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AMD XC4VLX40-10FFG668I
- Part No.:
- XC4VLX40-10FFG668I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VLX40-10FFG668I.pdf
- Description:
- IC FPGA 448 I/O 668FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,059
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Product details
Overview
XC4VLX40-10FFG668I from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA with 41,472 logic cells, 2.5 Gbps RocketIO transceivers, and embedded PowerPC 405 cores. It features 2,016 Kbits of block RAM, 128 DSP48 slices, and operates at -10 speed grade (1.0 ns CLB delay). It is used in high-performance reconfigurable computing systems requiring deterministic latency and mixed-signal integration.
For engineers reviewing the XC4VLX40-10FFG668I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage support (1.2 V to 3.3 V), differential signaling compliance (LVDS, RSDS, HSTL), transceiver lane count (16 lanes), and thermal design power (12.3 W typical).
Technical Context
The XC4VLX40-10FFG668I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for arithmetic-intensive tasks, and dual-port block RAM for on-chip data buffering. Its RocketIO transceivers support serial protocols including PCI Express Gen1 and Serial RapidIO.
It integrates two hard PowerPC 405 RISC cores with on-chip memory controllers and supports partial reconfiguration. Configuration is performed via Master SelectMAP mode using external PROM or JTAG, with bitstream encryption available via AES-128.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 41,472 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| Block RAM | 2,016 Kbits - provides on-die memory for FIFOs, buffers, or lookup tables without external DRAM |
| DSP Slices | 128 × DSP48 - enables parallel multiply-accumulate operations for filtering and FFT processing |
| RocketIO Transceivers | 16 lanes @ 622 Mbps–2.5 Gbps - supports high-speed serial interconnects including PCIe x1 and SRIO x4 |
| I/O Standards | LVCMOS, LVTTL, HSTL, SSTL, LVDS, RSDS - allows direct interface to DDR2, ADCs, FPGAs, and microprocessors |
| Speed Grade | -10 - guarantees timing closure at 1.0 ns CLB propagation delay under worst-case conditions |
| Thermal Design Power | 12.3 W (typical) - defines heatsink and airflow requirements for sustained operation |
Pinout & Package
XC4VLX40-10FFG668I is housed in a 668-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 32 I/O banks, each supporting independent VCCO and VREF settings. The package has 444 user I/O pins and 22 dedicated configuration pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Select | Determines configuration mode (SelectMAP, JTAG, or Serial) at power-up |
| CCLK | Configuration Clock | Drives internal configuration logic during Master SelectMAP or Slave Serial modes |
| DIN / DOUT | Data In / Data Out | Serial bitstream transfer path for configuration and readback |
| INIT_B | Initialization Status | Open-drain active-low signal indicating configuration memory readiness |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and restarts loading |
| CLK0–CLK3 | Global Clock Inputs | Dedicated low-skew inputs feeding global clock networks for synchronous design |
Key Features
| Feature | Design Value |
|---|---|
| Hard PowerPC 405 Cores | Two embedded 32-bit RISC processors with cache and memory management units enable real-time control alongside programmable logic |
| Partial Reconfiguration | Allows dynamic swapping of logic modules without resetting the entire device, critical for adaptive radio and protocol gateways |
| AES-128 Bitstream Encryption | Protects intellectual property by preventing unauthorized readback or cloning of configuration data |
| Dual-Register I/Os | Each I/O supports input/output register stages for timing-critical interfaces like DDR2 SDRAM with 2-cycle setup/hold margin |
| Multi-Voltage I/O Banks | 32 independent banks support mixed-voltage operation (1.2 V to 3.3 V), enabling direct connection to diverse peripherals |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical digital down-conversion and CFAR algorithms; RocketIO links to ADC/DAC mezzanine cards. Use Value: 128 DSP48 slices deliver 256 MAC operations/cycle at 200 MHz, meeting sub-microsecond latency targets. | Use Scenario: High-throughput image reconstruction pipeline in CT and MRI scanners. IC Role / Device Role / Timing Role: Coordinates parallel acquisition from multi-channel ADCs, performs back-projection, and streams processed volumes over PCIe. Use Value: 16-lane RocketIO transceivers sustain 4 GB/s aggregate bandwidth to host CPU, eliminating PCIe bottlenecks. |
| Avionics Data Concentrator | Industrial Protocol Gateway |
Use Scenario: ARINC 429, MIL-STD-1553, and AFDX network bridging in flight control systems. IC Role / Device Role / Timing Role: Implements deterministic packet routing, timestamping, and redundancy management across heterogeneous avionics buses. Use Value: Dual PowerPC 405 cores run DO-178C-certifiable firmware while FPGA logic handles low-level bus arbitration and CRC generation. | Use Scenario: Translation between Modbus TCP, PROFINET, and EtherCAT in smart factory edge controllers. IC Role / Device Role / Timing Role: FPGA fabric implements protocol state machines and frame parsing; I/O banks interface directly to PHYs and isolation ICs. Use Value: 444 user I/O pins support simultaneous attachment of up to four isolated Ethernet PHYs and eight RS-485 transceivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX60-10FFG668I | Higher logic density (62,208 CLBs), same package and speed grade | Supports larger algorithm partitions and additional protocol stacks without board redesign | Select when >41K logic cells or >2,500 Kbits block RAM are required |
| XCVU9P-2FLGA2104I | UltraScale architecture, 2,586K logic cells, 32.75 GT/s GTY transceivers, no embedded PowerPC | Targets AI-accelerated vision and 5G baseband where legacy PowerPC firmware is not needed | Choose for new designs requiring higher throughput and modern toolchain support, not drop-in replacement |
Compared with XC4VLX40-10FFG668I, XC4VLX60-10FFG668I offers scalable logic headroom within identical thermal and PCB constraints, while XCVU9P-2FLGA2104I delivers generational performance uplift at the cost of architectural discontinuity and toolchain migration effort.
