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AMD XC4VLX40-11FFG668I
- Part No.:
- XC4VLX40-11FFG668I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VLX40-11FFG668I.pdf
- Description:
- IC FPGA 448 I/O 668FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,353
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Product details
Overview
XC4VLX40-11FFG668I from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA with 41,472 logic cells, 2.5 Gbps multi-gigabit transceivers, and embedded PowerPC 405 cores. It features 2,016 Kbits of block RAM, 128 DSP48 slices, and operates at -11 speed grade with industrial temperature range (-40°C to +100°C). Used in high-performance reconfigurable computing and protocol bridging systems.
For engineers reviewing the XC4VLX40-11FFG668I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (448 user I/Os), transceiver compliance (Xilinx SelectIO™ and RocketIO™), power supply sequencing requirements, and configuration interface options (Master Serial, Slave SelectMAP).
Technical Context
The XC4VLX40-11FFG668I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for arithmetic-intensive tasks, and integrated RocketIO™ transceivers supporting protocols including PCI Express Gen1 and Gigabit Ethernet. Its dual-register LUT-based logic enables high-speed synchronous design.
Configuration is performed via internal Spartan-3 compatible PROM or external serial/parallel mode using JTAG, with bitstream encryption support. The device supports partial reconfiguration and dynamic reconfiguration through dedicated ICAP interface, enabling runtime hardware updates without system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 41,472 - total programmable logic capacity for complex state machines and data paths |
| User I/O Pins | 448 - supports high-pin-count interfaces such as DDR2 memory controllers and parallel video buses |
| Block RAM | 2,016 Kbits - distributed across 128 blocks, each 18 Kbits, usable for FIFOs or lookup tables |
| DSP Slices | 128 DSP48 - fixed-point multiply-accumulate units with 25×18-bit multipliers and 48-bit accumulators |
| Transceivers | 16 RocketIO™ - each supports 622 Mbps–2.5 Gbps line rates, compliant with PCIe 1.0a and SATA 1.0 |
| Speed Grade | -11 - highest performance bin for Virtex-4 LX, enabling 500+ MHz system clock domains |
| Operating Temp | -40°C to +100°C - qualified for industrial and extended-temperature embedded applications |
Pinout & Package
XC4VLX40-11FFG668I is housed in a 668-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% required for CLB and interconnect logic; decoupling critical for signal integrity |
| VCCAUX | Auxiliary power supply | 2.5 V ±5% powers configuration logic, selectIO banks, and transceiver reference circuitry |
| VCCO_0 | I/O bank power | Programmable voltage (1.2–3.3 V) per bank; determines output swing and input threshold for associated pins |
| M0–M2 | Configuration mode select | Three-pin encoding sets boot mode: Master Serial, Slave Serial, or SelectMAP parallel |
| CCLK | Configuration clock | Input clock for Master Serial mode; frequency up to 50 MHz determines bitstream load time |
| DONE | Configuration status | Open-drain output asserted high when configuration completes successfully and device is ready |
Key Features
| Feature | Design Value |
|---|---|
| Embedded PowerPC 405 cores | Two hard-macro RISC processors enable tightly coupled software-hardware co-design without external CPU |
| Partial Reconfiguration | Allows dynamic swapping of logic regions during operation-critical for adaptive radio and real-time protocol stacks |
| SelectIO Technology | Supports 19 I/O standards including LVDS, SSTL, HSTL, and differential signaling with programmable drive strength and slew rate |
| RocketIO Transceivers | Integrated SERDES with built-in 8B/10B encoder/decoder, elastic buffer, and clock correction for jitter-tolerant links |
| ICAP Interface | Dedicated internal configuration access port enables secure, runtime bitstream loading and hardware self-modification |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric implements parallel FFT engines and digital downconverters; RocketIO transceivers interface with ADC/DAC FMC modules. Use Value: 128 DSP48 slices deliver >20 GOPS sustained compute; -11 speed grade ensures deterministic 200+ MHz timing closure on critical paths. | Use Scenario: High-throughput image reconstruction pipeline in CT and MRI scanners. IC Role / Device Role / Timing Role: Configurable logic manages multi-channel data aggregation from analog front-ends and feeds GPU-accelerated reconstruction kernels. Use Value: 448 user I/Os support simultaneous 32-bit DDR2 memory bus, 8-lane PCI Express upstream, and 4-lane Camera Link outputs. |
| Avionics Data Concentrator | Industrial Protocol Gateway |
Use Scenario: ARINC 429, MIL-STD-1553, and AFDX network bridging in flight control subsystems. IC Role / Device Role / Timing Role: FPGA implements deterministic time-triggered communication stacks and hardware-based CRC/error-checking accelerators. Use Value: Industrial temperature rating (-40°C to +100°C) and SEU-hardened configuration memory meet DO-254 Level A requirements. | Use Scenario: Translation between Modbus TCP, PROFINET, and EtherCAT in smart factory edge controllers. IC Role / Device Role / Timing Role: Dual PowerPC 405 cores run real-time OS and protocol stacks; FPGA fabric handles packet parsing and timestamping. Use Value: Embedded processor + programmable logic eliminates need for separate MCU+FPGA board-level integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX60-11FFG668I | Higher logic density (62,208 LCs), same package and pinout; requires higher power and thermal management | Preferred for designs needing >40K logic cells but constrained by PCB footprint | Select when additional CLBs or block RAM are required without changing board layout |
| XCVU3P-2FFVD1760I | UltraScale architecture, 324K logic cells, 24.3 Gbps GTY transceivers; larger 1760-pin package, no pin compatibility | Targeted at next-generation systems requiring PCIe Gen4, DDR4, and hardened 100G Ethernet MAC | Choose for new designs where migration path, bandwidth, and scalability outweigh legacy compatibility |
Compared with XC4VLX40-11FFG668I, the XC4VLX60-11FFG668I offers direct layout reuse with increased resources, while the XCVU3P-2FFVD1760I provides architectural advancement at the cost of redesign-making the former ideal for incremental upgrades and the latter for green-field high-bandwidth applications.
