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AMD XC4VSX35-11FFG668C
- Part No.:
- XC4VSX35-11FFG668C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VSX35-11FFG668C.pdf
- Description:
- IC FPGA 448 I/O 668FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,108
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Product details
Overview
XC4VSX35-11FFG668C from AMD is a Virtex-4 SX family FPGA featuring 34,560 logic cells, 288 embedded 18×18 multipliers, and 2,304 Kbits of block RAM. It supports DDR2 memory interfaces up to 400 MHz and operates at -11 speed grade with 1.2 V core voltage. Used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC4VSX35-11FFG668C datasheet, pinout, applications, or equivalent options, key considerations include I/O bank voltage compatibility (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), differential signaling support (LVDS, RSDS, HSTL), and configuration interface options (Master SelectMAP, Slave Serial).
Technical Context
The XC4VSX35-11FFG668C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and flexible clock management tiles (CMTs) containing DCMs and PLLs. It supports partial reconfiguration and includes integrated PCI-X 133 MHz endpoint logic.
Configuration is performed via internal configuration access port (ICAP) or external master/slave modes using PROM, processor, or JTAG. The device uses 90 nm copper process technology and supports IEEE 1149.1 boundary-scan testing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 34,560 - determines maximum combinational and sequential logic capacity for system-level integration |
| Embedded Multipliers | 288 × 18×18-bit - enables parallel DSP operations including FIR filtering and FFT computation |
| Block RAM | 2,304 Kbits - supports on-chip data buffering, FIFOs, and lookup table storage without external memory |
| I/O Standards | Supports LVDS, RSDS, HSTL, SSTL, LVTTL - allows direct interfacing with common memory and peripheral ICs |
| Speed Grade | -11 - guarantees timing closure at highest operating frequency for critical paths in target designs |
| Core Voltage | 1.2 V - defines power delivery requirements and impacts dynamic power consumption |
Pinout & Package
XC4VSX35-11FFG668C is housed in a 668-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 32 mm × 32 mm body size and 1.0 mm ball pitch. Thermal characteristics include θJA = 15.6 °C/W and θJB = 3.7 °C/W.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master SelectMAP mode |
| DIN | Configuration Data Input | Serial data input for configuration bitstream in Slave Serial or SelectMAP modes |
| INIT_B | Configuration Initialization Output | Open-drain status signal indicating readiness for configuration or detecting CRC error |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot process |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant test access, debug, and indirect configuration |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP Slices | Each contains two 18×18 multipliers plus accumulator logic - accelerates math-intensive algorithms without consuming general logic |
| Flexible Clock Management | DCMs and PLLs per I/O bank - enable precise clock phase alignment and frequency synthesis for mixed-speed interfaces |
| Partial Reconfiguration Support | Allows dynamic module swapping in runtime - reduces system downtime and enables adaptive hardware functions |
| PCI-X 133 MHz Endpoint Logic | Hard IP block compliant with PCI-X 2.0 specification - eliminates need for external bridge logic in host-attached applications |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Configurable datapath engine executing time-critical filtering and correlation tasks with deterministic latency. Use Value: 288 embedded multipliers enable concurrent channel processing; -11 speed grade ensures sub-10 ns path timing for RF sampling control loops. | Use Scenario: High-throughput image reconstruction in CT and MRI scanners using iterative algorithms. IC Role / Device Role / Timing Role: Co-processor offloading compute-intensive backprojection and denoising kernels from host CPU. Use Value: 2,304 Kbits block RAM buffers projection data locally; LVDS I/O supports high-speed ADC/DAC interface synchronization. |
| Avionics Data Concentrators | High-Speed Test Equipment |
Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation with protocol translation and time-stamping. IC Role / Device Role / Timing Role: Deterministic real-time I/O controller managing multiple legacy avionics buses with guaranteed response deadlines. Use Value: Multiple I/O banks configured at 2.5 V/3.3 V support mixed-voltage legacy peripherals; DCMs provide jitter-controlled timing for timestamp accuracy. | Use Scenario: Pattern generation and response analysis in ATE platforms for SoC validation. IC Role / Device Role / Timing Role: Programmable stimulus engine generating synchronized multi-channel digital waveforms at >200 MHz. Use Value: 34,560 logic cells implement deep pattern memory and state machines; HSTL I/O ensures clean signal integrity at 400 Mbps data rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable computing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VSX55-11FFG1148C | Higher logic density (55,296 CLBs), larger package (1148-pin FFG), +33% multipliers | Suitable for more complex signal chains requiring additional pipeline stages or parallel processing lanes | Select when design scale exceeds XC4VSX35-11FFG668C resource limits but same Virtex-4 SX architecture is required |
| XCVU3P-2FFVD1760E | UltraScale architecture, 384K logic cells, 720 DSP slices, 27.5 Mb block RAM, 0.85 V core | Targets next-generation systems needing higher throughput, lower power, and PCIe Gen3/DDR4 support | Choose for new designs where long-term roadmap alignment and scalability outweigh legacy toolchain constraints |
Compared with XC4VSX35-11FFG668C, XC4VSX55-11FFG1148C offers scalable capacity within the same family and toolflow, while XCVU3P-2FFVD1760E provides architectural advancement at the cost of migration effort and toolchain transition.
