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AMD XC4VLX25-12SFG363C
- Part No.:
- XC4VLX25-12SFG363C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 363-FBGA, FCBGA
- Datasheet:
-
XC4VLX25-12SFG363C.pdf
- Description:
- IC FPGA 240 I/O 363FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,477
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Product details
Overview
XC4VLX25-12SFG363C from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA with 24,192 logic cells, 1.25 Mb of block RAM, and 128 DSP48 slices, configured in a 363-pin Fine-Pitch Ball Grid Array (FBGA) package rated for commercial temperature range (0°C to 85°C). It targets high-performance digital signal processing and embedded control in telecom infrastructure and industrial video systems.
For engineers reviewing the XC4VLX25-12SFG363C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (240 user I/Os), speed grade (-12), LVDS/PCI Express-compatible transceivers, and support for partial reconfiguration in runtime-adaptive systems.
Technical Context
The XC4VLX25-12SFG363C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for multiply-accumulate operations, and SelectIO technology supporting LVCMOS, LVTTL, LVDS, and RSDS signaling. It integrates 128 hard-wired DSP48 slices operating up to 500 MHz and supports DDR2 memory interfaces up to 400 MHz.
This device includes 240 user-configurable I/O pins distributed across 16 banks, each supporting independent VCCO and VREF settings. Its -12 speed grade guarantees timing closure at 500 MHz for internal logic and 1 Gbps for differential I/O standards such as LVDS and RSDS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,192 - provides gate count equivalent to ~1.2M ASIC gates for complex RTL implementation |
| Block RAM | 1.25 Mb - supports dual-port FIFOs, frame buffers, and on-chip data storage without external memory |
| DSP Slices | 128 × DSP48 - enables parallel 18×18-bit multiply-accumulate at 500 MHz for real-time filtering |
| User I/O Pins | 240 - allows high-bandwidth interface to ADCs, DACs, FPGAs, and processors in multi-chip systems |
| Speed Grade | -12 - ensures guaranteed timing performance up to 500 MHz internal clock and 1 Gbps differential I/O |
| Package | 363-pin SFG (Fine-Pitch BGA) - 17×17 mm body, 1.0 mm ball pitch, RoHS-compliant |
| Temperature Range | 0°C to +85°C - qualified for commercial-grade operation in non-extended environments |
Pinout & Package
The XC4VLX25-12SFG363C is housed in a 363-ball Fine-Pitch Ball Grid Array (SFG) package with 17×17 array, 1.0 mm ball pitch, and thermal pad. Pin functions are organized into 16 I/O banks, each supporting mixed-voltage operation and programmable slew rate.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% required for CLB and interconnect logic; decoupling critical for signal integrity |
| VCCO_0–VCCO_15 | I/O bank power | Programmable per-bank voltage (1.2 V to 3.3 V) enabling mixed-signaling interfaces |
| VRP/VRN | Reference voltage inputs | Enable differential input termination and SSTL/LVDS receiver calibration per bank |
| CLKIN_0/CLKIN_1 | Dedicated global clock inputs | Low-skew routing to DCMs for jitter-tolerant clock distribution and phase alignment |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reset-critical for adaptive radar and protocol-agnostic comms |
| Dedicated DCMs (Digital Clock Managers) | Provides jitter reduction, frequency synthesis, and phase shifting for precise clock domain crossing |
| SelectIO Technology | Supports 18 I/O standards including LVDS, RSDS, and SSTL-2/3 with programmable drive strength and slew rate |
| Hard-IP PCI Express Endpoint | Integrated PCIe v1.0 endpoint logic reduces FPGA resource usage and simplifies compliance testing |
| Multi-Standard Memory Controller | Configurable DDR/DDR2 controller supporting up to 400 MHz data rates and 2 GB address space |
Applications
| Telecom Baseband Processing | Industrial Machine Vision |
|---|---|
Use Scenario: Real-time channelization and modulation/demodulation in 3G/4G LTE base stations. IC Role / Device Role / Timing Role: FPGA fabric executes custom OFDM symbol processing, DDC/DUC chains, and CPRI framer logic. Use Value: 128 DSP48 slices enable concurrent 16-carrier FFT/IFFT and filter banks within one XC4VLX25-12SFG363C device. | Use Scenario: High-speed image acquisition and preprocessing in automated optical inspection (AOI) systems. IC Role / Device Role / Timing Role: Interfaces to CMOS image sensors via LVDS, performs pixel-level correction, and buffers frames in block RAM. Use Value: 240 user I/Os and 1.25 Mb block RAM allow simultaneous sensor streaming and real-time defect analysis without external memory latency. |
| Avionics Data Concentrators | Medical Ultrasound Beamforming |
Use Scenario: Aggregation and protocol translation of ARINC 429, MIL-STD-1553B, and discrete I/O in flight control units. IC Role / Device Role / Timing Role: Implements deterministic time-triggered communication stacks and safety-critical watchdog logic. Use Value: -12 speed grade and DCM-based clock management ensure sub-microsecond timing accuracy for ARINC 429 bit-synchronous decoding. | Use Scenario: Digital beamforming and RF echo processing in portable ultrasound scanners. IC Role / Device Role / Timing Role: Executes delay-and-sum algorithms across 64+ channels using pipelined DSP48 slices and synchronized ADC interfaces. Use Value: 500 MHz internal logic speed and LVDS I/O support 12-bit, 40 MSPS ADC interfacing with zero-cycle latency buffering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density logic and DSP acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX40-12SFG363C | 39,216 logic cells, 1.8 Mb block RAM, 192 DSP48 slices - larger capacity, same package and speed grade | Required when >24K LC or >128 DSP slices needed for expanded channel count or algorithm complexity | Select if design requires headroom for future feature upgrades or higher parallelism without PCB change |
| XCVU9P-2FFVB2104E | Virtex UltraScale+ device with 443K LC, 28.8 Mb BRAM, 2,560 DSP slices - 5× higher density, different package (2104-pin FBGA), not pin-compatible | Suitable for next-generation systems requiring PCIe Gen3, DDR4, or hardened 10G Ethernet MAC | Choose for migration path beyond Virtex-4 lifecycle; requires full board redesign and toolchain upgrade |
Compared with XC4VLX25-12SFG363C, the XC4VLX40-12SFG363C offers direct scalability in the same footprint, while the XCVU9P-2FFVB2104E delivers generational advancement in bandwidth and integration-but demands new layout, power delivery, and Vivado toolflow adoption.
