AMD XC4VLX25-11SF363I

Overview

XC4VLX25-11SF363I from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA with 24,192 logic cells, 1.2 Mb of block RAM, and 192 DSP48 slices. It features SelectIO™ technology supporting LVDS, SSTL, HSTL, and GTL interfaces, and is packaged in a 363-pin Fine-Pitch Ball Grid Array (FBGA) with 0.8 mm pitch. It targets high-performance embedded processing and reconfigurable digital signal processing in telecom infrastructure.

For engineers reviewing the XC4VLX25-11SF363I datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage flexibility (1.2 V to 3.3 V), -11 speed grade (1.1 ns CLB propagation delay), thermal performance in industrial temperature range (-40°C to +100°C), and compatibility with Xilinx ISE Design Suite v14.7.

Technical Context

The XC4VLX25-11SF363I implements a hierarchical architecture with configurable logic blocks (CLBs), dedicated arithmetic units (DSP48), and distributed memory. It supports multi-standard I/O with programmable slew rate, drive strength, and on-chip termination (up to 150 Ω).

It integrates clock management tiles (CMT) containing DCMs for frequency synthesis and phase alignment, and supports partial reconfiguration via ICAP interface. Configuration is performed through Master SelectMAP or JTAG modes using external PROM or processor-controlled loading.

Key Specifications

Pinout & Package

XC4VLX25-11SF363I is housed in a 363-pin Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm ball pitch and 27 × 27 mm body size. The package supports thermal dissipation up to 5.2 W under typical operating conditions and includes dedicated configuration, clock, and power delivery pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC4VLX25-11SF363I, the -10 variant trades 100 MHz system clock margin for lower power and cost, while the XC5VLX30T adds PCIe and higher DSP throughput but requires board redesign due to different package and voltage requirements.

Availability

XC4VLX25-11SF363I is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and industrial motion control systems requiring stable component supply across extended product lifecycles.

Supply support for XC4VLX25-11SF363I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues to support legacy Virtex families. Xilinx pioneered high-performance FPGA architectures for demanding signal processing and communications applications.

The Virtex-4 LX series was designed for logic-intensive, high-bandwidth applications including baseband processing, protocol acceleration, and real-time control - emphasizing I/O flexibility, DSP efficiency, and industrial temperature reliability.

FAQ

What is the maximum supported I/O standard voltage for XC4VLX25-11SF363I?

The XC4VLX25-11SF363I supports I/O bank voltages from 1.2 V to 3.3 V, with each of its eight I/O banks independently configurable. This allows simultaneous interfacing with DDR2 SDRAM (1.8 V), PCI-X (3.3 V), and low-voltage SERDES receivers (1.2 V) without level-shifting components. The XC4VLX25-11SF363I datasheet specifies absolute maximum I/O voltage as VCCO + 0.5 V.

Does XC4VLX25-11SF363I support partial reconfiguration?

Yes, XC4VLX25-11SF363I supports partial reconfiguration via its Internal Configuration Access Port (ICAP). This enables dynamic replacement of specific logic modules without resetting the entire device or disrupting active functions. Implementation requires Xilinx ISE Design Suite v14.7 with PlanAhead tools and proper floorplanning of reconfigurable regions in the XC4VLX25-11SF363I bitstream.

What configuration modes are available for XC4VLX25-11SF363I?

XC4VLX25-11SF363I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial PROM configuration modes. Master SelectMAP uses an internal oscillator to drive CCLK and load bitstream from external parallel flash; JTAG is used for debugging and programming during development. All modes are fully documented in the XC4VLX25-11SF363I Configuration User Guide (UG071).

What is the thermal resistance (θJA) of the XC4VLX25-11SF363I package?

The XC4VLX25-11SF363I in the 363-pin FBGA package has a junction-to-ambient thermal resistance (θJA) of 22.5°C/W under JEDEC-standard 2S2P board conditions. Measured junction temperature must remain below 100°C for industrial operation; thermal design should include 2 oz copper planes and ≥4 thermal vias per power ball for sustained 5.2 W dissipation.

Is XC4VLX25-11SF363I compatible with Xilinx ISE 14.7?

Yes, XC4VLX25-11SF363I is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, timing analysis, and bitstream generation. The XC4VLX25-11SF363I device files and simulation models are included in the ISE 14.7 installation; no patch or service pack is required for basic functionality or timing closure at -11 speed grade.