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AMD XC4VSX35-10FFG668C
- Part No.:
- XC4VSX35-10FFG668C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VSX35-10FFG668C.pdf
- Description:
- IC FPGA 448 I/O 668FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,140
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Product details
Overview
XC4VSX35-10FFG668C from AMD is a Virtex-4 SX family FPGA with 34,560 logic cells, 256 DSP slices, and 2.5 Mb of block RAM, configured in a 668-pin Fine-Pitch Flip-Chip BGA (FFG) package with 1.2 V core voltage. It targets high-performance embedded signal processing in radar baseband and software-defined radio systems.
For engineers reviewing the XC4VSX35-10FFG668C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (448 user I/Os), LVDS support (up to 48 differential pairs), clock management (four DCMs), and transceiver capability (no built-in SerDes).
Technical Context
The XC4VSX35-10FFG668C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for multiply-accumulate operations, and distributed memory resources. It supports SelectIO standards including LVCMOS, LVTTL, HSTL, and LVDS across its 448 user I/O pins.
Timing control is managed by four Digital Clock Managers (DCMs) providing phase shifting, frequency synthesis, and duty cycle correction. The device lacks integrated multi-gigabit transceivers - serial interface functions require external PHY or parallel I/O implementation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 34,560 - determines maximum combinational/sequential logic capacity for algorithm partitioning |
| DSP Slices | 256 - enables concurrent 18×18-bit multiply-accumulate operations per clock cycle |
| Block RAM | 2.5 Mb - supports large on-chip data buffering for FFT, filtering, and frame storage |
| User I/O Pins | 448 - provides high-density parallel interface connectivity for ADC/DAC, memory, and custom ASIC glue logic |
| DCMs | 4 - delivers jitter-tolerant clock synthesis and phase alignment for multi-clock domain designs |
| Core Voltage | 1.2 V - defines power delivery network requirements and thermal dissipation profile |
Pinout & Package
Package: 668-pin Fine-Pitch Flip-Chip BGA (FFG), 27×27 mm, 1.0 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.2 V to CLBs, DSP slices, and internal routing |
| VCCAUX | Auxiliary power supply | Supplies 2.5 V to configuration circuitry, DCMs, and SelectIO banks |
| VCCO | I/O bank power | Configurable per bank (1.2–3.3 V) to match interfaced peripheral voltage levels |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and initialization completion |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP48 slices | Hardwired 18×18-bit multipliers with pipeline registers enable deterministic MAC throughput at 500+ MHz |
| SelectIO technology | Per-bank I/O voltage control supports mixed-voltage system interfacing without level shifters |
| Digital Clock Manager (DCM) | Four independent DCMs provide zero-delay buffering, frequency doubling, and ±90° phase shift for timing-critical paths |
| Block RAM configuration | Configurable as 16Kb dual-port RAM, 32Kb single-port RAM, or 18Kb ROM to match algorithm memory access patterns |
Applications
| Radar Baseband Processing | Software-Defined Radio (SDR) |
|---|---|
Use Scenario: Real-time pulse compression and Doppler beamforming in ground-based surveillance radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FIR filter chains and FFT engines synchronized to 100 MHz system clock with sub-cycle latency control. Use Value: 256 DSP48 slices deliver >128 GMAC/s computational density while 2.5 Mb block RAM buffers full chirp waveforms for coherent integration. | Use Scenario: Multi-band, multi-standard wireless base station transceiver supporting GSM, WCDMA, and LTE waveforms. IC Role / Device Role / Timing Role: Configurable digital front-end handles channelization, up/down-conversion, and crest factor reduction prior to DAC/ADC interface. Use Value: 448 user I/Os enable parallel connection to multiple RFICs and memory controllers; four DCMs manage independent sample clocks for each air interface. |
| Medical Imaging Beamformer | High-Speed Data Acquisition |
Use Scenario: Ultrasound beamforming engine acquiring and focusing echo signals from 128-channel transducer arrays. IC Role / Device Role / Timing Role: Time-aligned delay-and-sum processing across channels using fixed-point arithmetic and low-latency routing. Use Value: Deterministic timing from DCM-controlled clocks ensures <100 ps inter-channel skew; block RAM stores calibration coefficients for real-time compensation. | Use Scenario: 16-bit, 250 MSPS digitizer capturing transient events in power electronics fault analysis. IC Role / Device Role / Timing Role: Interface controller synchronizes ADC parallel outputs, performs real-time decimation, and streams data to DDR2 memory via dedicated bus logic. Use Value: LVDS-capable I/O banks accept 250 MHz double-data-rate inputs; 34,560 logic cells implement custom trigger state machines and packetization logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VSX55-11FFG1148C | Higher logic capacity (55,296 cells), more DSP slices (384), larger package (1148-pin FFG) | Supports wider data paths and deeper pipeline stages in radar CFAR detection algorithms | Choose when algorithm complexity exceeds XC4VSX35-10FFG668C resource utilization by >20% |
| XCVU9P-L2FLGA2104E | UltraScale architecture, 568,800 logic cells, 2,592 DSP slices, integrated GTY transceivers (32.75 Gbps) | Enables JESD204B-compliant high-speed ADC/DAC links and PCIe Gen3 host interface | Choose for new designs requiring serial connectivity or >10× compute scaling; not pin-compatible |
Compared with XC4VSX35-10FFG668C, XC4VSX55-11FFG1148C offers scalable resources within the same Virtex-4 SX family and toolchain, while XCVU9P-L2FLGA2104E represents a generational leap in bandwidth and integration - requiring full RTL and PCB redesign but enabling next-generation SDR and phased-array systems.
