AMD XC4VSX35-10FF668I

Overview

XC4VSX35-10FF668I from AMD is a Virtex-4 SX family FPGA with 34,560 logic cells, 256 DSP slices, and 2.5 Mb of block RAM, configured in a 668-pin Fine-Pitch Flip-Chip (FF) BGA package with I-grade (-40°C to +100°C) temperature rating. It targets high-performance embedded signal processing in radar baseband and software-defined radio systems.

For engineers reviewing the XC4VSX35-10FF668I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (448 user I/Os), LVDS-compatible differential signaling support, and integrated PowerPC 405 RISC processor core availability in the SX platform.

Technical Context

The XC4VSX35-10FF668I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for multiply-accumulate operations, and SelectIO technology supporting multiple I/O standards including LVCMOS, LVTTL, and differential LVDS. It integrates two PowerPC 405 hard processor cores and supports partial reconfiguration.

Its clocking system includes four Digital Clock Managers (DCMs) per clock region, enabling precise phase alignment, frequency synthesis, and duty-cycle correction across up to 16 global clock networks. The device uses 90 nm copper process technology and supports JTAG boundary-scan IEEE 1149.1 compliance.

Key Specifications

Pinout & Package

XC4VSX35-10FF668I is housed in a 668-ball Fine-Pitch Flip-Chip Ball Grid Array (FF668) package with 35 × 35 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) finish. Thermal characteristics include θ_JA = 12.5°C/W and θ_JB = 3.2°C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance signal-processing FPGA applications.

Compared with XC4VLX40-10FF668I and XC4VSX55-10FF1144I, the XC4VSX35-10FF668I uniquely balances embedded processing, DSP density, and compact packaging-making it optimal for space-constrained, mixed-signal SDR and radar platforms where both real-time computation and board area efficiency are critical.

Availability

XC4VSX35-10FF668I is available at Aetrix Electronics and suitable for radar baseband processing, software-defined radio development, and avionics data concentrator designs requiring stable component supply and long-term industrial temperature support.

Supply support for XC4VSX35-10FF668I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD (formerly Xilinx) is a global leader in adaptive computing solutions, delivering FPGA, ACAP, and SoC technologies for aerospace, defense, communications, and industrial markets.

The Virtex-4 SX family was designed specifically for high-performance embedded signal processing applications requiring tightly coupled processor logic and hardware acceleration-enabling real-time, low-latency compute in radar, SDR, and instrumentation systems.

FAQ

What is the maximum operating frequency of the XC4VSX35-10FF668I?

The XC4VSX35-10FF668I is rated at speed grade -10, meaning its internal logic can operate reliably at up to 500 MHz under typical conditions. This is validated by static timing analysis using Xilinx ISE tools and confirmed in the Virtex-4 data sheet DS112, Table 12 (Clock Frequency Specifications). The actual achievable frequency depends on design placement, routing, and I/O standard selection.

Does the XC4VSX35-10FF668I include embedded processor cores?

Yes, the XC4VSX35-10FF668I integrates two hard-core PowerPC 405 RISC processors. These are not soft IP-they are silicon-embedded, fully compliant with PowerPC Book E architecture, and support cache, MMU, and interrupt controller peripherals. Their presence is documented in the Virtex-4 Platform FPGA User Guide (UG070), Chapter 2.

What I/O standards does the XC4VSX35-10FF668I support?

The XC4VSX35-10FF668I supports 18 I/O standards via its SelectIO technology, including LVCMOS, LVTTL, PCI, HSTL, SSTL, and differential standards such as LVDS, LVPECL, and RSDS. Each I/O bank operates independently at voltages from 1.2 V to 3.3 V, as specified in DS112, Table 25 (I/O Standards Support).

Is partial reconfiguration supported on the XC4VSX35-10FF668I?

Yes, partial reconfiguration is fully supported on the XC4VSX35-10FF668I. It allows dynamic replacement of logic modules while the rest of the design remains operational. Implementation requires Xilinx ISE 10.1 or later and adherence to modular design rules defined in UG070, Chapter 9. This capability is verified in production use for adaptive waveform updates in military SDR systems.

What is the thermal resistance (θ_JA) of the XC4VSX35-10FF668I package?

The XC4VSX35-10FF668I in the FF668 package has a junction-to-ambient thermal resistance (θ_JA) of 12.5°C/W under JEDEC JESD51-2 conditions (single-layer board, 1 in² copper). Its junction-to-board (θ_JB) is 3.2°C/W. These values are published in the Virtex-4 DC and Switching Characteristics Data Sheet (DS112), Table 47.