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AMD XC4VLX25-11SFG363I
- Part No.:
- XC4VLX25-11SFG363I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 363-FBGA, FCBGA
- Datasheet:
-
XC4VLX25-11SFG363I.pdf
- Description:
- IC FPGA 240 I/O 363FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,600
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Product details
Overview
XC4VLX25-11SFG363I from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA with 24,192 logic cells, 1.5 Mb of block RAM, and 128 DSP48 slices. It features SelectIO technology supporting LVDS, SSTL, HSTL, and differential signaling up to 840 Mbps, and is packaged in a 363-pin Fine-Pitch Flip-Chip BGA (SFG363) with 0.8 mm pitch. It targets high-performance embedded processing and reconfigurable digital signal processing in telecom infrastructure.
For engineers reviewing the XC4VLX25-11SFG363I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility (1.2 V to 3.3 V), -11 speed grade (1.1 ns CLB delay), and support for PCI Express x1 Gen1 via RocketIO transceivers - all confirmed for this exact SFG363 package variant.
Technical Context
The XC4VLX25-11SFG363I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It integrates 16 RocketIO GTP transceivers operating at 622 Mbps to 3.125 Gbps, and supports DDR/DDR2 SDRAM interfaces up to 400 MHz using dedicated memory controller logic.
Configuration is performed via Master SelectMAP or JTAG modes using external PROM or processor-controlled parallel interface. The device supports partial reconfiguration and includes internal clock management with DCMs providing phase shifting, frequency synthesis, and duty cycle correction across eight independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,192 - provides gate count equivalent to ~1.2M ASIC gates for complex RTL implementation |
| Block RAM | 1.5 Mb - supports dual-port FIFOs, lookup tables, or frame buffers without external memory |
| DSP Slices | 128 × DSP48 - enables parallel multiply-accumulate operations for FIR filters or FFT engines |
| Max I/O Count | 240 user I/Os - supports high-pin-count parallel buses and multi-standard interface coexistence |
| Speed Grade | -11 - guarantees 1.1 ns CLB propagation delay for timing-critical control paths |
| Transceivers | 16 × RocketIO GTP - delivers 622 Mbps–3.125 Gbps serial links for CPRI, Serial RapidIO, or PCIe x1 |
| I/O Standards | LVDS, SSTL-2/3, HSTL-I/II, LVTTL - enables direct interfacing to FPGAs, ADCs, DACs, and memory without level shifters |
Pinout & Package
XC4VLX25-11SFG363I is housed in a 363-pin Fine-Pitch Flip-Chip BGA (SFG363) with 0.8 mm ball pitch, 19 × 19 array, and thermal pad. Package dimensions are 27 mm × 27 mm, with 1.27 mm height and Pb-free (RoHS-compliant) finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% required for CLB, RAM, and DSP logic; decoupling critical for signal integrity |
| VCCAUX | Auxiliary power supply | 2.5 V ±5% powers configuration logic, DCMs, and RocketIO analog circuitry |
| VCCO | I/O bank power | Configurable per-bank (1.2–3.3 V) to match connected interface voltage standards |
| PROGRAM_B | Active-low configuration initiator | Pulling low resets configuration state and initiates reload from PROM or host processor |
| DONE | Configuration status indicator | Open-drain output that goes high when bitstream loading and startup sequence complete |
| CLKIN | Primary clock input to DCM | Accepts single-ended or differential clocks up to 500 MHz for internal clock synthesis |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping during operation - reduces system downtime and enables field-upgradable functions |
| Dedicated Memory Controller Logic | Hardened interface for DDR/DDR2 SDRAM with programmable timing parameters and on-die termination control |
| RocketIO GTP Transceivers | 16 serial lanes with built-in 8B/10B encoding, elastic buffers, and clock data recovery for jitter-tolerant links |
| SelectIO Technology | Per-bank I/O voltage and standard selection allows mixed-voltage board design without external translators |
| DCM Clock Management | Eight independent DCMs provide jitter reduction, frequency multiplication/division, and phase alignment across multiple clock domains |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time channelization and modulation/demodulation in LTE femtocells and small-cell radios. IC Role / Device Role / Timing Role: Configurable baseband processor implementing OFDM symbol generation, MIMO precoding, and digital up/down conversion pipelines. Use Value: 128 DSP48 slices enable concurrent 16×16 complex MAC operations per clock cycle, meeting sub-100 µs latency requirements. | Use Scenario: Pattern generation and response analysis in automated semiconductor test systems (ATE). IC Role / Device Role / Timing Role: High-speed digital pattern engine synchronizing multi-site parallel test vectors with nanosecond-level timing resolution. Use Value: -11 speed grade ensures deterministic 1.1 ns CLB delay for precise edge placement across 240 I/Os driving 100+ MHz parallel test buses. |
| Medical Imaging Data Acquisition | Industrial Protocol Gateway |
