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AMD XC4VSX35-11FF668I
- Part No.:
- XC4VSX35-11FF668I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VSX35-11FF668I.pdf
- Description:
- IC FPGA 448 I/O 668FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,301
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Product details
Overview
XC4VSX35-11FF668I from AMD is a Virtex-4 SX family FPGA featuring 34,560 logic cells, 288 embedded 18×18 multipliers, and 2.5 Mb of block RAM. It supports DDR2 memory interfaces up to 400 MHz and operates at -11 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC4VSX35-11FF668I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (576 user I/Os), differential signaling support (LVDS, RSDS, HSTL), configuration interface options (Master SelectMAP, Serial), and thermal performance under sustained logic utilization.
Technical Context
The XC4VSX35-11FF668I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and flexible clock management tiles (CMTs) containing DCMs and PLLs. It supports multiple configuration modes including JTAG, Master SelectMAP, and Serial PROM loading.
It integrates 576 user-configurable I/O pins compliant with 21 I/O standards including LVCMOS, LVTTL, HSTL, SSTL, and differential standards such as LVDS and RSDS. Configuration is performed via internal 4-bit or 8-bit parallel bus or 32-bit serial stream.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 34,560 - total available CLBs for combinational and sequential logic implementation |
| Embedded Multipliers | 288 × 18×18 - dedicated DSP resources for high-speed arithmetic in filtering and FFT |
| Block RAM | 2.5 Mb - distributed across 192 BRAM blocks, each 18 Kb, supporting true dual-port operation |
| User I/O Pins | 576 - supports high-density board interconnect with bank-specific voltage and standard assignment |
| Speed Grade | -11 - guarantees timing closure at maximum operating frequencies per device characterization |
| Operating Temperature | -40°C to +100°C - qualified for industrial environments without derating |
| Package | FF668 - 668-pin Fine-Pitch Flip-Chip BGA, 27×27 mm, 1.0 mm pitch |
Pinout & Package
XC4VSX35-11FF668I is housed in a 668-pin Fine-Pitch Flip-Chip BGA (FF668) package with 27×27 mm body size and 1.0 mm ball pitch. Thermal and electrical performance is optimized for high-speed routing and power delivery integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.2 V supply for internal logic; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary Power Supply | 2.5 V supply for configuration, clocking, and I/O banks; shared across multiple banks |
| VCCO | I/O Output Power | Bank-specific voltage (1.2–3.3 V) setting output drive strength and logic level |
| PROGRAM_B | Configuration Initiate | Active-low input that resets configuration logic and clears internal state |
| DONE | Configuration Status | Open-drain output indicating successful configuration completion |
| CCLK | Configuration Clock | Input clock for Master SelectMAP and Serial configuration modes |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP Slices | 288 × 18×18 multipliers with optional accumulator and pipeline registers for real-time signal processing |
| Flexible Clock Management | DCMs and PLLs per clock region enable independent frequency synthesis, phase shifting, and jitter reduction |
| SelectIO Technology | Support for 21 I/O standards including LVDS, RSDS, HSTL Class I/II, and SSTL-2/3 with programmable drive strength |
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reset-verified in Virtex-4 architecture documentation |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel filter banks and FFT engines; clock management ensures deterministic latency across processing chains. Use Value: 288 DSP slices enable simultaneous 128-channel FFT computation at >100 MSPS sample rate. | Use Scenario: High-throughput image reconstruction in CT and MRI subsystems requiring low-latency data path control. IC Role / Device Role / Timing Role: Configurable logic manages DMA handshaking, pixel buffering, and compression pipelines; block RAM provides frame-level storage. Use Value: 2.5 Mb block RAM allows dual-port access to 2048×2048 pixel buffers with zero wait-state read/write concurrency. |
| Industrial Protocol Gateway | Avionics Data Concentrator |
Use Scenario: Bridging EtherCAT, PROFINET, and CANopen in factory automation controllers. IC Role / Device Role / Timing Role: Implements multiple protocol state machines and time-critical interrupt handlers; I/O banks isolate mixed-voltage interfaces. Use Value: 576 user I/Os support concurrent 8× EtherCAT slaves and 4× PROFINET ports with independent timing domains. | Use Scenario: ARINC 429 and MIL-STD-1553B data aggregation in flight control computers. IC Role / Device Role / Timing Role: FPGA synchronizes asynchronous avionics buses using DCM-based clock domain crossing and FIFO buffering. Use Value: Industrial temperature rating (-40°C to +100°C) enables deployment in uncooled avionics bays without thermal throttling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable computing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VSX55-11FF1148I | Higher logic capacity (55,296 CLBs), more DSP slices (480), larger package (1148-pin) | Required for designs needing >34K logic cells or >288 multipliers; not pin-compatible | Select when scaling algorithm complexity beyond XC4VSX35-11FF668I capacity limits |
| XCVU9P-2FLGA2104I | Virtex UltraScale+ architecture; 512,000 logic cells, 2,592 DSP slices, integrated 100G Ethernet MAC | Targets next-generation protocols and AI-accelerated workloads; requires new PCB layout and toolchain migration | Choose for long-term roadmap alignment where legacy Virtex-4 support is no longer viable |
Compared with XC4VSX35-11FF668I, XC4VSX55-11FF1148I offers higher density but demands mechanical redesign, while XCVU9P-2FLGA2104I delivers orders-of-magnitude scalability at the cost of full ecosystem requalification.
