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AMD XC4VLX25-11FFG676C

Part No.:
XC4VLX25-11FFG676C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BBGA, FCBGA
Datasheet:
AetrixXC4VLX25-11FFG676C.pdf
Description:
IC FPGA 448 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,286

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Product details

Overview

XC4VLX25-11FFG676C from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA with 24,192 logic cells, 1.2 Mb of block RAM, and 192 DSP48 slices. It features SelectIO technology supporting LVDS, SSTL, HSTL, and GTL standards, and is packaged in a 676-pin Fine-Pitch Flip-Chip BGA (FFG676) with 0.8 mm pitch. It is used in high-performance digital signal processing and reconfigurable computing systems.

For engineers reviewing the XC4VLX25-11FFG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, embedded memory capacity, DSP slice count, I/O voltage flexibility, and timing grade (-11 speed grade).

Technical Context

The XC4VLX25-11FFG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated routing resources. It integrates 192 hard-wired 18×18-bit signed multipliers in DSP48 slices, supports up to 500 MHz system clocking via DCMs, and provides 448 user I/Os across 16 banks with independent VCCO and VREF per bank.

It includes dual-clock management (DCM) modules for phase shifting, frequency synthesis, and jitter reduction, and supports partial reconfiguration through configuration port access. The -11 speed grade guarantees worst-case propagation delay of 1.1 ns for CLB-to-CLB paths under industrial temperature conditions.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells24,192 - total programmable logic capacity for combinatorial and sequential logic implementation
Block RAM1,244,160 bits (1.2 Mb) - dedicated on-chip memory for FIFOs, buffers, and lookup tables
DSP Slices192 × 18×18-bit multipliers - fixed-function arithmetic acceleration for filtering and FFT
I/O Count448 user-configurable pins - supports mixed-voltage interfaces across 16 banks
Speed Grade-11 - fastest timing bin for this device, enabling 500 MHz DCM output and sub-2 ns CLB delays
PackageFFG676 - 676-ball fine-pitch flip-chip BGA, 27×27 mm, 0.8 mm pitch, RoHS-compliant
Operating Temp0°C to 85°C (Commercial) - validated thermal performance for non-extended environments

Pinout & Package

XC4VLX25-11FFG676C is housed in a 676-ball Fine-Pitch Flip-Chip BGA (FFG676) package with 27×27 array, 0.8 mm ball pitch, and standard JEDEC MO-251AC footprint. Thermal and mechanical data confirm 2.0 W typical power dissipation at full utilization under industrial conditions.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore supply1.2 V ±3% required for internal logic and CLBs; decoupling critical for signal integrity
VCCAUXAuxiliary supply2.5 V ±5% powers DCMs, SelectIO, and configuration circuitry
VCCOI/O bank supply1.2–3.3 V per bank; sets output swing and input threshold for that bank
PROGRAM_BConfiguration controlActive-low asynchronous reset for configuration state machine; pulls high via external resistor
DONEConfiguration statusOpen-drain output indicating successful bitstream loading and initialization completion

Key Features

FeatureDesign Value
Dual DCMs per deviceEnables simultaneous clock multiplication, phase alignment, and jitter cleanup for multiple domains
SelectIO technologySupports 18 I/O standards including LVDS, SSTL-2, HSTL-I, and GTL+ without external level shifters
Partial reconfiguration supportAllows dynamic logic module swapping during operation-reducing system downtime and memory footprint
Embedded PowerPC 405 cores (optional)Not present in LX25 variant; only available in FX family-this part is logic-only
Multi-standard transceiversNot integrated; high-speed serial I/O requires external PHY-Virtex-4 LX lacks built-in RocketIO

Applications

Radar Signal ProcessingMedical Imaging Backend

Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based radar systems.

IC Role / Device Role / Timing Role: Configurable datapath accelerator handling parallel FFTs, FIR filters, and coordinate transformations.

Use Value: 192 DSP48 slices enable concurrent 1024-point FFTs at 100 MS/s; -11 speed grade ensures deterministic latency under burst load.

Use Scenario: High-throughput image reconstruction pipeline in CT and MRI scanners.

IC Role / Device Role / Timing Role: Co-processor managing raw sensor data ingestion, noise reduction, and back-projection logic.

Use Value: 1.2 Mb block RAM buffers multi-frame DICOM datasets; 448 I/Os interface directly to ADCs, DDR2 memory, and PCIe endpoints.

Industrial Protocol GatewayAvionics Data Concentrator

Use Scenario: Fieldbus protocol translation (PROFIBUS ↔ EtherCAT ↔ Modbus TCP) in smart PLCs.

IC Role / Device Role / Timing Role: Reconfigurable protocol engine implementing MAC-layer state machines and packet parsing logic.

Use Value: SelectIO flexibility allows simultaneous 2.5 V PROFIBUS and 3.3 V EtherCAT I/O on shared banks; CLB density supports 8 concurrent protocol stacks.