Availability
XC4VSX35-10FFG668C is available at Aetrix Electronics and suitable for radar baseband processing, software-defined radio development, and medical ultrasound beamforming requiring stable component supply across extended production lifecycles.
Supply support for XC4VSX35-10FFG668C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for high-performance computing, AI acceleration, and embedded systems.
The Virtex-4 SX family was engineered for compute-intensive digital signal processing in defense, aerospace, and communications infrastructure where deterministic latency and hardware-reconfigurable logic are critical.
FAQ
What is the maximum operating frequency of the XC4VSX35-10FFG668C?
The XC4VSX35-10FFG668C is speed-grade -10, meaning its guaranteed maximum clock frequency for internal logic is 500 MHz under typical conditions. This applies to paths through CLBs and DSP48 slices; actual system-level timing depends on design constraints, placement, and routing. The XC4VSX35-10FFG668C datasheet specifies setup/hold times and propagation delays referenced to this grade.
Does the XC4VSX35-10FFG668C support JTAG boundary-scan testing?
Yes, the XC4VSX35-10FFG668C includes IEEE 1149.1-compliant JTAG TAP controller for configuration, debugging, and boundary-scan testing. Pins TCK, TMS, TDI, and TDO are dedicated for this function and operate at 3.3 V. The XC4VSX35-10FFG668C supports INTEST, EXTEST, and SAMPLE/PRELOAD instructions per the standard.
Can the XC4VSX35-10FFG668C be configured via SPI flash memory?
Yes, the XC4VSX35-10FFG668C supports master serial configuration mode using industry-standard SPI flash devices (e.g., Micron, Spansion). Configuration occurs automatically on power-up when MODE pins are set to 01. The XC4VSX35-10FFG668C reads the bitstream sequentially from address 0x000000 and supports dual/quad SPI modes depending on flash vendor support.
What is the purpose of the VCCAUX supply on the XC4VSX35-10FFG668C?
The VCCAUX supply powers auxiliary circuitry including configuration logic, Digital Clock Managers (DCMs), and SelectIO banks' input/output buffers. It must be regulated at 2.5 V ±3% and decoupled locally. The XC4VSX35-10FFG668C requires stable VCCAUX to ensure reliable configuration startup and jitter-free clock synthesis from its four DCMs.
Is the XC4VSX35-10FFG668C RoHS-compliant and lead-free?
Yes, the XC4VSX35-10FFG668C is RoHS-compliant and manufactured with lead-free flip-chip packaging. The "G" in FFG668C denotes green (halogen-free) and lead-free construction per JEDEC J-STD-020 and IPC/JEDEC J-STD-033. The XC4VSX35-10FFG668C meets EU RoHS Directive 2011/65/EU and is suitable for commercial and industrial applications requiring environmental compliance.
XC4VSX35-10FFG668C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 SX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3840
- Number of Logic Elements/Cells:
- 34560
- Total RAM Bits:
- 3538944
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VSX35-10FFG668C FAQ
1.How can I place an order for XC4VSX35-10FFG668C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VSX35-10FFG668C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VSX35-10FFG668C reliable?
The price and inventory of XC4VSX35-10FFG668C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VSX35-10FFG668C is usually 5 days.
3.What payment methods are accepted for XC4VSX35-10FFG668C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VSX35-10FFG668C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VSX35-10FFG668C?
XC4VSX35-10FFG668C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VSX35-10FFG668C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VSX35-10FFG668C?
For technical support, including XC4VSX35-10FFG668C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VSX35-10FFG668C requirements.
6.How does Aetrix verify that XC4VSX35-10FFG668C is sourced from the original manufacturer or authorized distributors?
All XC4VSX35-10FFG668C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VSX35-10FFG668C meets industry standards.
7.What is the process for return or replacement of XC4VSX35-10FFG668C?
All XC4VSX35-10FFG668C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VSX35-10FFG668C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VSX35-10FFG668C part is unused and in its original packaging.
Return procedure for XC4VSX35-10FFG668C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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