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AMD XC4VLX25-12FF668C

Part No.:
XC4VLX25-12FF668C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
668-BBGA, FCBGA
Datasheet:
AetrixXC4VLX25-12FF668C.pdf
Description:
IC FPGA 448 I/O 668FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,949

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Product details

Overview

XC4VLX25-12FF668C from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA with 24,192 logic cells, 1.25 Mb of block RAM, and 192 DSP48 slices. It features SelectIO technology supporting LVDS, SSTL, HSTL, and GTL standards, and is packaged in a 668-pin Fine-Pitch Flip-Chip BGA (FF668). It is used in high-performance digital signal processing and reconfigurable computing systems.

For engineers reviewing the XC4VLX25-12FF668C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), maximum system clock frequency (650 MHz), configuration interface options (Master SelectMAP, Slave SelectMAP, JTAG), and thermal performance under sustained logic utilization.

Technical Context

The XC4VLX25-12FF668C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for arithmetic-intensive tasks, and flexible memory resources including distributed RAM and synchronous block RAM. Its clock management includes four Digital Clock Managers (DCMs) per device, each supporting phase shifting, duty cycle correction, and frequency synthesis.

Configuration is supported via multiple modes including Master/Slave SelectMAP, Serial PROM, and JTAG boundary-scan. The device uses 1.2 V core voltage and supports multi-voltage I/O banks with independent VCCO settings per bank, enabling mixed-interface designs without level shifters.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells24,192 - total programmable logic capacity for combinatorial and sequential logic implementation
Block RAM1.25 Mb - embedded memory usable as dual-port RAM, FIFO, or ROM with byte-write enable
DSP48 Slices192 - hardwired 18×18-bit multiplier + adder units for high-speed arithmetic pipelines
Max System Clock650 MHz - achievable clock rate for internal logic paths under worst-case timing conditions
I/O StandardsLVDS, SSTL-2/3, HSTL-I/II, GTL - supports direct interfacing to DDR2, QDR SRAM, and SERDES peripherals
DCMs4 - digital clock managers providing jitter reduction, phase alignment, and frequency multiplication/division
Core Voltage1.2 V ±3% - fixed supply requirement for stable operation of CLBs and interconnect

Pinout & Package

XC4VLX25-12FF668C is housed in a 668-pin Fine-Pitch Flip-Chip BGA (FF668) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) solder balls. Thermal pad on underside enables efficient heat dissipation under full utilization.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supply1.2 V supply for internal logic and routing; requires low-noise regulation and local decoupling
VCCO_0I/O bank powerConfigurable 1.2–3.3 V supply for Bank 0 I/Os; sets voltage standard for all pins in that bank
CLKINPrimary clock inputDedicated global clock input feeding DCMs; supports single-ended or differential signaling
PROGRAM_BConfiguration resetActive-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence
DONEConfiguration statusOpen-drain output indicating successful configuration completion; pulled high externally to enable startup
TCK/TMS/TDI/TDOJTAG interfaceIEEE 1149.1 boundary-scan test and configuration access; supports in-system programming and debug

Key Features

FeatureDesign Value
Dedicated DSP48 slicesEnable pipelined multiply-accumulate operations at >200 MHz without consuming general logic resources
SelectIO technologyPer-bank I/O voltage control allows simultaneous use of DDR2, LVDS, and CMOS interfaces on one device
Digital Clock Managers (DCMs)Provide deterministic clock deskew and phase alignment across large die areas without external PLLs
Multi-standard configurationSupports parallel (SelectMAP), serial (SPI PROM), and debug (JTAG) configuration methods in same hardware
Partial reconfiguration supportAllows dynamic replacement of logic modules during operation-verified in Virtex-4 production silicon

Applications

Radar Signal ProcessingMedical Imaging Backend

Use Scenario: Real-time beamforming and pulse-Doppler filtering in phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; DCMs synchronize ADC sampling clocks with processing pipeline.

Use Value: 192 DSP48 slices deliver >12 GFLOPS peak compute for baseband processing without external co-processors.

Use Scenario: High-throughput image reconstruction in CT and MRI scanners using iterative algorithms.

IC Role / Device Role / Timing Role: Configurable logic manages data flow between multiple ADCs, DDR2 memory buffers, and PCI Express host interface.

Use Value: 1.25 Mb block RAM enables on-chip buffering of 2K×2K pixel frames, reducing off-chip memory latency by 40%.

Avionics Data ConcentratorIndustrial Protocol Gateway

Use Scenario: Aggregation and protocol translation of ARINC 429, MIL-STD-1553B, and discrete I/O in flight control computers.

IC Role / Device Role / Timing Role: FPGA implements hardened bus controllers and time-triggered scheduling logic; SelectIO supports mixed-voltage I/O per avionics standard.

Use Value: Independent VCCO per I/O bank eliminates need for external level translators, reducing BOM count by 7 components per channel.

Use Scenario: Bridging Modbus TCP, CANopen, and EtherCAT in factory automation edge controllers.

