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AMD XC4VLX25-12FFG676C
- Part No.:
- XC4VLX25-12FFG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC4VLX25-12FFG676C.pdf
- Description:
- IC FPGA 448 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,463
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Product details
Overview
XC4VLX25-12FFG676C from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA featuring 24,192 logic cells, 128 DSP48 slices, and 1,008 Kbits of block RAM. It operates at -12 speed grade (1.25 GHz internal clock), uses 1.2 V core voltage, and is packaged in a 676-pin Fine-Pitch Flip-Chip BGA (FFG676). It targets high-performance digital signal processing in wired communications infrastructure.
For engineers reviewing the XC4VLX25-12FFG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, DSP slice count, I/O voltage support (1.2/1.5/1.8/2.5/3.3 V), differential signaling capability (LVDS, RSDS), and thermal performance in compact base station modules.
Technical Context
The XC4VLX25-12FFG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for multiply-accumulate operations, and SelectIO technology supporting multi-standard I/O. It integrates hard-wired PCI-X 133 MHz interface logic and supports partial reconfiguration.
It features 228 user I/Os across 12 banks, each configurable for single-ended or differential standards. The device includes on-chip clock management using Digital Clock Managers (DCMs) with phase-matching, frequency synthesis, and duty-cycle correction capabilities.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,192 - determines maximum combinational/sequential logic capacity for protocol stack implementation |
| DSP Slices | 128 - enables parallel 18×18-bit signed multiplication and accumulation for real-time filtering |
| Block RAM | 1,008 Kbits - supports dual-port FIFOs, coefficient storage, and data buffering in transceiver subsystems |
| I/O Count | 228 - provides sufficient interface points for SerDes PHY control, memory interfaces, and host bus bridging |
| Speed Grade | -12 - guarantees timing closure up to 1.25 GHz internal clock frequency under worst-case conditions |
| Core Voltage | 1.2 V - defines power delivery network requirements and impacts dynamic power consumption |
| I/O Standards | LVCMOS, LVTTL, LVDS, RSDS, HSTL - enables direct interfacing with FPGAs, ASICs, and ADC/DACs without level shifters |
Pinout & Package
XC4VLX25-12FFG676C is housed in a 676-ball Fine-Pitch Flip-Chip BGA (FFG676) package with 1.0 mm ball pitch, 27 × 27 array, and thermal lid. Package dimensions are 27 mm × 27 mm, with JEDEC MO-251 compliant footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.2 V supply for CLBs, DSP slices, and interconnect; requires low-noise regulation |
| VCCAUX | Auxiliary Power Supply | 2.5 V supply for configuration logic, DCMs, and JTAG interface |
| VCCO | I/O Power Supply | Bank-specific 1.2–3.3 V supply enabling mixed-voltage I/O operation |
| CLKIN | Primary Clock Input | Accepts single-ended or differential clocks up to 500 MHz for DCM input |
| PROG_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| DONE | Configuration Status | Open-drain output indicating successful configuration completion and initialization |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP48 Slices | 128 independent 18×18-bit multipliers with pipeline registers for deterministic MAC latency |
| Digital Clock Managers (DCMs) | Up to four DCMs per device provide jitter reduction, frequency synthesis, and phase alignment across clock domains |
| SelectIO Technology | Supports 18 I/O standards including LVDS and RSDS with programmable drive strength and slew rate |
| PCI-X 133 MHz Hard IP | Integrated controller logic eliminates external bridge ICs and reduces latency in backplane interface designs |
| Partial Reconfiguration | Enables dynamic logic swapping without full device reset-critical for adaptive radio and protocol upgrade scenarios |
Applications
| Wireless Baseband Processing | Optical Transport Line Cards |
|---|---|
Use Scenario: Real-time channel coding, modulation/demodulation, and MIMO signal processing in LTE macro base stations. IC Role / Device Role / Timing Role: Primary programmable logic fabric executing Layer 1 PHY algorithms with deterministic latency. Use Value: 128 DSP48 slices enable concurrent execution of 128 complex multiply-accumulate operations per clock cycle. | Use Scenario: Forward error correction (FEC), OTU frame mapping, and client signal multiplexing in 10G/40G optical line cards. IC Role / Device Role / Timing Role: High-bandwidth packet processing engine interfacing with 10G serializers and SRAM buffers. Use Value: 228 I/Os with LVDS support allow direct connection to multiple 10Gbps SerDes PHYs and external DDR2 memory. |
| High-Speed Test Equipment | Avionics Data Concentrators |
