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AMD XC4VSX25-10FFG668C
- Part No.:
- XC4VSX25-10FFG668C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VSX25-10FFG668C.pdf
- Description:
- IC FPGA 320 I/O 668FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,890
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Product details
Overview
XC4VSX25-10FFG668C from AMD is a Virtex-4 SX family FPGA with 24,192 logic cells, 1.25 Mb of block RAM, and 192 DSP48 slices, configured in a 668-pin Fine-Pitch Flip-Chip BGA (FFG) package rated for commercial temperature range (0°C to 85°C). It targets high-performance embedded signal processing in radar baseband and software-defined radio systems.
For engineers reviewing the XC4VSX25-10FFG668C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (448 user I/Os), differential signaling support (LVDS, RSDS), clock management (four DCMs), and transceiver capability (none - this variant lacks RocketIO).
Technical Context
The XC4VSX25-10FFG668C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated arithmetic units (DSP48), and synchronous block RAM. It supports SelectIO standards including LVCMOS, LVTTL, LVDS, and RSDS across its 448 user I/O pins.
It integrates four Digital Clock Managers (DCMs) for phase alignment, duty-cycle correction, and frequency synthesis, but does not include high-speed serial transceivers - distinguishing it from Virtex-4 FX and LX variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,192 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 1.25 Mb - provides on-chip memory for FIFOs, buffers, or coefficient storage without external memory |
| DSP Slices | 192 × DSP48 - enables parallel multiply-accumulate operations for real-time filtering and FFTs |
| User I/O Pins | 448 - supports wide parallel interfaces, multi-channel ADC/DAC control, and board-level interconnect |
| DCMs | 4 - delivers jitter-tolerant clock synthesis and skew management for synchronous subsystems |
| Max I/O Speed | 840 Mbps (LVDS) - enables high-throughput data capture from high-speed ADCs or video sources |
| Operating Temp | 0°C to +85°C - qualifies for commercial and extended industrial ambient environments |
Pinout & Package
Package: 668-pin Fine-Pitch Flip-Chip BGA (FFG), 27×27 mm, 1.0 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration, clocking, and SelectIO circuitry |
| VCCO | I/O bank power | Programmable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface design |
| CONFIG_IO | Configuration I/O | Dedicated pins for JTAG, Master SelectMAP, or Slave Serial configuration modes |
| CLKIN | DCM input clock | Accepts single-ended or differential clocks up to 500 MHz for DCM-based timing control |
| INIT_B | Configuration status | Open-drain output indicating configuration success/failure during startup |
Key Features
| Feature | Design Value |
|---|---|
| ASMBL Architecture | Modular CLB, RAM, and DSP tile layout enabling predictable timing closure and floorplanning |
| SelectIO Technology | Per-bank voltage and standard selection supports concurrent LVDS, LVTTL, and SSTL interfaces |
| Digital Clock Manager (DCM) | Four independent DCMs provide zero-delay buffering, frequency synthesis, and phase shifting |
| Power-Down Mode | Reduces static power by disabling unused CLBs and I/O banks during idle periods |
| MultiBoot Configuration | Supports up to four independent bitstreams stored in external flash for field-upgradable firmware |
Applications
| Radar Baseband Processing | Software-Defined Radio (SDR) |
|---|---|
Use Scenario: Real-time pulse compression and Doppler processing in ground-based surveillance radar systems. IC Role / Device Role / Timing Role: Configurable digital signal processor implementing adaptive FIR filters and FFT engines synchronized to system clock domains. Use Value: 192 DSP48 slices enable simultaneous multi-channel correlation at >100 MSPS sample rates without external co-processors. | Use Scenario: Wideband channelization and modulation/demodulation in military HF/VHF/UHF radios. IC Role / Device Role / Timing Role: Reconfigurable baseband engine handling multiple waveforms (e.g., SINCGARS, HAVEQUICK) under dynamic mission profiles. Use Value: 448 user I/Os and LVDS support allow direct connection to dual 16-bit 130-MSPS ADCs and DACs for full-duplex operation. |
| Medical Imaging Backend | Industrial Machine Vision Controller |
Use Scenario: Real-time image reconstruction pipeline in portable ultrasound systems using beamforming data. IC Role / Device Role / Timing Role: High-throughput data aggregator and preprocessor feeding GPU or ARM host with filtered, aligned frame data. Use Value: 1.25 Mb block RAM serves as line buffer and histogram memory, eliminating external SRAM for sub-100 µs latency paths. | Use Scenario: High-speed inspection of PCB assemblies using multi-camera synchronization and defect classification logic. IC Role / Device Role / Timing Role: Deterministic I/O controller managing camera triggers, lighting strobes, and encoder feedback with sub-microsecond jitter. Use Value: Four DCMs ensure precise phase alignment across 12+ camera sensors and motion axes without external clock fanout ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VSX35-10FFG668C | 34,560 logic cells, 1.8 Mb block RAM, 256 DSP48 slices - larger resource footprint | Supports more complex algorithms (e.g., synthetic aperture radar imaging) requiring >25K logic cells | Select when algorithm complexity exceeds XC4VSX25-10FFG668C capacity; same package enables drop-in upgrade path |
| XC5VLX30-1FF676C | Virtex-5 architecture, 30K logic cells, 1.2 Mb block RAM, 64 DSP48 slices, no transceivers | Lacks DSP density for high-throughput filtering; offers improved routing and lower static power | Prefer for lower-power deterministic control tasks where DSP throughput is secondary to timing predictability |
Compared with XC4VSX25-10FFG668C, XC4VSX35-10FFG668C delivers higher computational headroom within identical thermal and board space constraints, while XC5VLX30-1FF676C trades DSP density for architectural efficiency and reduced leakage - making each suitable for distinct stages of algorithm maturity and power budgeting.
