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AMD XC4VSX25-11FF668I
- Part No.:
- XC4VSX25-11FF668I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VSX25-11FF668I.pdf
- Description:
- IC FPGA 320 I/O 668FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,956
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Product details
Overview
XC4VSX25-11FF668I from AMD is a Virtex-4 SX family FPGA with 24,192 logic cells, 1.25 Mb of block RAM, and 192 DSP48 slices, configured in a 668-pin Fine-Pitch Flip-Chip BGA (FF668) package for high-performance embedded processing and digital signal acceleration in radar and communications baseband systems.
For engineers reviewing the XC4VSX25-11FF668I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (448 user I/Os), speed grade (-11), extended industrial temperature range (-40°C to +100°C), and support for SelectIO standards including LVDS, SSTL, and HSTL.
Technical Context
The XC4VSX25-11FF668I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for multiply-accumulate operations, and flexible clock management using Digital Clock Managers (DCMs). It supports multi-gigabit transceivers only in FX and FX/LX families-not in SX series-so this device relies on parallel I/O for high-speed data interfaces.
Configuration is performed via Master SelectMAP or JTAG mode using external PROM or processor-controlled interface. The -11 speed grade guarantees maximum clock frequencies up to 500 MHz for internal logic and 800 Mbps for DDR2 SDRAM interfaces under industrial temperature conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,192 - total programmable LUT/flip-flop pairs for combinatorial and sequential logic implementation |
| Block RAM | 1.25 Mb - distributed across 192 x 18-Kb dual-port RAM blocks supporting true dual-port or FIFO operation |
| DSP48 Slices | 192 - hardwired 18×18-bit multiplier + 48-bit accumulator units for deterministic arithmetic pipelines |
| User I/O Pins | 448 - configurable as single-ended or differential I/O with voltage and standard flexibility per bank |
| Speed Grade | -11 - guarantees timing closure at 500 MHz internal logic frequency and 800 Mbps DDR2 interface rate |
| Operating Temperature | -40°C to +100°C - qualified for extended industrial environments without derating |
| Package | FF668 - 668-pin fine-pitch flip-chip BGA with 1.0 mm pitch and 27×27 mm body size |
Pinout & Package
The XC4VSX25-11FF668I is housed in a 668-pin Fine-Pitch Flip-Chip BGA (FF668) package with 448 user-configurable I/Os distributed across 16 I/O banks, each supporting independent VCCO and VREF settings. Power delivery includes dedicated VCCINT (1.2 V), VCCAUX (2.5 V), and VCCO (1.2–3.3 V) supplies.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master SelectMAP mode; requires clean 0–50 MHz clock source |
| DIN | Configuration Data Input | Serial data input for bitstream loading in Master SelectMAP mode; synchronous to CCLK |
| INIT_B | Configuration Status Output | Open-drain active-low signal indicating configuration status and memory initialization completion |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test and debug interface supporting programming, verification, and runtime visibility |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP48 slices | 192 hardwired arithmetic units enabling cycle-accurate FIR filtering and FFT stage pipelining without LUT resource consumption |
| SelectIO technology | Per-bank I/O voltage and standard independence allows mixed-voltage interfacing (e.g., 3.3 V CPU + 1.8 V ADC) |
| Digital Clock Managers (DCMs) | Eight DCMs provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication/division for precise timing control |
| Block RAM flexibility | 192 × 18-Kb RAM blocks support true dual-port, simple dual-port, or FIFO configurations with programmable write depth |
| Extended temperature operation | Full functionality maintained from –40°C to +100°C without performance degradation or timing margin loss |
Applications
| Radar Signal Processing | Wireless Baseband Acceleration |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and CFAR detection in ground-based surveillance radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical beamforming and matched filtering kernels while DCMs synchronize ADC sampling clocks and DAC reconstruction clocks. Use Value: 192 DSP48 slices enable parallel 16-channel Doppler FFTs at 200 MSPS input rate with deterministic latency under 5 µs. | Use Scenario: LTE-Advanced physical layer acceleration for small-cell base stations handling 4×4 MIMO OFDM modulation/demodulation. IC Role / Device Role / Timing Role: Configurable logic implements channel estimation, equalization, and turbo decoding; SelectIO interfaces directly with RFIC and memory controllers. Use Value: 448 user I/Os support simultaneous 4-lane DDR2 memory bus, 2× RGMII Ethernet, and 8-lane CPRI interface without glue logic. |
| Industrial Image Acquisition | Avionics Data Concentration |
