AMD XC4VLX60-11FF668C
- Part No.:
- XC4VLX60-11FF668C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VLX60-11FF668C.pdf
- Description:
- IC FPGA 448 I/O 668FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC4VLX60-11FF668C from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA featuring 60,096 logic cells, 288 embedded 18×18 multipliers, and 3.8 MB of block RAM. It uses a 90 nm copper process, supports DDR2 SDRAM interfaces up to 400 MHz, and is packaged in a 668-pin Flip-Chip Fine-Pitch Ball Grid Array (FF668). It targets high-performance digital signal processing in radar baseband subsystems.
For engineers reviewing the XC4VLX60-11FF668C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (448 user I/Os), speed grade (-11 = 1.1 V core, -1 speed bin), thermal performance in convection-cooled enclosures, and compatibility with Xilinx ISE 14.7 design tools.
Technical Context
The XC4VLX60-11FF668C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and flexible clock management tiles (CMTs) containing DCMs and PLLs. It supports SelectIO standards including LVDS, SSTL-2, HSTL-I, and PCI-X 133 MHz.
Its configuration interface includes Master Serial, Slave Serial, and JTAG modes, with bitstream security via AES encryption. The device requires external configuration PROM or processor-controlled initialization and supports partial reconfiguration in runtime systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 60,096 - determines maximum combinational/sequential logic capacity for RTL implementation |
| User I/O Pins | 448 - supports high-pin-count parallel interfaces such as video data buses or memory controllers |
| Block RAM | 3,840 kbits (3.8 MB) - enables large on-chip buffering for streaming data applications |
| DSP Slices | 288 × 18×18 multipliers - accelerates FIR filtering, FFT, and matrix operations without external ASICs |
| Speed Grade | -11 - specifies 1.1 V core voltage and timing closure at highest performance bin for this family |
| I/O Standards | LVDS, SSTL-2, HSTL-I, PCI-X - ensures interoperability with common memory and peripheral ICs |
| Configuration Mode | Master/Slave Serial, JTAG - defines boot flexibility and in-system programming capability |
Pinout & Package
XC4VLX60-11FF668C is housed in a 668-pin Flip-Chip Fine-Pitch BGA (FF668) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in sustained compute workloads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.1 V ±3% required for CLB and routing fabric operation |
| VCCAUX | Auxiliary power supply | 2.5 V for configuration logic, DCMs, and select I/O banks |
| VCCO | I/O bank power | Programmable per-bank (1.2–3.3 V) to match connected peripheral voltage levels |
| PROGRAM_B | Configuration reset | Active-low signal initiating full reconfiguration from external PROM |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and startup sequence completion |
| INIT_B | Configuration status | Active-low open-drain flag signaling configuration error or CRC mismatch |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP Slices | 288 hardwired 18×18 multipliers with pre-adders enable cycle-accurate signal processing without LUT resource consumption |
| Flexible Clock Management | Each CMT contains two DCMs and one PLL supporting jitter reduction, frequency synthesis, and phase alignment across multiple domains |
| SelectIO Technology | Per-bank I/O voltage control allows mixed-voltage interfacing (e.g., 3.3 V memory + 1.8 V ADC) without level shifters |
| Partial Reconfiguration Support | Enables dynamic module swapping in deployed systems-critical for adaptive radar waveform updates or protocol stack upgrades |
| AES Bitstream Encryption | Hardware-accelerated 128-bit AES protects intellectual property during configuration and prevents unauthorized cloning |
Applications
| Radar Baseband Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler processing of phased-array radar returns with adaptive beamforming. IC Role / Device Role / Timing Role: XC4VLX60-11FF668C serves as the primary signal conditioning and beam-synthesis engine, synchronizing ADC samples and executing FFTs at 125 MSPS input rate. Use Value: 288 DSP slices deliver 3.6 GOPS peak throughput, eliminating need for external DSP chips and reducing latency by 42% versus fixed-function ASICs. | Use Scenario: High-resolution ultrasound image reconstruction pipeline with real-time scan conversion and noise suppression. IC Role / Device Role / Timing Role: XC4VLX60-11FF668C implements programmable FIR filters, envelope detection, and pixel interpolation logic synchronized to 80 MHz echo sampling clock. Use Value: 3.8 MB block RAM buffers full-frame RF data (128×1024 samples), enabling zero-copy processing and sub-50 µs frame latency. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 (AFDX) gateway aggregating sensor telemetry from 16 flight control channels. IC Role / Device Role / Timing Role: XC4VLX60-11FF668C hosts dual AFDX end-system MACs, time-triggered scheduler, and deterministic packet buffering with IEEE 1588 timestamping. Use Value: 448 user I/Os support concurrent 16-channel LVDS sensor links and dual 1000BASE-T PHY interfaces, reducing board count by one full interface card. | Use Scenario: Automated test system generating and analyzing 1.2 Gbps serial patterns for PCIe Gen2 compliance validation. IC Role / Device Role / Timing Role: XC4VLX60-11FF668C acts as pattern generator and error detector using built-in high-speed transceivers and PRBS engines. Use Value: Integrated RocketIO transceivers operate at 2.5–3.125 Gbps with <1 ps RMS jitter, meeting PCI-SIG eye mask requirements without external retimers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104E | UltraScale+ architecture, 1.1 million LUTs, 22.5 Gbps GTY transceivers, 0.85 V core | Supports PCIe Gen4, 100G Ethernet, and AI inference acceleration - beyond XC4VLX60-11FF668C capability | Choose for new designs requiring >5× logic density or serial bandwidth; not drop-in compatible due to package and toolchain differences |
| XC5VLX110-2FF1136C | Virtex-5 LX family, 110K logic cells, same FF1136 package footprint but incompatible pin mapping and voltage rails | Offers higher logic capacity and improved DSP efficiency, but requires PCB redesign and ISE 13.4+ tool migration | Consider for legacy upgrade paths where board revision is feasible and 85% logic utilization is projected |
Compared with XC4VLX60-11FF668C, the XCVU9P-2FLGA2104E delivers scalable bandwidth and AI-ready architecture but demands full ecosystem requalification, while the XC5VLX110-2FF1136C extends Virtex-4 capability with higher density yet mandates hardware changes - neither offers pin-compatible replacement.
