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AMD XC4VSX25-10FF668I
- Part No.:
- XC4VSX25-10FF668I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VSX25-10FF668I.pdf
- Description:
- IC FPGA 320 I/O 668FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,853
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Product details
Overview
XC4VSX25-10FF668I from AMD is a Virtex-4 SX family FPGA with 24,192 logic cells, 1.25 Mb of block RAM, and 192 DSP48 slices, configured in a 668-pin Fine-Pitch Flip-Chip BGA (FF668) package for high-speed embedded processing applications in radar signal conditioning and protocol bridging.
For engineers reviewing the XC4VSX25-10FF668I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (448 user I/Os), speed grade (-10), extended industrial temperature range (-40°C to +100°C), and support for SelectIO standards including LVDS, SSTL, and HSTL.
Technical Context
The XC4VSX25-10FF668I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for multiply-accumulate operations, and flexible clock management using Digital Clock Managers (DCMs). It supports multi-gigabit transceivers only in higher-density Virtex-4 FX variants-not in the SX25 device.
Configuration is performed via Master SelectMAP or JTAG modes using external PROM or processor-controlled interfaces. The device requires separate VCCINT (1.2 V), VCCAUX (2.5 V), and VCCO (1.2–3.3 V) supplies, with bank-specific voltage assignment enforced per I/O standard compliance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,192 - total configurable logic resources for state machines, counters, and custom datapaths |
| Block RAM | 1.25 Mb - distributed across 192 x 18-kb RAMB16 blocks for FIFOs, buffers, and lookup tables |
| DSP Slices | 192 DSP48 - hardwired 18×18 multipliers with pre-adders and accumulators for real-time filtering |
| User I/O Pins | 448 - assignable across 24 I/O banks supporting mixed-voltage operation and slew-rate control |
| Speed Grade | -10 - guarantees timing closure at maximum operating frequencies per data sheet timing tables |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
| Package | FF668 - 668-pin flip-chip BGA with 1.0 mm pitch, thermal lid, and controlled impedance routing capability |
Pinout & Package
The XC4VSX25-10FF668I is housed in a 668-pin Fine-Pitch Flip-Chip BGA (FF668) package with thermal lid, 1.0 mm ball pitch, and 35 × 35 mm body size. Pin functions are organized into configuration, clock, I/O, power, and ground groups with bank-specific voltage domains.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master SelectMAP mode; must be driven externally at ≤50 MHz |
| DIN | Configuration Data Input | Serial data input for bitstream loading in Master SelectMAP; tied high when unused |
| INIT_B | Configuration Status Output | Open-drain active-low signal indicating configuration memory readiness or error condition |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| TDI/TDO/TMS/TCK | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for programming, debugging, and verification |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP48 Slices | 192 independent arithmetic units enabling parallel 18×18 multiplication with 48-bit accumulation per cycle |
| SelectIO Technology | Support for 19 I/O standards including LVDS differential pairs, SSTL-2 Class I, and HSTL Class I/III with programmable drive strength |
| Digital Clock Managers (DCMs) | Eight DCMs provide jitter-reduced clock synthesis, phase shifting, frequency doubling, and duty-cycle correction |
| Power-Down Modes | Per-bank I/O shutdown and global suspend modes reduce static current by up to 70% during idle states |
| Multi-Voltage I/O Banks | 24 independent banks allow simultaneous operation at 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O voltages |
Applications
| Radar Signal Processing | Industrial Protocol Bridge |
|---|---|
Use Scenario: Real-time pulse compression and CFAR detection in ground-based radar front-ends. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels while DCMs synchronize ADC sampling clocks and DAC reconstruction clocks. Use Value: 192 DSP48 slices enable concurrent 16-channel FFT processing at 65 MSPS with deterministic latency under 200 ns. | Use Scenario: Translation between Modbus RTU over RS-485 and EtherNet/IP on factory-floor PLC gateways. IC Role / Device Role / Timing Role: Configurable logic implements dual-protocol state machines and packet buffering; SelectIO supports both 2.5 V RS-485 transceivers and 3.3 V Ethernet PHY interfaces. Use Value: 448 user I/Os allow full-duplex RS-485 termination plus MII interface routing without external glue logic. |
| Avionics Data Concentrator | Test Equipment Pattern Generator |
Use Scenario: Aggregation and preprocessing of ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control computers. IC Role / Device Role / Timing Role: FPGA implements protocol-specific decoders, parity checkers, and time-stamped buffering; DCMs generate precise 1 MHz and 4 MHz timing references. Use Value: -40°C to +100°C operating range ensures reliable operation in unpressurized avionics bays without forced cooling. | Use Scenario: High-fidelity digital stimulus generation for ATE systems validating ASIC I/O timing margins. IC Role / Device Role / Timing Role: Logic fabric generates synchronized multi-channel patterns at 200+ MHz; I/O banks drive 1.8 V LVCMOS and 2.5 V SSTL loads simultaneously. Use Value: Programmable slew rate and output drive strength per pin enable precise edge rate control matching DUT load conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VSX35-10FF668I | Higher logic capacity (34,000 CLBs), same package and speed grade; larger die area and higher static power | Required for designs exceeding 24K CLB utilization or needing additional DSP48 slices | Select when XC4VSX25-10FF668I resource usage exceeds 90% in place-and-route |
| XCVU9P-2FLGA2104I | Virtex UltraScale+ device with 443K logic cells, 28 Gbps GTY transceivers, and DDR4 controller hard IP; incompatible pinout and configuration flow | Suitable for new designs requiring PCIe Gen3, 10G Ethernet, or high-bandwidth memory interfaces | Not a drop-in replacement; migration requires full RTL and PCB redesign |
Compared with XC4VSX25-10FF668I, the XC4VSX35-10FF668I offers headroom for logic growth within identical thermal and board layout constraints, while the XCVU9P-2FLGA2104I enables next-generation serial connectivity and memory bandwidth at the cost of complete re-architecture.