Availability
XC4VLX40-10FFG668I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and avionics data concentrator applications requiring stable component supply across extended product lifecycles.
Supply support for XC4VLX40-10FFG668I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and CPU/GPU technologies for data center, AI, and embedded markets.
The Virtex-4 LX family was designed for high-performance logic-intensive applications demanding integrated processing, high-speed serial I/O, and deterministic real-time behavior in aerospace, defense, and medical systems.
FAQ
What is the maximum supported I/O standard voltage for XC4VLX40-10FFG668I?
The XC4VLX40-10FFG668I supports I/O bank voltages from 1.2 V to 3.3 V per bank. Each of its 32 I/O banks can be independently configured with VCCO and VREF settings, enabling concurrent interfacing to DDR2 (1.8 V), LVDS (2.5 V), and LVTTL (3.3 V) devices without level-shifting components.
Does XC4VLX40-10FFG668I support partial reconfiguration?
Yes, XC4VLX40-10FFG668I supports partial reconfiguration through Xilinx ISE design tools. This capability allows runtime swapping of logic modules-such as protocol engines or filter coefficients-without disrupting the rest of the configuration, which is essential for adaptive communication systems and field-upgradable instrumentation.
What configuration modes are available for XC4VLX40-10FFG668I?
XC4VLX40-10FFG668I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SelectMAP uses an external PROM; JTAG enables boundary-scan testing and in-system programming via standard debug interfaces.
Is bitstream encryption supported on XC4VLX40-10FFG668I?
Yes, XC4VLX40-10FFG668I supports AES-128 bitstream encryption. When enabled, the configuration bitstream is encrypted before storage in external PROM and decrypted on-the-fly during loading, protecting proprietary logic design from reverse engineering or unauthorized duplication.
What is the thermal design power (TDP) of XC4VLX40-10FFG668I under typical operating conditions?
The thermal design power of XC4VLX40-10FFG668I is 12.3 W under typical operating conditions with 50% logic utilization and active RocketIO transceivers. This value guides heatsink sizing and airflow requirements for conduction-cooled or forced-air enclosures in industrial and avionics deployments.
XC4VLX40-10FFG668I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4608
- Number of Logic Elements/Cells:
- 41472
- Total RAM Bits:
- 1769472
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VLX40-10FFG668I FAQ
1.How can I place an order for XC4VLX40-10FFG668I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX40-10FFG668I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX40-10FFG668I reliable?
The price and inventory of XC4VLX40-10FFG668I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX40-10FFG668I is usually 5 days.
3.What payment methods are accepted for XC4VLX40-10FFG668I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX40-10FFG668I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX40-10FFG668I?
XC4VLX40-10FFG668I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX40-10FFG668I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX40-10FFG668I?
For technical support, including XC4VLX40-10FFG668I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX40-10FFG668I requirements.
6.How does Aetrix verify that XC4VLX40-10FFG668I is sourced from the original manufacturer or authorized distributors?
All XC4VLX40-10FFG668I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX40-10FFG668I meets industry standards.
7.What is the process for return or replacement of XC4VLX40-10FFG668I?
All XC4VLX40-10FFG668I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX40-10FFG668I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX40-10FFG668I part is unused and in its original packaging.
Return procedure for XC4VLX40-10FFG668I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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