Use Scenario: Pattern generation, response analysis, and real-time pass/fail decision logic in automated test systems for SoCs. IC Role / Device Role / Timing Role: Deterministic timing engine synchronizing stimulus generation and acquisition with sub-nanosecond precision. Use Value: DCM-based clock synthesis ensures stable, low-jitter clocks for 1 GSPS DAC/ADC interfaces. | Use Scenario: ARINC 429/664 (AFDX) message aggregation, filtering, and time-triggered scheduling in flight control subsystems. IC Role / Device Role / Timing Role: Safety-critical deterministic switch fabric with guaranteed worst-case execution time (WCET). Use Value: -12 speed grade and hardened PCI-X interface ensure timing compliance under extended temperature and EMI stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX40-11FFG676C | Higher logic density (39,888 LCs), same package and I/O count, slower speed grade (-11) | Supports larger protocol stacks and deeper pipeline stages but with reduced max clock frequency | Choose when design requires more logic resources and can accept lower timing margin |
| XC5VLX30T-1FFG665C | Virtex-5 family; 30K logic cells, 64 DSP48E slices, 1.0 V core, FFG665 package (665 balls) | Offers improved power efficiency and enhanced serial transceivers (3.75 Gbps), but requires PCB redesign | Choose for new designs needing higher serial bandwidth and lower static power, not for drop-in replacement |
Compared with XC4VLX25-12FFG676C, XC4VLX40-11FFG676C trades speed for logic capacity within identical packaging, while XC5VLX30T-1FFG665C introduces architectural improvements requiring layout revision but delivering superior serial I/O and power efficiency.
Availability
XC4VLX25-12FFG676C is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, and high-reliability test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC4VLX25-12FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated workloads.
The Virtex-4 LX family was designed for high-performance logic-intensive applications such as wired/wireless infrastructure, video processing, and military systems requiring deterministic timing and high I/O bandwidth.
FAQ
What is the maximum operating junction temperature for XC4VLX25-12FFG676C?
The XC4VLX25-12FFG676C has a maximum operating junction temperature of 100°C, specified for commercial-grade operation (C grade). Thermal design must ensure adequate heat dissipation via the thermal lid and PCB copper pour to maintain reliability under sustained logic utilization.
Does XC4VLX25-12FFG676C support JTAG boundary-scan testing?
Yes, XC4VLX25-12FFG676C fully supports IEEE 1149.1 JTAG boundary-scan testing through dedicated TDI, TDO, TMS, and TCK pins. The device implements TAP controller logic and supports INTEST, EXTEST, and SAMPLE/PRELOAD instructions for board-level diagnostics.
Can XC4VLX25-12FFG676C be configured via SPI flash memory?
Yes, XC4VLX25-12FFG676C supports master SPI configuration mode using external serial PROMs such as XCFxxP devices. Configuration occurs automatically on power-up when MODE pins are set to 01, loading bitstream from SPI flash into configuration memory.
What clocking resources are available on XC4VLX25-12FFG676C?
XC4VLX25-12FFG676C includes up to four Digital Clock Managers (DCMs), each supporting input frequency multiplication, division, phase shifting, and duty-cycle correction. These DCMs drive internal logic and I/O clocks with jitter less than 200 ps peak-to-peak.
Is partial reconfiguration supported on XC4VLX25-12FFG676C?
Yes, XC4VLX25-12FFG676C supports partial reconfiguration through its configuration port interface and hierarchical design methodology. This allows dynamic swapping of logic modules without resetting the entire device, enabling runtime adaptation in communication and defense applications.
XC4VLX25-12FFG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2688
- Number of Logic Elements/Cells:
- 24192
- Total RAM Bits:
- 1327104
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC4VLX25-12FFG676C FAQ
1.How can I place an order for XC4VLX25-12FFG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX25-12FFG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX25-12FFG676C reliable?
The price and inventory of XC4VLX25-12FFG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX25-12FFG676C is usually 5 days.
3.What payment methods are accepted for XC4VLX25-12FFG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX25-12FFG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX25-12FFG676C?
XC4VLX25-12FFG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX25-12FFG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX25-12FFG676C?
For technical support, including XC4VLX25-12FFG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX25-12FFG676C requirements.
6.How does Aetrix verify that XC4VLX25-12FFG676C is sourced from the original manufacturer or authorized distributors?
All XC4VLX25-12FFG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX25-12FFG676C meets industry standards.
7.What is the process for return or replacement of XC4VLX25-12FFG676C?
All XC4VLX25-12FFG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX25-12FFG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX25-12FFG676C part is unused and in its original packaging.
Return procedure for XC4VLX25-12FFG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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