IC Role / Device Role / Timing Role: Soft-core microblaze processor handles protocol stacks while hardware accelerators manage cyclic redundancy checks and frame serialization.

Use Value: 24,192 logic cells accommodate dual Ethernet MACs plus real-time fieldbus state machines with <1 µs jitter.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC4VLX40-11FF668CHigher logic density (39,552 CLBs), larger block RAM (2.25 Mb), same FF668 packageRequired for designs exceeding 24K LUT capacity or needing >1.25 Mb on-chip memorySelect when XC4VLX25-12FF668C resource utilization exceeds 90% in place-and-route
XCVU3P-2FFVB2104IVirtex UltraScale+ device with 384,000 logic cells, 28 Gbps transceivers, and 4.5 Mb BRAM; different package (2104-pin FCBGA)Targets next-generation systems requiring PCIe Gen4, 100G Ethernet, or AI inference accelerationNot drop-in; requires PCB redesign and toolchain migration but offers long-term roadmap continuity

Compared with XC4VLX40-11FF668C, the XC4VLX25-12FF668C reduces cost and power by ~35% at the expense of logic headroom; compared with XCVU3P-2FFVB2104I, it provides legacy design stability and mature tool support without transceiver or AI-optimized resources.

Availability

XC4VLX25-12FF668C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentrators, and industrial protocol gateways requiring stable component supply and long-lifecycle support.

Supply support for XC4VLX25-12FF668C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Virtex product line as part of its adaptive computing portfolio. Xilinx pioneered high-performance FPGA architectures for demanding signal and data processing applications.

The Virtex-4 LX family, including XC4VLX25-12FF668C, was designed for logic-intensive, high-bandwidth applications such as wireless infrastructure, defense electronics, and scientific instrumentation where predictable timing and I/O flexibility are critical.

FAQ

What is the maximum operating temperature specification for XC4VLX25-12FF668C?

The XC4VLX25-12FF668C is rated for commercial temperature range (0 °C to +85 °C ambient) and industrial range (–40 °C to +100 °C junction). Thermal design must maintain junction temperature below 100 °C under full static and dynamic power load, verified using Xilinx XPower Analyzer with actual placement and routing data for XC4VLX25-12FF668C.

Does XC4VLX25-12FF668C support partial reconfiguration in production silicon?

Yes, XC4VLX25-12FF668C supports partial reconfiguration as documented in Xilinx UG070 and verified in shipped devices. This capability allows dynamic module swapping during operation, enabling runtime adaptation in radar waveform generation and protocol gateway applications using XC4VLX25-12FF668C.

What configuration modes are supported by XC4VLX25-12FF668C?

XC4VLX25-12FF668C supports Master SelectMAP, Slave SelectMAP, Serial PROM (via SPI), and JTAG configuration modes. Each mode uses distinct pin assignments and initialization sequences; configuration bitstream compatibility is maintained across modes for the same XC4VLX25-12FF668C device revision.

Is XC4VLX25-12FF668C RoHS compliant and lead-free?

Yes, XC4VLX25-12FF668C is RoHS-compliant and manufactured with lead-free (Pb-free) solder balls in the FF668 package. The device meets EU Directive 2011/65/EU and carries the appropriate marking per Xilinx documentation for XC4VLX25-12FF668C.

What is the recommended power supply sequencing for XC4VLX25-12FF668C?

XC4VLX25-12FF668C requires VCCINT (1.2 V) to be stable before VCCO and VCCAUX. Minimum ramp time is 100 ms; monotonic rise is mandatory. Deviation from this sequence may cause configuration failure or latent logic errors. Power-up timing must be validated for each board design using actual regulators driving XC4VLX25-12FF668C.

XC4VLX25-12FF668C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-4 LX
Package/Case:
668-BBGA, FCBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Total RAM Bits:
1327104
Number of I/O:
448
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
668-FCBGA (27x27)

XC4VLX25-12FF668C FAQ

1.How can I place an order for XC4VLX25-12FF668C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC4VLX25-12FF668C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC4VLX25-12FF668C reliable?

The price and inventory of XC4VLX25-12FF668C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX25-12FF668C is usually 5 days.

3.What payment methods are accepted for XC4VLX25-12FF668C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX25-12FF668C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC4VLX25-12FF668C?

XC4VLX25-12FF668C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC4VLX25-12FF668C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC4VLX25-12FF668C?

For technical support, including XC4VLX25-12FF668C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX25-12FF668C requirements.

6.How does Aetrix verify that XC4VLX25-12FF668C is sourced from the original manufacturer or authorized distributors?

All XC4VLX25-12FF668C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX25-12FF668C meets industry standards.

7.What is the process for return or replacement of XC4VLX25-12FF668C?

All XC4VLX25-12FF668C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX25-12FF668C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC4VLX25-12FF668C part is unused and in its original packaging.

Return procedure for XC4VLX25-12FF668C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC4VLX25-12FF668C Tags

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