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AMD XC4VLX60-11FFG668I
- Part No.:
- XC4VLX60-11FFG668I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VLX60-11FFG668I.pdf
- Description:
- IC FPGA 448 I/O 668FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,144
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Product details
Overview
XC4VLX60-11FFG668I from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA featuring 60,096 logic cells, 288 embedded 18×18 multipliers, and 3.8 MB of total block RAM. It uses a 668-pin Fine-Pitch Flip-Chip BGA (FFG) package with 448 user I/Os and operates at -11 speed grade (1.1 ns CLB delay). It is deployed in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC4VLX60-11FFG668I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, embedded multiplier density, block RAM capacity, speed grade timing closure, and FFG668 thermal/mechanical compatibility with PCB layout constraints.
Technical Context
The XC4VLX60-11FFG668I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), SelectIO™ technology for multi-standard I/O support (LVCMOS, LVDS, SSTL, HSTL), and RocketIO™ multi-gigabit transceivers (up to 3.125 Gbps) in higher-density variants - though this specific LX60 variant does not include transceivers. It supports partial reconfiguration and features dedicated clock management tiles with DCMs (Digital Clock Managers) for jitter reduction and phase alignment.
It targets 90 nm copper process technology, operates at 1.2 V core voltage, and supports JTAG boundary-scan IEEE 1149.1 compliance for test and configuration. Configuration is performed via Master SelectMAP, Slave SelectMAP, or Serial PROM modes using external non-volatile memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 60,096 - determines maximum combinational/sequential logic capacity for RTL implementation |
| Embedded Multipliers | 288 × 18×18-bit - enables high-throughput DSP functions like FIR filtering and FFT without LUT resource consumption |
| Block RAM | 3.8 MB - supports large on-chip data buffering, FIFOs, and lookup tables without external memory access |
| User I/O Pins | 448 - provides high interface density for parallel buses, memory controllers, and multi-protocol I/O banks |
| Speed Grade | -11 (1.1 ns CLB delay) - guarantees timing closure for designs targeting ≥500 MHz system clocks under worst-case conditions |
| Package | FFG668 - 27×27 mm fine-pitch flip-chip BGA with 0.8 mm pitch and thermal lid for improved power dissipation |
| Core Voltage | 1.2 V - defines power delivery network requirements and impacts dynamic/static power consumption |
Pinout & Package
The XC4VLX60-11FFG668I is housed in a 668-pin Fine-Pitch Flip-Chip BGA (FFG668) package with 448 user-configurable I/Os distributed across 16 I/O banks, each supporting independent voltage and termination settings. Power and ground pins are arranged per bank for noise isolation, and dedicated configuration, clock, and JTAG pins are fixed per Xilinx Virtex-4 pinout specification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for CLBs, RAM, and routing; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for I/O banks, DCMs, and configuration circuitry |
| VCCO | I/O output power | Bank-specific voltage (1.2–3.3 V) setting output drive strength and logic level standards |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reload sequence |
| DONE | Configuration status | Open-drain output indicating successful configuration completion and readiness for user mode |
| CLK0–CLK3 | Global clock inputs | Dedicated low-skew inputs feeding DCMs and global clock networks |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 19 I/O standards per bank including LVDS, SSTL-2, and HSTL - enables direct interfacing with DDR2 SDRAM, ADCs, and FPGAs without level shifters |
| Digital Clock Manager (DCM) | Provides frequency synthesis, phase shifting, and duty-cycle correction - eliminates need for external clock ICs in timing-critical subsystems |
| Partial Reconfiguration | Allows dynamic swapping of logic modules during operation - reduces system downtime and enables adaptive hardware acceleration |
| Power-Optimized Architecture | 90 nm process with multiple power gating modes - lowers active power by up to 40% versus previous generation at same performance |
| JTAG Boundary-Scan | IEEE 1149.1-compliant test access port - enables board-level diagnostics, in-system programming, and interconnect verification |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Configurable datapath accelerator implementing parallel filter banks and FFT engines synchronized to 100+ MHz sampling clocks. Use Value: 288 embedded multipliers enable simultaneous 128-point complex FFTs at 200 MS/s, reducing latency versus fixed-ASIC alternatives. | Use Scenario: High-speed image reconstruction pipeline in CT and MRI scanners. IC Role / Device Role / Timing Role: Co-processor managing raw sensor data ingestion, 3D back-projection, and DICOM compression before host CPU handoff. Use Value: 3.8 MB block RAM buffers full sinogram datasets, eliminating external DRAM bottlenecks and improving frame throughput by 35%. |
| Industrial Machine Vision | Avionics Data Concentrator |
Use Scenario: Sub-millisecond defect detection on automated PCB assembly lines using high-resolution line-scan cameras. IC Role / Device Role / Timing Role: Real-time pixel processing engine performing edge detection, blob analysis, and pass/fail decisioning at 1 Gpixel/s. Use Value: 448 user I/Os support concurrent Camera Link interfaces and PCIe Gen1 x4 host uplink, enabling zero-frame-loss acquisition. | Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation in flight control computers. IC Role / Device Role / Timing Role: Deterministic protocol bridge with time-stamped message queuing and error-checked forwarding across heterogeneous avionics networks. Use Value: DCM-based clock domain crossing ensures <10 ns timestamp jitter across 16 independent serial channels, meeting DO-254 Level A timing assurance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX80-11FF1148I | Higher logic density (80,384 CLBs), 384 multipliers, 5.2 MB RAM, 1148-pin FFG package | Supports larger algorithms requiring >60K logic cells or additional transceiver lanes (not present in LX60) | Choose when design scale exceeds XC4VLX60-11FFG668I capacity or requires more I/O bandwidth |
| XC5VLX50T-1FFG665I | Virtex-5 architecture, 50K logic cells, 192 multipliers, 2.5 MB RAM, 665-pin FFG package, integrated PCIe endpoint block | Includes hard IP for PCIe Gen1, lower static power, but lacks DCM phase-shift precision of Virtex-4 | Prefer for new PCIe-integrated designs where protocol offload justifies migration from Virtex-4 platform |
Compared with XC4VLX60-11FFG668I, the XC4VLX80-11FF1148I offers scalable logic and memory headroom within the same architecture, while the XC5VLX50T-1FFG665I introduces hardened PCIe but trades off DCM flexibility and legacy toolchain compatibility.
