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AMD XC4VSX35-10FFG668I

Part No.:
XC4VSX35-10FFG668I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
668-BBGA, FCBGA
Datasheet:
AetrixXC4VSX35-10FFG668I.pdf
Description:
IC FPGA 448 I/O 668FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,372

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Product details

Overview

XC4VSX35-10FFG668I from AMD is a Virtex-4 SX family FPGA with 34,560 logic cells, 2.5 Gbps RocketIO transceivers, and embedded PowerPC 405 processors. It features 352 I/O pins in a 668-pin Fine-Pitch Flip-Chip BGA package and targets high-performance digital signal processing and embedded computing applications.

For engineers reviewing the XC4VSX35-10FFG668I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed, embedded processor availability, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), and -10 speed grade timing performance.

Technical Context

The XC4VSX35-10FFG668I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (2,088 kbits), and dedicated DSP48 slices for arithmetic-intensive tasks. Its dual-processor subsystem includes two PowerPC 405 cores with on-chip cache and PLB bus interface.

RocketIO transceivers support serial protocols including PCI Express Gen1 and Serial RapidIO at up to 2.5 Gbps per lane. The device uses SelectIO technology with programmable I/O standards and differential signaling support (LVDS, RSDS, HSTL).

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells34,560 - determines maximum combinational and sequential logic capacity for custom digital design implementation
Block RAM2,088 kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external memory interface
RocketIO Transceivers8 channels × 2.5 Gbps - enables high-speed serial interconnect for backplane or chip-to-chip communication
Embedded Processors2× PowerPC 405 - supports real-time control, boot management, and co-processing alongside programmable logic
I/O Pins352 - supports wide parallel interfaces, multi-standard signaling, and board-level connectivity flexibility
Speed Grade-10 - guarantees worst-case timing performance at 10% faster than -11 grade, enabling higher clock frequencies
Package668-pin FFG (Fine-Pitch Flip-Chip BGA) - 27×27 mm body, 1.0 mm pitch, RoHS-compliant, requires controlled impedance PCB layout

Pinout & Package

XC4VSX35-10FFG668I is housed in a 668-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 352 user I/Os, 8 RocketIO transceiver pairs, dedicated configuration and JTAG pins, and multiple VCCINT/VCCAUX/VCCO power domains.

Pin/TerminalCircuit RoleDesign Meaning
G18MRCC_L15PDedicated multi-region clock input (positive) for global clock distribution network
H19MRCC_L15NDedicated multi-region clock input (negative) - must be used as differential pair with G18
A10MGTCLKA0PPrimary transceiver reference clock input (positive) for RocketIO bank A
A9MGTCLKA0NPrimary transceiver reference clock input (negative) - differential pair with A10
P2PROGRAM_BActive-Low asynchronous configuration initiation signal - pulls low to reset and reload bitstream
T1INIT_BOpen-drain status output indicating configuration completion or error condition
V2CCLKConfiguration clock input - drives internal configuration logic during master serial mode

Key Features

FeatureDesign Value
Dual PowerPC 405 CoresEnables asymmetric multiprocessing: one core for real-time OS tasks, the other for application-specific firmware execution
8 RocketIO TransceiversSupports protocol-agnostic serial links up to 2.5 Gbps - eliminates need for external SerDes in PCIe Gen1 endpoint designs
SelectIO TechnologyProgrammable I/O standards (LVCMOS, LVTTL, SSTL, HSTL, LVDS) per bank - simplifies interface to mixed-voltage peripherals
DSP48 Slices128 dedicated 18×18 multipliers with pipeline registers - accelerates FIR filtering, FFT, and matrix operations in hardware
Partial Reconfiguration SupportAllows dynamic logic module swapping without full device reset - critical for adaptive radio and runtime protocol switching

Applications

Radar Signal ProcessingMedical Imaging Backend

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels; PowerPC cores manage system control and data packaging.

Use Value: On-chip DSP48 slices reduce latency vs. external DSP chips; RocketIO links stream ADC data directly from RF front-end.

Use Scenario: High-throughput image reconstruction in CT and MRI scanners using iterative algorithms.

IC Role / Device Role / Timing Role: Configurable logic implements custom pixel pipelines; embedded processors handle DICOM protocol stack and storage interface.

Use Value: Block RAM capacity stores intermediate image buffers; dual PowerPC 405 cores enable concurrent acquisition and reconstruction threads.

Avionics Data ConcentratorIndustrial Protocol Gateway

Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control computers.

IC Role / Device Role / Timing Role: FPGA logic implements protocol translators and time-triggered scheduling; PowerPC runs DO-178C-certifiable software.

Use Value: Multi-standard I/O banks interface natively to legacy avionics buses; -10 speed grade ensures deterministic response under temperature variation.

Use Scenario: Bridging Modbus TCP, PROFINET, and EtherCAT in smart factory edge controllers.

IC Role / Device Role / Timing Role: FPGA fabric handles real-time Ethernet MAC offload and fieldbus timing; PowerPC manages web UI and cloud upload.

