My Inquiry
My Account
AMD XC4VLX25-11SFG363C
- Part No.:
- XC4VLX25-11SFG363C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 363-FBGA, FCBGA
- Datasheet:
-
XC4VLX25-11SFG363C.pdf
- Description:
- IC FPGA 240 I/O 363FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,544
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC4VLX25-11SFG363C from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA featuring 24,192 logic cells, 1.2 Mb of block RAM, and 192 DSP48 slices. It supports up to 500 MHz system clocking and is packaged in a 363-pin Fine-Pitch Ball Grid Array (FBGA) with 1.0 mm pitch. This device targets high-performance digital signal processing and embedded control applications in telecom infrastructure.
For engineers reviewing the XC4VLX25-11SFG363C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (240 user I/Os), speed grade (-11), thermal performance (commercial temperature range 0°C to 85°C), and compatibility with Xilinx ISE design tools and Spartan-3/4 migration paths.
Technical Context
The XC4VLX25-11SFG363C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated carry chains, and distributed RAM. It integrates SelectIO technology supporting LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS and RSDS.
Its embedded PowerPC 405 hard processor core option is not present in this LX-series variant; instead, it emphasizes logic density and DSP throughput. Configuration occurs via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,192 - defines maximum combinational and sequential logic capacity for RTL synthesis |
| Block RAM | 1,244,160 bits (1.2 Mb) - supports large FIFOs, buffers, and on-chip data storage without external memory |
| DSP Slices | 192 × 18×18 multipliers - enables parallel MAC operations for FIR filters and FFT engines |
| User I/O Pins | 240 - provides flexible interface routing across multiple voltage domains and signaling standards |
| Speed Grade | -11 - guarantees timing closure at 500 MHz system clock frequency under worst-case commercial conditions |
| Operating Temp | 0°C to +85°C - validated for use in fan-cooled telecom line cards and industrial controllers |
| Package | 363-pin FCBGA (SFG363) - 19×19 mm body, 1.0 mm ball pitch, RoHS-compliant lead-free finish |
Pinout & Package
The XC4VLX25-11SFG363C is housed in a 363-ball Fine-Pitch Ball Grid Array (SFG363) package with corner balls omitted and thermal pad exposed on underside. Pinout follows Xilinx Virtex-4 LX25 standard layout per UG070 v2.5.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master Serial mode; must be driven by external source or oscillator |
| DIN | Configuration Data Input | Serial bitstream input for FPGA programming; synchronous to CCLK edge |
| INIT_B | Configuration Status Output | Open-drain active-low signal indicating configuration memory readiness or error condition |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| M0–M2 | Mode Selection Inputs | Three-pin encoding selects configuration mode (JTAG, Master/Slave Serial, SelectMAP) |
Key Features
| Feature | Design Value |
|---|---|
| Advanced SelectIO Technology | Supports 18 I/O standards including LVDS, RSDS, and SSTL-2 with programmable drive strength and slew rate |
| Embedded Multiplier Blocks | 192 dedicated 18×18-bit signed/unsigned multipliers enable pipelined arithmetic at 500 MHz |
| Flexible Clock Management | Four DCMs (Digital Clock Managers) provide phase shifting, frequency synthesis, and duty cycle correction |
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset-verified in Xilinx ISE 12.4+ toolflow |
| Multi-Voltage I/O Banks | 16 independent banks support mixed-voltage operation (1.2V to 3.3V) for interfacing legacy and modern peripherals |
Applications
| Wireless Baseband Processing | High-Speed Protocol Bridging |
|---|---|
Use Scenario: Real-time channel coding/decoding and modulation/demodulation in LTE eNodeB baseband units. IC Role / Device Role / Timing Role: Programmable logic fabric executing Viterbi, Turbo, and LDPC algorithms with deterministic latency. Use Value: 192 DSP48 slices deliver >20 GOPS at 200 MHz, enabling dual-stream MIMO processing within single XC4VLX25-11SFG363C. | Use Scenario: Converting between PCI Express 1.0 and SRIO 1.2 protocols in radar data concentrators. IC Role / Device Role / Timing Role: Glue logic and packet translation engine with precise timing alignment across asynchronous clock domains. Use Value: Four DCMs maintain sub-nanosecond skew between PCIe REFCLK and SRIO SYSCLK, ensuring link training success. |
| Industrial Motion Control | Avionics Data Acquisition |
Use Scenario: Closed-loop servo control with 16-axis interpolation and real-time safety monitoring in CNC machine tools. IC Role / Device Role / Timing Role: Deterministic state-machine executor with hardware-accelerated trajectory generation and encoder feedback processing. Use Value: 240 user I/Os directly connect to 16 quadrature encoders and 64 PWM outputs-no external bus transceivers required. | Use Scenario: ARINC 429 and MIL-STD-1553B data acquisition in flight test instrumentation pods. IC Role / Device Role / Timing Role: Dual-protocol interface controller with time-stamped packet buffering and error detection logic. Use Value: Block RAM provides 128 KB deep buffer for burst-mode sensor data capture at 10 MB/s sustained rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital logic and signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX25-10FF668C | Same logic resources but -10 speed grade and 668-pin FF package; lower max frequency (450 MHz) and larger footprint | Preferred where board space allows larger package and thermal margin exceeds requirements | Select when higher I/O count (320 pins) and relaxed timing budget justify added PCB area |
| XC5VLX30T-1FF324C | Virtex-5 family; 30K logic cells, enhanced DSP48E slices, and integrated GTP transceivers-requires ISE 13.1+ tool support | Suitable for designs requiring serial transceivers or higher logic density with lower power per gate | Choose for new designs needing native 3.125 Gbps serial I/O or improved power efficiency over XC4VLX25-11SFG363C |
Compared with XC4VLX25-11SFG363C, the XC4VLX25-10FF668C trades speed and compactness for I/O scalability, while the XC5VLX30T-1FF324C introduces transceiver capability and architectural improvements at the cost of legacy toolchain compatibility and higher unit cost.