Availability
XC4VSX35-11FF668I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and industrial protocol gateway applications requiring stable component supply across extended product lifecycles.
Supply support for XC4VSX35-11FF668I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions, with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.
The Virtex-4 SX family-including XC4VSX35-11FF668I-was engineered for compute-intensive signal processing applications demanding high logic density, embedded arithmetic, and deterministic I/O timing.
FAQ
What is the maximum supported DDR2 memory interface speed for XC4VSX35-11FF668I?
The XC4VSX35-11FF668I supports DDR2 SDRAM interfaces up to 400 MHz data rate (200 MHz clock frequency) using dedicated I/O logic and calibration features. This capability is verified in the Virtex-4 DC and Switching Characteristics datasheet (DS112, v2.11), and requires proper PCB layout matching and termination for signal integrity.
Does XC4VSX35-11FF668I support partial reconfiguration?
Yes, XC4VSX35-11FF668I supports partial reconfiguration as defined in the Virtex-4 architecture and documented in UG070 (Virtex-4 Configuration User Guide). This allows dynamic replacement of logic modules without resetting the entire device, enabling runtime adaptation in communication and instrumentation systems.
What configuration modes are supported by XC4VSX35-11FF668I?
XC4VSX35-11FF668I supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. The mode is selected via MODE pins during power-up. Master SelectMAP enables autonomous boot from external flash, while JTAG is used for debugging and programming during development.
Is XC4VSX35-11FF668I qualified for industrial temperature operation?
Yes, the "I" suffix in XC4VSX35-11FF668I denotes industrial temperature qualification (-40°C to +100°C). This rating is confirmed in the Virtex-4 Packaging and Reliability Report (AR143) and applies to the full FF668 package variant under specified voltage and derating conditions.
What I/O standards are supported on XC4VSX35-11FF668I banks?
XC4VSX35-11FF668I supports 21 I/O standards including LVCMOS, LVTTL, HSTL Class I/II, SSTL-2/3, and differential standards LVDS and RSDS. Each I/O bank is independently configurable for voltage and standard, subject to bank-specific VCCO constraints as defined in DS112 Table 21.
XC4VSX35-11FF668I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 SX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3840
- Number of Logic Elements/Cells:
- 34560
- Total RAM Bits:
- 3538944
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VSX35-11FF668I FAQ
1.How can I place an order for XC4VSX35-11FF668I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VSX35-11FF668I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VSX35-11FF668I reliable?
The price and inventory of XC4VSX35-11FF668I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VSX35-11FF668I is usually 5 days.
3.What payment methods are accepted for XC4VSX35-11FF668I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VSX35-11FF668I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VSX35-11FF668I?
XC4VSX35-11FF668I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VSX35-11FF668I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VSX35-11FF668I?
For technical support, including XC4VSX35-11FF668I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VSX35-11FF668I requirements.
6.How does Aetrix verify that XC4VSX35-11FF668I is sourced from the original manufacturer or authorized distributors?
All XC4VSX35-11FF668I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VSX35-11FF668I meets industry standards.
7.What is the process for return or replacement of XC4VSX35-11FF668I?
All XC4VSX35-11FF668I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VSX35-11FF668I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VSX35-11FF668I part is unused and in its original packaging.
Return procedure for XC4VSX35-11FF668I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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