AMD XC4VLX60-10FF668C
- Part No.:
- XC4VLX60-10FF668C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VLX60-10FF668C.pdf
- Description:
- IC FPGA 448 I/O 668FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,585
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Product details
Overview
XC4VLX60-10FF668C from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA featuring 60,096 logic cells, 288 embedded 18×18 multipliers, and 3.8 MB of total block RAM. It uses a 668-pin Fine-Pitch Flip-Chip BGA (FF668) package with 320 user I/Os and supports SelectIO standards up to 840 Mb/s. It is deployed in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC4VLX60-10FF668C datasheet, pinout, applications, or equivalent options, key selection considerations include speed grade (-10), I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), embedded memory depth, multiplier count, and configuration interface compatibility (Master SelectMAP, Slave Serial).
Technical Context
The XC4VLX60-10FF668C implements a hierarchical architecture with configurable logic blocks (CLBs), dedicated DSP slices, and block RAM columns distributed across eight columns. It integrates RocketIO™ multi-gigabit transceivers (not present in LX variant) and supports partial reconfiguration via ICAP.
Configuration is performed through internal configuration access port (ICAP), JTAG, or Master/Slave SelectMAP interfaces. The -10 speed grade guarantees timing closure at 100 MHz system clock with worst-case commercial temperature (0°C to 85°C) and 1.2 V core supply.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 60,096 - determines maximum combinational and sequential logic capacity for RTL implementation |
| Block RAM | 3,784 kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory |
| Embedded Multipliers | 288 × 18×18 - enables parallel DSP operations such as FIR filtering and FFT computation |
| User I/O Pins | 320 - supports high-bandwidth parallel interfaces including DDR2 SDRAM and parallel ADC/DAC |
| Speed Grade | -10 - specifies guaranteed timing performance at 100 MHz system frequency under commercial conditions |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
| I/O Standards | LVCMOS, LVTTL, SSTL, HSTL, PCI - enables direct interfacing with diverse memory and peripheral devices |
Pinout & Package
XC4VLX60-10FF668C is housed in a 668-pin Fine-Pitch Flip-Chip BGA (FF668) package with 320 user-configurable I/Os, 12 global clock inputs, and dedicated configuration pins (INIT_B, PROGRAM_B, CCLK, DIN, DOUT, DONE). Thermal and power integrity are maintained via integrated thermal pad and multiple VCCINT/VCCAUX/VCCO banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master SelectMAP mode |
| DIN | Configuration Data Input | Serial data input for bitstream loading in Master/Slave SelectMAP modes |
| DONE | Configuration Status Output | Asserted high when configuration completes successfully and device enters user mode |
| INIT_B | Initialization Status Output | Open-drain output indicating device readiness to accept configuration data |
| PROGRAM_B | Configuration Reset Input | Active-low signal that clears configuration memory and restarts configuration sequence |
| GCLK[0–11] | Global Clock Input | Dedicated low-skew routing to all clock-capable resources across the device |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic updates in operational systems without full device reset |
| Dedicated DSP Slices | Each slice combines 18×18 multiplier with accumulator and pipeline registers for deterministic latency |
| Multi-Voltage I/O Banks | 16 independent I/O banks allow mixed-voltage operation (1.2 V to 3.3 V) on single device |
| Internal Configuration Access Port (ICAP) | Allows runtime access to configuration memory for self-modifying logic or field updates |
| Triple-Mode Redundancy (TMR) Support | Hardware-level mitigation for single-event upsets in radiation-prone environments |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical filter chains and coordinate transformations with sub-microsecond latency. Use Value: 288 embedded multipliers enable concurrent channel processing; 320 I/Os support high-speed ADC front-end and DAC back-end interfaces. | Use Scenario: Accelerating reconstruction algorithms (e.g., filtered back-projection) in CT and MRI scanners. IC Role / Device Role / Timing Role: Configurable logic implements custom pipeline stages synchronized to detector sampling clocks. Use Value: 3.8 MB block RAM stores intermediate projection data; -10 speed grade ensures deterministic execution within 100 MHz timing budget. |
| Industrial Protocol Gateway | High-Speed Test Equipment |
Use Scenario: Bridging EtherCAT, PROFINET, and SERCOS III in factory automation controllers. IC Role / Device Role / Timing Role: Implements protocol state machines and real-time packet forwarding with hardware timestamping. Use Value: Multi-voltage I/O banks interface directly with 2.5 V PHYs and 3.3 V legacy fieldbus transceivers without level shifters. | Use Scenario: Generating and analyzing multi-channel digital patterns in ATE platforms. IC Role / Device Role / Timing Role: Serves as pattern generator core with precise cycle-accurate stimulus control. Use Value: 320 user I/Os support 64-bit wide parallel vector buses; 100 MHz system clock meets 100 MS/s test rate requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX80-10FF1148C | Higher logic density (81,792 CLBs), larger FF1148 package (1148 pins), +20% block RAM | Required for designs exceeding 60K logic cell capacity or needing >320 I/Os | Select when scalability beyond XC4VLX60-10FF668C resources is confirmed |
| XC5VLX50T-1FF665C | Virtex-5 architecture; 50K logic cells; 220 I/Os; lower static power; no TMR support | Suitable for cost-sensitive, lower-complexity designs where radiation tolerance is not required | Choose for migration path requiring reduced power and newer toolchain support |
Compared with XC4VLX60-10FF668C, XC4VLX80-10FF1148C offers headroom for expansion but requires PCB redesign, while XC5VLX50T-1FF665C reduces power and simplifies tool flow at the expense of radiation-hardened features and I/O count.