Use Value: RocketIO transceivers connect to Gigabit PHYs; SelectIO supports 2.5 V/3.3 V industrial I/O voltage levels.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance embedded FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Xilinx XC4VLX40-10FF668INo embedded PowerPC cores; higher logic density (41,472 CLBs); same package and transceiver countBetter suited for pure logic-intensive tasks without processor requirementsSelect when application does not require hard-core processor integration and prioritizes raw logic capacity
Xilinx XC4VSX55-11FF668IHigher logic count (55,296 CLBs); same PowerPC dual-core and RocketIO count; -11 speed grade (slower max frequency)Targeted at bandwidth-constrained but logic-heavy signal processing where lower power is acceptableChoose when additional logic resources are needed and timing margin allows -11 grade operation

Compared with XC4VLX40-10FF668I and XC4VSX55-11FF668I, the XC4VSX35-10FFG668I uniquely balances embedded processing, transceiver bandwidth, and logic resources - making it optimal for tightly coupled control + signal processing workloads where both CPU and FPGA resources are concurrently utilized.

Availability

XC4VSX35-10FFG668I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentration, and industrial protocol gateway applications requiring stable component supply and long-term lifecycle support.

Supply support for XC4VSX35-10FFG668I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions, with leadership in FPGA, AI acceleration, and data center technologies.

The Virtex-4 SX family was designed specifically for embedded computing applications requiring integrated processing, high-speed serial I/O, and reconfigurable logic - targeting aerospace, defense, and medical imaging systems.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC4VSX35-10FFG668I?

The XC4VSX35-10FFG668I supports PowerPC 405 core operation up to 500 MHz under typical conditions. This frequency is guaranteed by the -10 speed grade and validated across industrial temperature range (-40°C to +100°C). The actual achievable frequency depends on voltage scaling, thermal management, and configuration of on-chip caches and bus arbitration. XC4VSX35-10FFG668I documentation specifies this limit in the Processor Block Timing section of DS204.

Does XC4VSX35-10FFG668I support partial reconfiguration?

Yes, XC4VSX35-10FFG668I supports partial reconfiguration through its hierarchical bitstream architecture and dedicated configuration logic. This capability allows dynamic replacement of logic modules without resetting the entire device or halting PowerPC execution. Implementation requires Xilinx ISE 10.1 or later and adherence to floorplanning constraints. XC4VSX35-10FFG668I is explicitly listed in UG070 as supporting this feature.

What I/O standards are supported by XC4VSX35-10FFG668I?

XC4VSX35-10FFG668I supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS, RSDS, and BLVDS via its SelectIO technology. Each I/O bank operates independently at 1.2 V, 1.5 V, 1.8 V, or 2.5 V. XC4VSX35-10FFG668I does not support 3.3 V I/O in this package variant due to FFG668I's internal power architecture limitations.

Is XC4VSX35-10FFG668I pin-compatible with other Virtex-4 devices in the FFG668 package?

No, XC4VSX35-10FFG668I is not fully pin-compatible with other Virtex-4 families in the FFG668 package. While mechanical footprint and ball count match, I/O banking structure, power pin allocation, and transceiver pin assignments differ between SX, LX, and FX subfamilies. XC4VSX35-10FFG668I requires its specific pinout map (DS204 Table 2) and cannot be substituted without PCB redesign.

What configuration modes does XC4VSX35-10FFG668I support?

XC4VSX35-10FFG668I supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. It also supports fallback and multi-boot via external SPI flash. Configuration is initiated by PROGRAM_B and monitored via INIT_B and DONE pins. XC4VSX35-10FFG668I implements dual-boot capability using two independent bitstreams stored in external memory, enabling fail-safe firmware updates.

XC4VSX35-10FFG668I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-4 SX
Package/Case:
668-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
3840
Number of Logic Elements/Cells:
34560
Total RAM Bits:
3538944
Number of I/O:
448
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
668-FCBGA (27x27)

XC4VSX35-10FFG668I FAQ

1.How can I place an order for XC4VSX35-10FFG668I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC4VSX35-10FFG668I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC4VSX35-10FFG668I reliable?

The price and inventory of XC4VSX35-10FFG668I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VSX35-10FFG668I is usually 5 days.

3.What payment methods are accepted for XC4VSX35-10FFG668I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VSX35-10FFG668I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC4VSX35-10FFG668I?

XC4VSX35-10FFG668I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC4VSX35-10FFG668I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC4VSX35-10FFG668I?

For technical support, including XC4VSX35-10FFG668I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VSX35-10FFG668I requirements.

6.How does Aetrix verify that XC4VSX35-10FFG668I is sourced from the original manufacturer or authorized distributors?

All XC4VSX35-10FFG668I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VSX35-10FFG668I meets industry standards.

7.What is the process for return or replacement of XC4VSX35-10FFG668I?

All XC4VSX35-10FFG668I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VSX35-10FFG668I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC4VSX35-10FFG668I part is unused and in its original packaging.

Return procedure for XC4VSX35-10FFG668I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC4VSX35-10FFG668I Tags

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  • XC4VSX35-10FFG668I Images
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