Availability
XC4VLX25-12SFG363C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial imaging, and avionics subsystems requiring stable component supply and long-term obsolescence management.
Supply support for XC4VLX25-12SFG363C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues to support legacy Virtex families under the AMD Adaptive SoC portfolio. Xilinx pioneered FPGA architecture for high-performance reconfigurable computing.
The Virtex-4 LX series was designed for logic-intensive, DSP-accelerated applications in wired/wireless infrastructure and defense electronics, emphasizing I/O flexibility, deterministic timing, and partial reconfiguration capability.
FAQ
What is the maximum supported I/O standard voltage for XC4VLX25-12SFG363C?
The XC4VLX25-12SFG363C supports I/O voltages from 1.2 V to 3.3 V per bank, with independent VCCO and VRP/VRN settings. Each of its 16 I/O banks can be configured for LVCMOS, LVTTL, SSTL, HSTL, or differential standards like LVDS and RSDS, provided the selected VCCO matches the standard's specification.
Does XC4VLX25-12SFG363C include built-in PCI Express functionality?
Yes, the XC4VLX25-12SFG363C integrates a hard IP PCI Express v1.0 endpoint block, eliminating the need for soft-core implementations. This reduces logic utilization, improves timing closure, and simplifies compliance testing for add-in cards and embedded host interfaces.
What configuration modes does XC4VLX25-12SFG363C support?
The XC4VLX25-12SFG363C supports Master SelectMAP, Slave SelectMAP, Serial Peripheral Interface (SPI), and JTAG configuration modes. Configuration bitstreams can be loaded from PROM, microcontroller, or boundary-scan tools, with fallback support via PROGRAM_B assertion.
Is XC4VLX25-12SFG363C qualified for automotive applications?
No, the XC4VLX25-12SFG363C is specified only for commercial temperature range (0°C to +85°C) and lacks AEC-Q100 qualification. For automotive use, designers should consider Xilinx Automotive-grade Virtex-5 or AMD Versal derivatives with extended temperature and reliability certification.
How many Digital Clock Managers (DCMs) are available in XC4VLX25-12SFG363C?
The XC4VLX25-12SFG363C contains eight Digital Clock Managers (DCMs), each capable of frequency synthesis, phase shifting, duty cycle correction, and spread-spectrum clocking. These support synchronous domain crossing and low-jitter clock distribution across the FPGA fabric.
XC4VLX25-12SFG363C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 363-FBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2688
- Number of Logic Elements/Cells:
- 24192
- Total RAM Bits:
- 1327104
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 363-FCBGA (17x17)
XC4VLX25-12SFG363C FAQ
1.How can I place an order for XC4VLX25-12SFG363C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX25-12SFG363C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX25-12SFG363C reliable?
The price and inventory of XC4VLX25-12SFG363C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX25-12SFG363C is usually 5 days.
3.What payment methods are accepted for XC4VLX25-12SFG363C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX25-12SFG363C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX25-12SFG363C?
XC4VLX25-12SFG363C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX25-12SFG363C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX25-12SFG363C?
For technical support, including XC4VLX25-12SFG363C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX25-12SFG363C requirements.
6.How does Aetrix verify that XC4VLX25-12SFG363C is sourced from the original manufacturer or authorized distributors?
All XC4VLX25-12SFG363C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX25-12SFG363C meets industry standards.
7.What is the process for return or replacement of XC4VLX25-12SFG363C?
All XC4VLX25-12SFG363C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX25-12SFG363C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX25-12SFG363C part is unused and in its original packaging.
Return procedure for XC4VLX25-12SFG363C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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