Availability
XC4VLX60-11FFG668I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, industrial machine vision, and avionics data concentrator applications requiring stable component supply across extended production lifecycles.
Supply support for XC4VLX60-11FFG668I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated workloads.
The Virtex-4 family, including XC4VLX60-11FFG668I, was originally designed for high-performance reconfigurable computing in aerospace, defense, and wired infrastructure where deterministic timing, I/O flexibility, and long-term availability are critical.
FAQ
What is the maximum operating frequency supported by the XC4VLX60-11FFG668I?
The XC4VLX60-11FFG668I is rated at speed grade -11, guaranteeing 1.1 ns CLB propagation delay. This enables synchronous system clock frequencies up to 500 MHz in typical designs with balanced routing and proper timing constraints. Actual achievable frequency depends on design topology, placement, and I/O standard selection - verified through Xilinx ISE timing analysis reports for XC4VLX60-11FFG668I.
Does the XC4VLX60-11FFG668I include built-in transceivers?
No, the XC4VLX60-11FFG668I belongs to the Virtex-4 LX (Logic eXtended) family and does not integrate RocketIO™ multi-gigabit transceivers. Transceiver capability is reserved for Virtex-4 FX (FX = FlexIO + transceivers) and SX (Signal Processing) variants. The XC4VLX60-11FFG668I relies on SelectIO™ for high-speed parallel I/O up to 840 Mbps per pin.
What configuration modes are supported by the XC4VLX60-11FFG668I?
The XC4VLX60-11FFG668I supports Master SelectMAP, Slave SelectMAP, and Serial PROM configuration modes. It accepts configuration bitstreams from external SPI or parallel PROMs, or via JTAG boundary-scan. Configuration is initiated after PROGRAM_B deassertion and validated by the DONE pin assertion - all defined in the official Virtex-4 Configuration User Guide for XC4VLX60-11FFG668I.
Is the XC4VLX60-11FFG668I RoHS compliant?
Yes, the XC4VLX60-11FFG668I is manufactured as a lead-free, RoHS-compliant device per EU Directive 2011/65/EU. The FFG668 package uses matte tin finish on solder balls and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) handling requirements.
How many Digital Clock Managers (DCMs) does the XC4VLX60-11FFG668I contain?
The XC4VLX60-11FFG668I integrates eight Digital Clock Managers (DCMs), each capable of frequency synthesis, phase shifting, and duty-cycle correction. These DCMs are distributed across the die to serve local clock domains and feed global clock networks - a key capability documented in the XC4VLX60-11FFG668I data sheet and essential for multi-clock domain synchronization.
XC4VLX60-11FFG668I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6656
- Number of Logic Elements/Cells:
- 59904
- Total RAM Bits:
- 2949120
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VLX60-11FFG668I FAQ
1.How can I place an order for XC4VLX60-11FFG668I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX60-11FFG668I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX60-11FFG668I reliable?
The price and inventory of XC4VLX60-11FFG668I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX60-11FFG668I is usually 5 days.
3.What payment methods are accepted for XC4VLX60-11FFG668I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX60-11FFG668I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX60-11FFG668I?
XC4VLX60-11FFG668I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX60-11FFG668I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX60-11FFG668I?
For technical support, including XC4VLX60-11FFG668I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX60-11FFG668I requirements.
6.How does Aetrix verify that XC4VLX60-11FFG668I is sourced from the original manufacturer or authorized distributors?
All XC4VLX60-11FFG668I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX60-11FFG668I meets industry standards.
7.What is the process for return or replacement of XC4VLX60-11FFG668I?
All XC4VLX60-11FFG668I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX60-11FFG668I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX60-11FFG668I part is unused and in its original packaging.
Return procedure for XC4VLX60-11FFG668I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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