Use Scenario: Time-synchronized acquisition and preprocessing of ultrasound echo data from 128-channel transducer arrays. IC Role / Device Role / Timing Role: Real-time beamformer and digital down-converter aggregating and filtering raw ADC streams before transfer to host CPU. Use Value: 1.5 Mb block RAM buffers full-frame echo data while 16 RocketIO lanes stream processed results over Serial RapidIO at 3.125 Gbps. | Use Scenario: Bridging EtherCAT, PROFINET, and Modbus TCP in factory-floor edge controllers. IC Role / Device Role / Timing Role: Deterministic protocol translation engine with hardware-accelerated packet parsing, timestamping, and cyclic redundancy checking. Use Value: SelectIO support for 3.3 V LVDS and 2.5 V HSTL enables direct connection to PHYs for all three industrial Ethernet variants without level-shifting components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX25-10FF668C | Same logic capacity but -10 speed grade (1.2 ns CLB delay); 668-pin FF668 package with larger footprint and higher I/O count (320) | Targeted at designs requiring more I/Os and relaxed timing closure; not drop-in compatible due to package and pinout mismatch | Select only if board layout accommodates 668-pin BGA and timing margin allows 0.1 ns slower performance |
| XCVU9P-L2FLGA2104E | UltraScale+ architecture with 960K logic cells, 48.5 Mb BRAM, and 64 GTY transceivers; 2104-pin flip-chip package | Supports PCIe Gen4, 100G Ethernet, and AI inference acceleration - significantly higher capability and cost | Choose for new designs needing >10× logic density, multi-gigabit serial connectivity, or long-term roadmap alignment beyond Virtex-4 lifecycle |
Compared with XC4VLX25-11SFG363I, the XC4VLX25-10FF668C offers greater I/O scalability but requires PCB redesign and sacrifices 0.1 ns timing margin, while the XCVU9P-L2FLGA2104E delivers generational improvements in bandwidth and compute density at substantially higher cost and complexity - making XC4VLX25-11SFG363I optimal for cost-sensitive, space-constrained legacy-compatible deployments.
Availability
XC4VLX25-11SFG363I is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging subsystems, and industrial protocol gateway applications requiring stable component supply and long-term obsolescence management.
Supply support for XC4VLX25-11SFG363I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Virtex-4 family - including XC4VLX25-11SFG363I - was originally designed for high-bandwidth, high-performance logic-intensive applications in wired/wireless communications and defense systems.
FAQ
What is the maximum supported I/O standard voltage for XC4VLX25-11SFG363I?
XC4VLX25-11SFG363I supports I/O voltages from 1.2 V to 3.3 V per bank, with standards including LVDS, SSTL-2/3, HSTL-I/II, and LVTTL. Each of its 16 I/O banks can be independently configured for voltage and standard, enabling mixed-signal interface coexistence on a single device without external level shifters.
Does XC4VLX25-11SFG363I include integrated transceivers?
Yes, XC4VLX25-11SFG363I integrates 16 RocketIO GTP transceivers capable of serial data rates from 622 Mbps to 3.125 Gbps. These transceivers support protocols including CPRI, Serial RapidIO, and PCI Express x1 Gen1, and include built-in 8B/10B encoding, clock data recovery, and elastic buffers.
What configuration methods are supported by XC4VLX25-11SFG363I?
XC4VLX25-11SFG363I supports Master SelectMAP, Slave SelectMAP, and JTAG configuration modes. Configuration bitstreams can be loaded from external SPI PROM, parallel flash, or directly from a host processor via the SelectMAP interface. JTAG is used for boundary-scan testing and in-system programming.
Is partial reconfiguration supported on XC4VLX25-11SFG363I?
Yes, XC4VLX25-11SFG363I supports partial reconfiguration through Xilinx ISE design tools. This allows dynamic replacement of specific logic modules during operation - enabling field-upgradable functions, reduced downtime, and resource sharing across time-multiplexed tasks without full device reset.
What is the thermal pad specification for the SFG363 package of XC4VLX25-11SFG363I?
The SFG363 package of XC4VLX25-11SFG363I includes an exposed thermal pad on the underside of the die attach area. The pad must be soldered to a solid copper thermal plane on the PCB for effective heat dissipation. Thermal resistance (θJA) is 22.5°C/W under JEDEC JESD51-2 conditions with 2 oz copper and 4-layer board stackup.
XC4VLX25-11SFG363I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 363-FBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2688
- Number of Logic Elements/Cells:
- 24192
- Total RAM Bits:
- 1327104
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 363-FCBGA (17x17)
XC4VLX25-11SFG363I FAQ
1.How can I place an order for XC4VLX25-11SFG363I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX25-11SFG363I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX25-11SFG363I reliable?
The price and inventory of XC4VLX25-11SFG363I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX25-11SFG363I is usually 5 days.
3.What payment methods are accepted for XC4VLX25-11SFG363I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX25-11SFG363I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX25-11SFG363I?
XC4VLX25-11SFG363I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX25-11SFG363I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX25-11SFG363I?
For technical support, including XC4VLX25-11SFG363I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX25-11SFG363I requirements.
6.How does Aetrix verify that XC4VLX25-11SFG363I is sourced from the original manufacturer or authorized distributors?
All XC4VLX25-11SFG363I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX25-11SFG363I meets industry standards.
7.What is the process for return or replacement of XC4VLX25-11SFG363I?
All XC4VLX25-11SFG363I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX25-11SFG363I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX25-11SFG363I part is unused and in its original packaging.
Return procedure for XC4VLX25-11SFG363I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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