Availability
XC4VSX25-10FF668I is available at Aetrix Electronics and suitable for radar signal processing, industrial protocol bridging, avionics data concentration, and automated test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC4VSX25-10FF668I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing, graphics, and visualization technologies for data center, client, and embedded markets.
The Virtex-4 SX family was engineered for high-performance embedded signal processing and system integration, targeting applications demanding deterministic latency, mixed-signal interface flexibility, and industrial-grade reliability.
FAQ
What is the maximum supported I/O standard voltage for XC4VSX25-10FF668I?
The XC4VSX25-10FF668I supports I/O voltages from 1.2 V to 3.3 V across its 24 independently powered banks. Each bank must be assigned a single VCCO voltage, and compatible standards include LVCMOS, LVTTL, SSTL, HSTL, and LVDS. Voltage selection is fixed per bank at configuration time and cannot be dynamically changed during operation.
Does XC4VSX25-10FF668I include built-in transceivers for high-speed serial communication?
No, the XC4VSX25-10FF668I does not include RocketIO or any other multi-gigabit transceivers. Transceiver capability was introduced only in the Virtex-4 FX and Virtex-5 families. XC4VSX25-10FF668I relies on external PHY devices or parallel I/O for serial protocols such as PCI, RapidIO, or Gigabit Ethernet.
What configuration modes are supported by XC4VSX25-10FF668I?
The XC4VSX25-10FF668I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Master SelectMAP is commonly used for standalone boot from parallel PROM, while JTAG is preferred for in-system programming and debugging. Configuration mode is selected via MODE pins at power-up.
Is XC4VSX25-10FF668I RoHS compliant and lead-free?
Yes, the XC4VSX25-10FF668I is RoHS compliant and manufactured with lead-free flip-chip packaging. The FF668 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available in AMD's official product change notices.
How many Digital Clock Managers (DCMs) are available in XC4VSX25-10FF668I?
The XC4VSX25-10FF668I contains eight Digital Clock Managers (DCMs), each capable of frequency synthesis, phase shifting, duty-cycle correction, and clock doubling. These DCMs operate independently and can be cascaded or combined to generate multiple clock domains with sub-nanosecond skew control across the device fabric.
XC4VSX25-10FF668I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 SX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2560
- Number of Logic Elements/Cells:
- 23040
- Total RAM Bits:
- 2359296
- Number of I/O:
- 320
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VSX25-10FF668I FAQ
1.How can I place an order for XC4VSX25-10FF668I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VSX25-10FF668I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VSX25-10FF668I reliable?
The price and inventory of XC4VSX25-10FF668I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VSX25-10FF668I is usually 5 days.
3.What payment methods are accepted for XC4VSX25-10FF668I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VSX25-10FF668I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VSX25-10FF668I?
XC4VSX25-10FF668I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VSX25-10FF668I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VSX25-10FF668I?
For technical support, including XC4VSX25-10FF668I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VSX25-10FF668I requirements.
6.How does Aetrix verify that XC4VSX25-10FF668I is sourced from the original manufacturer or authorized distributors?
All XC4VSX25-10FF668I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VSX25-10FF668I meets industry standards.
7.What is the process for return or replacement of XC4VSX25-10FF668I?
All XC4VSX25-10FF668I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VSX25-10FF668I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VSX25-10FF668I part is unused and in its original packaging.
Return procedure for XC4VSX25-10FF668I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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