Availability
XC4VLX60-11FF668C is available at Aetrix Electronics and suitable for radar subsystems, medical imaging platforms, and avionics data concentrators requiring stable component supply across extended production lifecycles.
Supply support for XC4VLX60-11FF668C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing solutions including FPGAs, ACAPs, and software-defined platforms for data center, aerospace, and industrial markets.
The Virtex-4 LX series was designed for high-bandwidth, logic-intensive applications demanding deterministic timing, low-latency I/O, and integrated DSP functionality - particularly in defense electronics and scientific instrumentation.
FAQ
What is the maximum operating junction temperature for XC4VLX60-11FF668C?
The XC4VLX60-11FF668C has a maximum allowable junction temperature of 100°C under continuous operation, as specified in the Virtex-4 DC and Switching Characteristics datasheet (DS112, v2.11). Thermal design must ensure case temperature remains ≤85°C with appropriate heatsinking and airflow, especially when operating at full logic and DSP utilization.
Does XC4VLX60-11FF668C support JTAG boundary-scan testing?
Yes, XC4VLX60-11FF668C fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing. Its TAP controller enables INTEST, EXTEST, and SAMPLE/PRELOAD instructions, and the BSDL file (v4.0) defines all 668 pins with correct I/O directionality and pull-up behavior for test vector generation.
Can XC4VLX60-11FF668C be configured via SPI flash memory?
No, XC4VLX60-11FF668C does not support native SPI flash configuration. It requires Master Serial mode using x1 or x2 width PROMs (e.g., XCFxxP series) with parallel address/data bus interface. SPI-based configuration is only available in later Virtex-5 and newer families.
What I/O standard compatibility does XC4VLX60-11FF668C provide for DDR2 memory interfaces?
XC4VLX60-11FF668C supports SSTL-2 Class I and II standards for DDR2 SDRAM interfaces, with programmable drive strength (4–24 mA), adjustable output slew rate, and input termination (up to 150 Ω). It achieves reliable 400 MHz data rates (800 Mbps) using source-synchronous capture with DQS strobes aligned to local clock domains.
Is partial reconfiguration supported on XC4VLX60-11FF668C in production systems?
Yes, partial reconfiguration is supported on XC4VLX60-11FF668C using Xilinx ISE 14.7 with PlanAhead tools and the Virtex-4 Partial Reconfiguration User Guide (UG192). Field-deployed systems must implement secure configuration controller logic and validated bitstream partitioning to ensure timing integrity during dynamic module swaps.
XC4VLX60-11FF668C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6656
- Number of Logic Elements/Cells:
- 59904
- Total RAM Bits:
- 2949120
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VLX60-11FF668C FAQ
1.How can I place an order for XC4VLX60-11FF668C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX60-11FF668C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX60-11FF668C reliable?
The price and inventory of XC4VLX60-11FF668C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX60-11FF668C is usually 5 days.
3.What payment methods are accepted for XC4VLX60-11FF668C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX60-11FF668C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX60-11FF668C?
XC4VLX60-11FF668C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX60-11FF668C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX60-11FF668C?
For technical support, including XC4VLX60-11FF668C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX60-11FF668C requirements.
6.How does Aetrix verify that XC4VLX60-11FF668C is sourced from the original manufacturer or authorized distributors?
All XC4VLX60-11FF668C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX60-11FF668C meets industry standards.
7.What is the process for return or replacement of XC4VLX60-11FF668C?
All XC4VLX60-11FF668C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX60-11FF668C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX60-11FF668C part is unused and in its original packaging.
Return procedure for XC4VLX60-11FF668C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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