Use Scenario: High-speed line-scan camera interface in automated optical inspection (AOI) systems requiring pixel-level timestamping and defect classification. IC Role / Device Role / Timing Role: FPGA captures 12-bit 100 MHz parallel image streams, performs real-time histogram analysis, and formats data for PCIe host transfer. Use Value: 1.25 Mb block RAM enables full-frame buffering of 2048×2048@12-bit images at 60 fps with zero frame drop. | Use Scenario: ARINC 429 and MIL-STD-1553B bus bridging in flight control computers consolidating sensor and actuator data. IC Role / Device Role / Timing Role: Soft-core microcontroller plus protocol engines implement dual-redundant bus controllers with hardware timestamping and error injection testing. Use Value: Extended temperature rating ensures uninterrupted operation during thermal cycling in unpressurized avionics bays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VSX35-11FF668I | 34,560 logic cells, 1.8 Mb block RAM, 256 DSP48 slices - larger capacity but same FF668 package and pinout | Supports more complex algorithms (e.g., full-bandwidth 5G NR channel emulation) requiring >25K LUTs | Select when design exceeds XC4VSX25-11FF668I resource utilization by >15% in post-place-and-route analysis |
| XCVU3P-2FFVA1156I | Virtex UltraScale+ device with 331K logic cells, 27.5 Mb BRAM, 1152 DSP slices, and integrated 10.3125 Gbps GTY transceivers | Enables serial high-speed interfaces (PCIe Gen3, 10G Ethernet) not supported by XC4VSX25-11FF668I | Choose for new designs requiring higher bandwidth, lower power per MAC, or migration path beyond Virtex-4 lifecycle |
Compared with XC4VSX25-11FF668I, the XC4VSX35-11FF668I offers direct pin-compatible scalability within the same footprint and thermal envelope, while the XCVU3P-2FFVA1156I provides architectural modernization with transceivers and hardened IP-but requires PCB redesign and toolchain migration.
Availability
XC4VSX25-11FF668I is available at Aetrix Electronics and suitable for radar signal processing, wireless baseband acceleration, and industrial image acquisition requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC4VSX25-11FF668I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded applications.
The Virtex-4 SX family was designed specifically for high-performance digital signal processing applications requiring tightly coupled logic, memory, and arithmetic resources in a single programmable platform.
FAQ
What is the maximum operating frequency of the XC4VSX25-11FF668I?
The XC4VSX25-11FF668I carries the -11 speed grade, guaranteeing internal logic operation up to 500 MHz and DDR2 memory interface rates up to 800 Mbps under extended industrial temperature conditions (–40°C to +100°C). This rating is verified through silicon characterization and static timing analysis across process corners.
Does the XC4VSX25-11FF668I support high-speed serial transceivers?
No, the XC4VSX25-11FF668I does not include built-in multi-gigabit transceivers. Serial high-speed connectivity must be implemented externally using discrete SerDes ICs or parallel I/O with source-synchronous timing. Transceiver capability was introduced in later Virtex families (Virtex-5 FX and beyond).
What configuration modes are supported by the XC4VSX25-11FF668I?
The XC4VSX25-11FF668I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Master SelectMAP uses an internal oscillator to drive CCLK and load bitstream from external PROM; JTAG is used for debugging, boundary scan, and in-system programming of the XC4VSX25-11FF668I.
How many DSP48 slices does the XC4VSX25-11FF668I contain?
The XC4VSX25-11FF668I contains 192 dedicated DSP48 slices-each comprising a 18×18-bit signed multiplier, 48-bit accumulator, and pipeline registers. These slices operate independently and can be cascaded to implement wide-bit arithmetic or multi-stage filters without consuming general-purpose logic resources.
Is the XC4VSX25-11FF668I RoHS compliant and lead-free?
Yes, the XC4VSX25-11FF668I is manufactured in a lead-free, RoHS-compliant process. The FF668 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements for surface-mount assembly.
XC4VSX25-11FF668I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 SX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2560
- Number of Logic Elements/Cells:
- 23040
- Total RAM Bits:
- 2359296
- Number of I/O:
- 320
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VSX25-11FF668I FAQ
1.How can I place an order for XC4VSX25-11FF668I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VSX25-11FF668I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VSX25-11FF668I reliable?
The price and inventory of XC4VSX25-11FF668I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VSX25-11FF668I is usually 5 days.
3.What payment methods are accepted for XC4VSX25-11FF668I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VSX25-11FF668I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VSX25-11FF668I?
XC4VSX25-11FF668I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VSX25-11FF668I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VSX25-11FF668I?
For technical support, including XC4VSX25-11FF668I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VSX25-11FF668I requirements.
6.How does Aetrix verify that XC4VSX25-11FF668I is sourced from the original manufacturer or authorized distributors?
All XC4VSX25-11FF668I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VSX25-11FF668I meets industry standards.
7.What is the process for return or replacement of XC4VSX25-11FF668I?
All XC4VSX25-11FF668I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VSX25-11FF668I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VSX25-11FF668I part is unused and in its original packaging.
Return procedure for XC4VSX25-11FF668I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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