Availability
XC4VSX25-10FFG668C is available at Aetrix Electronics and suitable for radar baseband processing, software-defined radio development, and medical imaging backend systems requiring stable component supply over extended production lifecycles.
Supply support for XC4VSX25-10FFG668C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (formerly Xilinx) designs programmable logic devices for high-performance computing, aerospace, and communications infrastructure.
The Virtex-4 SX family was engineered specifically for embedded signal processing applications demanding balanced logic, memory, and arithmetic resources - not general-purpose computation or serial connectivity.
FAQ
Does XC4VSX25-10FFG668C include high-speed serial transceivers?
No. The XC4VSX25-10FFG668C belongs to the Virtex-4 SX family and contains no RocketIO transceivers. It supports only parallel and low-voltage differential signaling (LVDS/RSDS) up to 840 Mbps per I/O pair. For transceiver capability, consider Virtex-4 FX or later-generation families. This limitation is documented in the XC4VSX25-10FFG668C data sheet revision 2.0, section 1.2.
What configuration modes are supported by XC4VSX25-10FFG668C?
The XC4VSX25-10FFG668C supports Master SelectMAP, Slave SelectMAP, Slave Serial, and JTAG configuration modes. Configuration is initiated via dedicated CONFIG_IO pins, and bitstream loading can be performed from external SPI flash, PROM, or host processor. MultiBoot capability allows up to four independent configurations to be stored and selected dynamically in the field.
Is XC4VSX25-10FFG668C pin-compatible with other Virtex-4 FFG668 packages?
Yes - the XC4VSX25-10FFG668C shares the same 668-pin FFG package footprint and ball map with other Virtex-4 devices in the FFG668 variant, including XC4VLX25, XC4VSX35, and XC4VFX20. Power and configuration pin assignments are consistent, enabling hardware reuse across performance tiers within the Virtex-4 family.
What is the maximum operating frequency of the DCMs in XC4VSX25-10FFG668C?
The Digital Clock Managers (DCMs) in the XC4VSX25-10FFG668C accept input clocks up to 500 MHz and generate output frequencies up to 1 GHz depending on multiplication/division settings. Each DCM supports fine-grained phase shifting (±1 ns resolution), duty-cycle correction, and spread-spectrum clocking - critical for meeting setup/hold timing in high-speed I/O interfaces.
Does XC4VSX25-10FFG668C support partial reconfiguration?
No. Partial reconfiguration is not supported in the Virtex-4 architecture. The XC4VSX25-10FFG668C requires full bitstream reload for any functional change. Dynamic reconfiguration capabilities were introduced in Virtex-5 and later families. Designers requiring runtime adaptation must implement modular logic partitioning and use MultiBoot to switch between pre-compiled configurations.
XC4VSX25-10FFG668C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 SX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2560
- Number of Logic Elements/Cells:
- 23040
- Total RAM Bits:
- 2359296
- Number of I/O:
- 320
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VSX25-10FFG668C FAQ
1.How can I place an order for XC4VSX25-10FFG668C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VSX25-10FFG668C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VSX25-10FFG668C reliable?
The price and inventory of XC4VSX25-10FFG668C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VSX25-10FFG668C is usually 5 days.
3.What payment methods are accepted for XC4VSX25-10FFG668C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VSX25-10FFG668C transactions.
Note: Certain payment methods may incur a processing fee.
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XC4VSX25-10FFG668C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VSX25-10FFG668C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VSX25-10FFG668C?
For technical support, including XC4VSX25-10FFG668C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VSX25-10FFG668C requirements.
6.How does Aetrix verify that XC4VSX25-10FFG668C is sourced from the original manufacturer or authorized distributors?
All XC4VSX25-10FFG668C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VSX25-10FFG668C meets industry standards.
7.What is the process for return or replacement of XC4VSX25-10FFG668C?
All XC4VSX25-10FFG668C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VSX25-10FFG668C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VSX25-10FFG668C part is unused and in its original packaging.
Return procedure for XC4VSX25-10FFG668C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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