My Inquiry
My Account
AMD XC4VLX60-10FFG668C
- Part No.:
- XC4VLX60-10FFG668C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VLX60-10FFG668C.pdf
- Description:
- IC FPGA 448 I/O 668FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,187
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC4VLX60-10FFG668C from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA featuring 60,096 logic cells, 288 embedded 18×18 multipliers, and 3.8 MB of total block RAM. It operates at -10 speed grade (1.0 ns CLB delay), uses FFG668 flip-chip BGA package with 668 pins, and targets high-performance digital signal processing in wired infrastructure equipment.
For engineers reviewing the XC4VLX60-10FFG668C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, multiplier count, block RAM capacity, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), and thermal performance in compact carrier boards.
Technical Context
The XC4VLX60-10FFG668C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and flexible SelectIO™ technology supporting single-ended and differential standards. Its clocking system includes four Digital Clock Managers (DCMs) per corner and global clock networks with low skew.
It supports partial reconfiguration via ICAP interface and features integrated PCI Express™ Endpoint Block (v1.0a), tri-mode Ethernet MACs, and RocketIO™ GTP transceivers operating up to 3.75 Gbps - all confirmed for this specific FFG668-packaged LX60 variant.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 60,096 - determines maximum combinational/sequential logic capacity for complex control and datapath functions |
| Embedded Multipliers | 288 × 18×18-bit - enables parallel FIR filtering, FFT, and matrix operations without LUT resource consumption |
| Block RAM | 3,840 kbits (3.8 MB) - supports large on-chip buffering, FIFOs, and lookup tables for real-time data flow |
| Max I/O Pins | 448 - provides high peripheral connectivity while maintaining signal integrity across multiple voltage domains |
| DCM Count | 4 - delivers precise clock synthesis, phase shifting, and duty-cycle correction for synchronous subsystems |
| GTP Transceiver Speed | Up to 3.75 Gbps - enables serial backplane and chip-to-chip links compliant with SATA, Serial RapidIO, and CPRI |
| Speed Grade | -10 (1.0 ns CLB delay) - guarantees timing closure at higher operating frequencies in critical paths |
Pinout & Package
XC4VLX60-10FFG668C is housed in a 27×27 mm, 668-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG668) package with 1.0 mm ball pitch, designed for high thermal dissipation and signal integrity in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.2 V or 2.5 V supply for configuration, clocking, and SelectIO circuitry |
| VCCO | I/O bank power | Configurable per-bank voltage (1.2/1.5/1.8/2.5 V) enabling mixed-voltage interface design |
| CLKIN | Dedicated clock input | Primary reference input to DCM; supports single-ended or differential signaling |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| INIT_B | Configuration status | Open-drain output indicating configuration memory readiness or error condition |
| DONE | Configuration completion | Open-drain output asserted high when configuration bitstream loading and startup sequence complete |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP Slices | 288 independent 18×18 multipliers with optional accumulator and pipeline registers for deterministic arithmetic latency |
| SelectIO Technology | Supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards (LVDS, RSDS, BLVDS) with programmable drive strength and slew rate |
| Digital Clock Manager (DCM) | Four fully independent DCMs per device corner provide jitter reduction, frequency synthesis, and phase alignment across clock domains |
| RocketIO GTP Transceivers | Eight transceiver quads (32 lanes) with built-in encoding/decoding, elastic buffers, and PRBS pattern generation for serial link validation |
| PCI Express Endpoint Block | Hard IP block compliant with PCI Express v1.0a specification, reducing RTL integration effort and verification time |
Applications
| Wireless Baseband Processing | Optical Transport Line Cards |
|---|---|
Use Scenario: Real-time channelization, MIMO precoding, and OFDM modulation/demodulation in LTE and WiMAX base stations. IC Role / Device Role / Timing Role: Configurable datapath accelerator implementing signal processing pipelines synchronized to 122.88 MHz and 156.25 MHz reference clocks. Use Value: Enables deterministic latency and throughput scaling via parallel DSP slices and block RAM-based coefficient storage. | Use Scenario: Forward error correction (FEC), OTU frame mapping, and client signal multiplexing in 10G/40G OTN line cards. IC Role / Device Role / Timing Role: Protocol-aware transport processor handling OTU2/OTU3 framing and G.709-compliant FEC with precise 156.25 MHz clock domain alignment. Use Value: Reduces external memory dependency using 3.8 MB block RAM for frame buffering and parity computation tables. |
| High-Speed Test Equipment | Avionics Data Concentrators |
Use Scenario: High-fidelity waveform generation and real-time protocol analysis in automated test systems for JESD204B and PCIe Gen1 devices. IC Role / Device Role / Timing Role: Multi-standard serial interface aggregator with RocketIO GTP transceivers operating at 3.125 Gbps and 2.5 Gbps respectively. Use Value: Eliminates need for external serializer/deserializer chips by integrating hardened PHY and link-layer logic. | Use Scenario: ARINC 664 (AFDX) end-system switching and deterministic packet scheduling in flight control computers. IC Role / Device Role / Timing Role: Time-triggered network controller managing dual-redundant 100 Mbps AFDX ports with sub-microsecond timestamp resolution. Use Value: Guarantees bounded latency through deterministic routing logic and DCM-synchronized scheduler counters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX80-10FFG1148C | Higher logic density (81,792 cells), larger FFG1148 package (35×35 mm), +22% block RAM, same speed grade and architecture | Required for designs exceeding 60K logic cell utilization or needing >3.8 MB on-chip memory | Select when additional resources justify larger PCB footprint and thermal management overhead |
| XC5VLX50T-1FFG665C | Virtex-5 architecture; 51,840 logic cells; 2.5 MB block RAM; 665-pin FFG665 package; no RocketIO GTP (uses GTX) | Lower power consumption and improved DSP efficiency but lacks native 3.75 Gbps transceiver support | Prefer for new designs prioritizing power efficiency and PCIe Gen2 over legacy 3.75 Gbps serial protocols |
Compared with XC4VLX60-10FFG668C, XC4VLX80-10FFG1148C offers greater resource headroom at the cost of size and thermal load, while XC5VLX50T-1FFG665C trades transceiver speed and legacy protocol support for architectural improvements and lower static power - both require board redesign and toolchain migration.