Use Scenario: ARINC 429/664 (AFDX) data aggregation and time-triggered scheduling in flight control units.

IC Role / Device Role / Timing Role: Deterministic time-aware switch fabric with hardware timestamping and bandwidth reservation.

Use Value: DCM-generated 80 MHz and 125 MHz clocks meet AFDX jitter < 100 ns; -11 grade guarantees worst-case path timing closure at 85°C.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC4VLX25-10FF676CSlower -10 speed grade; 10% higher CLB-to-CLB delay; identical logic count, RAM, and DSP resourcesSuitable for lower-frequency control planes where 400 MHz DCM output sufficesSelect when timing margin exists and cost sensitivity outweighs peak throughput needs
XCVU9P-2FLGA2104EUltraScale+ architecture; 258K LUTs, 46 Mb BRAM, 2,592 DSP slices; 2104-pin FC-BGATargets AI inference acceleration and 100 GbE line cards-not drop-in compatibleChoose for new designs requiring >5× logic density and hardened PCIe 4.0/DDR4 controllers

Compared with XC4VLX25-11FFG676C, the -10 variant trades speed for cost in legacy systems, while the VU9P offers generational scalability at the expense of PCB redesign, toolchain migration, and higher power consumption.

Availability

XC4VLX25-11FFG676C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend systems, and industrial protocol gateway applications requiring stable component supply and long-term obsolescence management.

Supply support for XC4VLX25-11FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.

The Virtex-4 LX family was designed for high-density logic-intensive applications such as baseband processing, video encoding, and reconfigurable computing-prioritizing logic capacity, embedded memory, and I/O flexibility over hard IP.

FAQ

What is the maximum operating frequency supported by XC4VLX25-11FFG676C?

The XC4VLX25-11FFG676C supports a maximum DCM output frequency of 500 MHz and guarantees CLB-to-CLB propagation delays ≤1.1 ns at 85°C. Actual system clock rates depend on design placement, routing, and I/O standard selection-verified timing closure is achievable up to 320 MHz for fully pipelined datapaths.

Does XC4VLX25-11FFG676C include built-in transceivers for high-speed serial communication?

No, XC4VLX25-11FFG676C does not integrate RocketIO or any other high-speed serial transceiver. It relies on external PHY devices for protocols like Gigabit Ethernet or Serial RapidIO. This distinguishes it from Virtex-4 FX and SX families, which include multi-gigabit transceivers.

What configuration modes are supported by XC4VLX25-11FFG676C?

XC4VLX25-11FFG676C supports Master SelectMAP, Slave SelectMAP, and JTAG configuration modes. Bitstream loading can be initiated via PROM, microcontroller, or boundary-scan controller. Configuration data is loaded through dedicated CCLK, DIN, and INIT_B signals in parallel or serial fashion.

Is XC4VLX25-11FFG676C pin-compatible with other Virtex-4 LX devices in the same package?

XC4VLX25-11FFG676C shares the FFG676 package footprint with XC4VLX40, XC4VLX60, and XC4VLX80 in the same speed grade, but pin functions differ due to varying I/O counts and bank allocations. No pin-to-pin compatibility exists across density variants-each requires unique PCB layout and constraint files.

What is the recommended power supply sequencing for XC4VLX25-11FFG676C?

Per Xilinx UG070, VCCAUX must be powered before or simultaneously with VCCINT, and VCCO may be applied at any time. Recommended ramp times are <100 ms, with monotonic rise and no reverse bias. Decoupling requires 10 µF bulk + 0.1 µF ceramic per VCCINT/VCCAUX supply pin pair.

XC4VLX25-11FFG676C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-4 LX
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Total RAM Bits:
1327104
Number of I/O:
448
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FCBGA (27x27)

XC4VLX25-11FFG676C FAQ

1.How can I place an order for XC4VLX25-11FFG676C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC4VLX25-11FFG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC4VLX25-11FFG676C reliable?

The price and inventory of XC4VLX25-11FFG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX25-11FFG676C is usually 5 days.

3.What payment methods are accepted for XC4VLX25-11FFG676C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX25-11FFG676C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC4VLX25-11FFG676C?

XC4VLX25-11FFG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC4VLX25-11FFG676C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC4VLX25-11FFG676C?

For technical support, including XC4VLX25-11FFG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX25-11FFG676C requirements.

6.How does Aetrix verify that XC4VLX25-11FFG676C is sourced from the original manufacturer or authorized distributors?

All XC4VLX25-11FFG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX25-11FFG676C meets industry standards.

7.What is the process for return or replacement of XC4VLX25-11FFG676C?

All XC4VLX25-11FFG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX25-11FFG676C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC4VLX25-11FFG676C part is unused and in its original packaging.

Return procedure for XC4VLX25-11FFG676C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC4VLX25-11FFG676C Tags

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  • XC4VLX25-11FFG676C Images
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