Availability
XC4VLX25-11SFG363C is available at Aetrix Electronics and suitable for wireless infrastructure, industrial automation, and avionics systems requiring stable component supply and long-term obsolescence management.
Supply support for XC4VLX25-11SFG363C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software-defined hardware solutions.
The Virtex-4 LX family-including XC4VLX25-11SFG363C-was designed for high-bandwidth logic-intensive applications such as baseband processing, protocol acceleration, and real-time control where predictable timing and I/O flexibility are critical.
FAQ
What is the maximum operating frequency supported by the XC4VLX25-11SFG363C?
The XC4VLX25-11SFG363C is rated for a system clock frequency of up to 500 MHz under worst-case commercial conditions, as confirmed by its -11 speed grade and timing analysis in Xilinx ISE 12.4. This applies to internal logic paths constrained by DCM output clocks and verified through static timing analysis-not guaranteed for all user-defined paths without proper constraints and placement.
Does the XC4VLX25-11SFG363C include embedded processors?
No, the XC4VLX25-11SFG363C belongs to the Virtex-4 LX (Logic Optimized) series and does not integrate hard PowerPC cores. Those are found only in the FX and SX families. The XC4VLX25-11SFG363C relies on soft-core implementations like MicroBlaze if processor functionality is required.
What configuration methods are supported by the XC4VLX25-11SFG363C?
The XC4VLX25-11SFG363C supports Master Serial, Slave Serial, JTAG, and SelectMAP configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Configuration bitstreams can be loaded from SPI PROM, microcontroller, or boundary-scan chain depending on selected mode.
Is the XC4VLX25-11SFG363C RoHS compliant?
Yes, the XC4VLX25-11SFG363C carries RoHS-compliant packaging with lead-free solder finish and meets EU Directive 2011/65/EU. Its SFG363 package uses matte tin plating over copper pillars and conforms to JEDEC J-STD-020 moisture sensitivity level 3.
Can the XC4VLX25-11SFG363C be used in automotive applications?
The XC4VLX25-11SFG363C is specified for commercial temperature range (0°C to +85°C) and is not qualified to AEC-Q100. It may be used in under-hood automotive applications only with external thermal management and derating, but is primarily intended for telecom, industrial, and avionics environments where extended temperature variants are not required.
XC4VLX25-11SFG363C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 363-FBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2688
- Number of Logic Elements/Cells:
- 24192
- Total RAM Bits:
- 1327104
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 363-FCBGA (17x17)
XC4VLX25-11SFG363C FAQ
1.How can I place an order for XC4VLX25-11SFG363C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX25-11SFG363C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX25-11SFG363C reliable?
The price and inventory of XC4VLX25-11SFG363C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX25-11SFG363C is usually 5 days.
3.What payment methods are accepted for XC4VLX25-11SFG363C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX25-11SFG363C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX25-11SFG363C?
XC4VLX25-11SFG363C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX25-11SFG363C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX25-11SFG363C?
For technical support, including XC4VLX25-11SFG363C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX25-11SFG363C requirements.
6.How does Aetrix verify that XC4VLX25-11SFG363C is sourced from the original manufacturer or authorized distributors?
All XC4VLX25-11SFG363C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX25-11SFG363C meets industry standards.
7.What is the process for return or replacement of XC4VLX25-11SFG363C?
All XC4VLX25-11SFG363C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX25-11SFG363C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX25-11SFG363C part is unused and in its original packaging.
Return procedure for XC4VLX25-11SFG363C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC4VLX25-11SFG363C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
