simultaneous clock multiplication, phase alignment, and jitter cleanup for multiple domains |
| SelectIO technology | Supports 18 I/O standards including LVDS, SSTL-2, HSTL-I, and GTL+ without external level shifters |
| Partial reconfiguration support | Allows dynamic logic module swapping during operation-reducing system downtime and memory footprint |
| Embedded PowerPC 405 cores (optional) | Not present in LX25 variant; only available in FX family-this part is logic-only |
| Multi-standard transceivers | Not integrated; high-speed serial I/O requires external PHY-Virtex-4 LX lacks built-in RocketIO |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based radar systems. IC Role / Device Role / Timing Role: Configurable datapath accelerator handling parallel FFTs, FIR filters, and coordinate transformations. Use Value: 192 DSP48 slices enable concurrent 1024-point FFTs at 100 MS/s; -11 speed grade ensures deterministic latency under burst load. | Use Scenario: High-throughput image reconstruction pipeline in CT and MRI scanners. IC Role / Device Role / Timing Role: Co-processor managing raw sensor data ingestion, noise reduction, and back-projection logic. Use Value: 1.2 Mb block RAM buffers multi-frame DICOM datasets; 448 I/Os interface directly to ADCs, DDR2 memory, and PCIe endpoints. |
| Industrial Protocol Gateway | Avionics Data Concentrator |
Use Scenario: Fieldbus protocol translation (PROFIBUS ↔ EtherCAT ↔ Modbus TCP) in smart PLCs. IC Role / Device Role / Timing Role: Reconfigurable protocol engine implementing MAC-layer state machines and packet parsing logic. Use Value: SelectIO flexibility allows simultaneous 2.5 V PROFIBUS and 3.3 V EtherCAT I/O on shared banks; CLB density supports 8 concurrent protocol stacks. | Use Scenario: ARINC 429/664 (AFDX) data aggregation and time-triggered scheduling in flight control units. IC Role / Device Role / Timing Role: Deterministic time-aware switch fabric with hardware timestamping and bandwidth reservation. Use Value: DCM-generated 80 MHz and 125 MHz clocks meet AFDX jitter < 100 ns; -11 grade guarantees worst-case path timing closure at 85°C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX25-10FF676C | Slower -10 speed grade; 10% higher CLB-to-CLB delay; identical logic count, RAM, and DSP resources | Suitable for lower-frequency control planes where 400 MHz DCM output suffices | Select when timing margin exists and cost sensitivity outweighs peak throughput needs |
| XCVU9P-2FLGA2104E | UltraScale+ architecture; 258K LUTs, 46 Mb BRAM, 2,592 DSP slices; 2104-pin FC-BGA | Targets AI inference acceleration and 100 GbE line cards-not drop-in compatible | Choose for new designs requiring >5× logic density and hardened PCIe 4.0/DDR4 controllers |
Compared with XC4VLX25-11FFG676C, the -10 variant trades speed for cost in legacy systems, while the VU9P offers generational scalability at the expense of PCB redesign, toolchain migration, and higher power consumption.
Availability
XC4VLX25-11FFG676C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend systems, and industrial protocol gateway applications requiring stable component supply and long-term obsolescence management.
Supply support for XC4VLX25-11FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Virtex-4 LX family was designed for high-density logic-intensive applications such as baseband processing, video encoding, and reconfigurable computing-prioritizing logic capacity, embedded memory, and I/O flexibility over hard IP.
FAQ
What is the maximum operating frequency supported by XC4VLX25-11FFG676C?
The XC4VLX25-11FFG676C supports a maximum DCM output frequency of 500 MHz and guarantees CLB-to-CLB propagation delays ≤1.1 ns at 85°C. Actual system clock rates depend on design placement, routing, and I/O standard selection-verified timing closure is achievable up to 320 MHz for fully pipelined datapaths.
Does XC4VLX25-11FFG676C include built-in transceivers for high-speed serial communication?
No, XC4VLX25-11FFG676C does not integrate RocketIO or any other high-speed serial transceiver. It relies on external PHY devices for protocols like Gigabit Ethernet or Serial RapidIO. This distinguishes it from Virtex-4 FX and SX families, which include multi-gigabit transceivers.
What configuration modes are supported by XC4VLX25-11FFG676C?
XC4VLX25-11FFG676C supports Master SelectMAP, Slave SelectMAP, and JTAG configuration modes. Bitstream loading can be initiated via PROM, microcontroller, or boundary-scan controller. Configuration data is loaded through dedicated CCLK, DIN, and INIT_B signals in parallel or serial fashion.
Is XC4VLX25-11FFG676C pin-compatible with other Virtex-4 LX devices in the same package?
XC4VLX25-11FFG676C shares the FFG676 package footprint with XC4VLX40, XC4VLX60, and XC4VLX80 in the same speed grade, but pin functions differ due to varying I/O counts and bank allocations. No pin-to-pin compatibility exists across density variants-each requires unique PCB layout and constraint files.
What is the recommended power supply sequencing for XC4VLX25-11FFG676C?
Per Xilinx UG070, VCCAUX must be powered before or simultaneously with VCCINT, and VCCO may be applied at any time. Recommended ramp times are <100 ms, with monotonic rise and no reverse bias. Decoupling requires 10 µF bulk + 0.1 µF ceramic per VCCINT/VCCAUX supply pin pair.
XC4VLX25-11FFG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2688
- Number of Logic Elements/Cells:
- 24192
- Total RAM Bits:
- 1327104
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC4VLX25-11FFG676C FAQ
1.How can I place an order for XC4VLX25-11FFG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX25-11FFG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX25-11FFG676C reliable?
The price and inventory of XC4VLX25-11FFG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX25-11FFG676C is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX25-11FFG676C transactions.
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Once your XC4VLX25-11FFG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX25-11FFG676C?
For technical support, including XC4VLX25-11FFG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX25-11FFG676C requirements.
6.How does Aetrix verify that XC4VLX25-11FFG676C is sourced from the original manufacturer or authorized distributors?
All XC4VLX25-11FFG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX25-11FFG676C meets industry standards.
7.What is the process for return or replacement of XC4VLX25-11FFG676C?
All XC4VLX25-11FFG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX25-11FFG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX25-11FFG676C part is unused and in its original packaging.
Return procedure for XC4VLX25-11FFG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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