Availability
XC4VLX60-10FF668C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and industrial protocol gateway applications requiring stable component supply and long-term obsolescence management.
Supply support for XC4VLX60-10FF668C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues to support the Virtex family as part of its adaptive computing portfolio for high-performance, mission-critical systems.
The Virtex-4 LX series was designed for logic-intensive, high-bandwidth applications demanding deterministic timing, large on-chip memory, and flexible I/O interfacing in aerospace, defense, and industrial infrastructure.
FAQ
What is the maximum operating frequency of the XC4VLX60-10FF668C?
The XC4VLX60-10FF668C carries a -10 speed grade, guaranteeing timing closure for system clock frequencies up to 100 MHz under worst-case commercial conditions (0°C to 85°C, 1.2 V ±3%). Actual achievable frequency depends on design complexity, routing, and I/O standard selection. The XC4VLX60-10FF668C does not specify a hard upper limit beyond this guaranteed timing budget.
Does the XC4VLX60-10FF668C support partial reconfiguration?
Yes, the XC4VLX60-10FF668C supports partial reconfiguration via its Internal Configuration Access Port (ICAP), enabling dynamic updates to designated logic regions without resetting the entire device. This capability is documented in Xilinx UG070 and verified in production designs using the XC4VLX60-10FF668C. Implementation requires specific floorplanning and bitstream generation workflows.
What configuration modes are supported by the XC4VLX60-10FF668C?
The XC4VLX60-10FF668C supports Master SelectMAP, Slave SelectMAP, Slave Serial, and JTAG configuration modes. It also allows fallback to JTAG if primary configuration fails. These modes are implemented using dedicated pins (CCLK, DIN, DOUT, INIT_B, PROGRAM_B, DONE) and are fully specified in the XC4VLX60-10FF668C data sheet revision 2.0.
Is triple-mode redundancy (TMR) supported on the XC4VLX60-10FF668C?
Yes, the XC4VLX60-10FF668C includes hardware-level support for triple-mode redundancy (TMR) to mitigate single-event upsets, particularly in radiation-exposed environments. This feature is enabled through Xilinx's TMR Tool and applies to both CLB and block RAM resources. TMR implementation is validated for use with the XC4VLX60-10FF668C in aerospace-grade designs.
What I/O standards does the XC4VLX60-10FF668C support?
The XC4VLX60-10FF668C supports LVCMOS, LVTTL, SSTL-2, SSTL-3, HSTL-I, HSTL-II, and PCI I/O standards across its 16 independently powered I/O banks. Each bank operates at voltages from 1.2 V to 3.3 V, allowing mixed-voltage interfaces. This I/O flexibility is confirmed in the XC4VLX60-10FF668C DC and switching characteristics specification.
XC4VLX60-10FF668C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6656
- Number of Logic Elements/Cells:
- 59904
- Total RAM Bits:
- 2949120
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VLX60-10FF668C FAQ
1.How can I place an order for XC4VLX60-10FF668C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX60-10FF668C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX60-10FF668C reliable?
The price and inventory of XC4VLX60-10FF668C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX60-10FF668C is usually 5 days.
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XC4VLX60-10FF668C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX60-10FF668C order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for XC4VLX60-10FF668C?
For technical support, including XC4VLX60-10FF668C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX60-10FF668C requirements.
6.How does Aetrix verify that XC4VLX60-10FF668C is sourced from the original manufacturer or authorized distributors?
All XC4VLX60-10FF668C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX60-10FF668C meets industry standards.
7.What is the process for return or replacement of XC4VLX60-10FF668C?
All XC4VLX60-10FF668C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX60-10FF668C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX60-10FF668C part is unused and in its original packaging.
Return procedure for XC4VLX60-10FF668C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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