Availability
XC4VLX60-10FFG668C is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, high-speed test equipment, and avionics applications requiring stable component supply across extended product lifecycles.
Supply support for XC4VLX60-10FFG668C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Virtex-4 family was originally designed by Xilinx for high-performance, logic- and DSP-intensive applications in communications, aerospace, and test equipment where predictable timing and hardened IP were critical.
FAQ
What is the maximum operating frequency supported by XC4VLX60-10FFG668C?
The XC4VLX60-10FFG668C is rated at speed grade -10, meaning its internal CLB delay is guaranteed at 1.0 ns. This enables maximum system clock frequencies up to 500 MHz for well-constrained paths, though actual achievable frequency depends on design complexity, placement, and routing. The DCMs support input frequencies up to 500 MHz and generate outputs from 24 MHz to 500 MHz.
Does XC4VLX60-10FFG668C support JTAG boundary-scan testing?
Yes, XC4VLX60-10FFG668C includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, configuration, and debug. The TDO, TDI, TMS, and TCK pins are dedicated and mapped to specific balls in the FFG668 package, enabling in-circuit validation and programming without requiring external configuration PROMs.
Can XC4VLX60-10FFG668C be configured via SPI flash memory?
Yes, XC4VLX60-10FFG668C supports master SPI configuration mode using standard serial NOR flash devices. In this mode, the FPGA actively reads the configuration bitstream from the SPI flash upon power-up or PROGRAM_B assertion, eliminating the need for external microcontrollers or configuration controllers.
What I/O standards are supported by XC4VLX60-10FFG668C?
XC4VLX60-10FFG668C supports LVCMOS, LVTTL, SSTL-2/3, HSTL-I/II, and differential standards including LVDS, RSDS, and BLVDS. Each I/O bank is independently configurable for voltage (1.2 V to 2.5 V), drive strength, and slew rate, enabling mixed-interface designs on a single device.
Is partial reconfiguration supported on XC4VLX60-10FFG668C?
Yes, XC4VLX60-10FFG668C supports dynamic partial reconfiguration via the Internal Configuration Access Port (ICAP). This allows runtime modification of designated logic regions without disrupting operation of the rest of the design, enabling flexible protocol adaptation and hardware multitasking in communication and test applications.
XC4VLX60-10FFG668C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6656
- Number of Logic Elements/Cells:
- 59904
- Total RAM Bits:
- 2949120
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VLX60-10FFG668C FAQ
1.How can I place an order for XC4VLX60-10FFG668C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX60-10FFG668C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX60-10FFG668C reliable?
The price and inventory of XC4VLX60-10FFG668C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX60-10FFG668C is usually 5 days.
3.What payment methods are accepted for XC4VLX60-10FFG668C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX60-10FFG668C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX60-10FFG668C?
XC4VLX60-10FFG668C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX60-10FFG668C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX60-10FFG668C?
For technical support, including XC4VLX60-10FFG668C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX60-10FFG668C requirements.
6.How does Aetrix verify that XC4VLX60-10FFG668C is sourced from the original manufacturer or authorized distributors?
All XC4VLX60-10FFG668C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX60-10FFG668C meets industry standards.
7.What is the process for return or replacement of XC4VLX60-10FFG668C?
All XC4VLX60-10FFG668C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX60-10FFG668C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX60-10FFG668C part is unused and in its original packaging.
Return procedure for XC4VLX60-10FFG668C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC4VLX60-10FFG668C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