Availability
XC4VLX40-11FFG668I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend systems, and avionics data concentrators requiring stable component supply and long-term lifecycle support.
Supply support for XC4VLX40-11FFG668I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms spanning FPGAs, adaptive SoCs, and AI engines for data center, aerospace, and industrial markets.
The Virtex-4 family was originally designed by Xilinx for high-performance, system-level integration-targeting applications demanding both programmable logic density and hardened IP such as processors and transceivers.
FAQ
What is the maximum supported I/O standard voltage for XC4VLX40-11FFG668I?
XC4VLX40-11FFG668I supports I/O voltages from 1.2 V to 3.3 V per bank, with individual bank configuration. Each I/O bank's VCCO must match the selected standard (e.g., 1.8 V for SSTL18, 2.5 V for HSTL_I). The device does not support 1.0 V or 3.6 V operation, and mixing incompatible standards within one bank is prohibited.
Does XC4VLX40-11FFG668I support JTAG boundary-scan testing?
Yes, XC4VLX40-11FFG668I fully complies with IEEE 1149.1 (JTAG) and supports boundary-scan testing via TDI, TDO, TMS, TCK, and TRST pins. The BSCAN_VIRTEX4 primitive enables access to internal logic states, and the device supports INTEST, EXTEST, and SAMPLE instructions for PCB-level diagnostics.
Can XC4VLX40-11FFG668I be configured using SPI flash memory?
No, XC4VLX40-11FFG668I does not natively support SPI flash configuration. It requires x8 or x16 parallel NOR flash (SelectMAP mode) or serial PROM (Master Serial mode using Xilinx Platform Flash XL). SPI interface support was introduced in later Virtex-5 and newer families.
What is the configuration bitstream size for XC4VLX40-11FFG668I?
The uncompressed configuration bitstream for XC4VLX40-11FFG668I is approximately 5.2 Mbits for full device programming. With Xilinx BitGen compression enabled, typical compressed size is ~2.8 Mbits. Bitstream format is proprietary and requires Xilinx ISE 14.7 or earlier toolchain for generation and validation.
Is XC4VLX40-11FFG668I qualified for automotive AEC-Q100?
No, XC4VLX40-11FFG668I is rated for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. Xilinx did not release any Virtex-4 devices under automotive qualification; automotive-grade alternatives require evaluation of Spartan-3A DSP or later Zynq-7000 series with formal AEC-Q100 certification.
XC4VLX40-11FFG668I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4608
- Number of Logic Elements/Cells:
- 41472
- Total RAM Bits:
- 1769472
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VLX40-11FFG668I FAQ
1.How can I place an order for XC4VLX40-11FFG668I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX40-11FFG668I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX40-11FFG668I reliable?
The price and inventory of XC4VLX40-11FFG668I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX40-11FFG668I is usually 5 days.
3.What payment methods are accepted for XC4VLX40-11FFG668I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX40-11FFG668I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX40-11FFG668I?
XC4VLX40-11FFG668I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX40-11FFG668I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX40-11FFG668I?
For technical support, including XC4VLX40-11FFG668I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX40-11FFG668I requirements.
6.How does Aetrix verify that XC4VLX40-11FFG668I is sourced from the original manufacturer or authorized distributors?
All XC4VLX40-11FFG668I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX40-11FFG668I meets industry standards.
7.What is the process for return or replacement of XC4VLX40-11FFG668I?
All XC4VLX40-11FFG668I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX40-11FFG668I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX40-11FFG668I part is unused and in its original packaging.
Return procedure for XC4VLX40-11FFG668I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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