Availability
XC4VSX35-11FFG668C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentrators requiring stable component supply across extended production lifecycles.
Supply support for XC4VSX35-11FFG668C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in high-performance computing, adaptive SoCs, and FPGA technologies for aerospace, defense, and industrial applications.
The Virtex-4 SX family was designed specifically for embedded signal processing applications demanding high arithmetic throughput, low-latency I/O, and deterministic real-time behavior in harsh environments.
FAQ
What is the maximum supported I/O standard voltage for XC4VSX35-11FFG668C?
XC4VSX35-11FFG668C supports I/O bank voltages of 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V. Each I/O bank is independently configurable, enabling mixed-voltage operation across different peripheral interfaces. This flexibility allows direct connection to DDR2 memory, LVDS transceivers, and legacy TTL devices without level-shifting circuitry.
Does XC4VSX35-11FFG668C support partial reconfiguration?
Yes, XC4VSX35-11FFG668C supports partial reconfiguration through its ICAP interface and dedicated configuration logic. This capability allows runtime modification of specific logic regions without resetting the entire device. Designers use it in applications like adaptive filter tuning or protocol switching where continuous operation must be maintained.
What configuration modes are available for XC4VSX35-11FFG668C?
XC4VSX35-11FFG668C supports Master SelectMAP, Slave SelectMAP, Slave Serial, and JTAG configuration modes. Master SelectMAP uses an internal oscillator to drive CCLK; Slave Serial accepts bitstream via DIN with external clock. JTAG enables boundary-scan testing and indirect programming via TDI/TDO.
Is XC4VSX35-11FFG668C qualified for aerospace or military applications?
XC4VSX35-11FFG668C is not a radiation-hardened or MIL-STD-883-qualified part. However, it has been deployed in non-safety-critical avionics subsystems such as data concentrators and sensor pre-processors where commercial-grade reliability and extended temperature range (-40°C to +100°C case) meet program requirements.
What thermal management guidance applies to XC4VSX35-11FFG668C?
XC4VSX35-11FFG668C has a junction-to-ambient thermal resistance (θJA) of 15.6 °C/W and junction-to-board (θJB) of 3.7 °C/W. For reliable operation at full utilization, a 4-layer PCB with thermal vias under the package and a heatsink rated for ≥2.5 W dissipation is recommended. Thermal simulation should verify peak junction temperature remains below 100°C.
XC4VSX35-11FFG668C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 SX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3840
- Number of Logic Elements/Cells:
- 34560
- Total RAM Bits:
- 3538944
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VSX35-11FFG668C FAQ
1.How can I place an order for XC4VSX35-11FFG668C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VSX35-11FFG668C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VSX35-11FFG668C reliable?
The price and inventory of XC4VSX35-11FFG668C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VSX35-11FFG668C is usually 5 days.
3.What payment methods are accepted for XC4VSX35-11FFG668C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VSX35-11FFG668C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VSX35-11FFG668C?
XC4VSX35-11FFG668C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VSX35-11FFG668C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VSX35-11FFG668C?
For technical support, including XC4VSX35-11FFG668C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VSX35-11FFG668C requirements.
6.How does Aetrix verify that XC4VSX35-11FFG668C is sourced from the original manufacturer or authorized distributors?
All XC4VSX35-11FFG668C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VSX35-11FFG668C meets industry standards.
7.What is the process for return or replacement of XC4VSX35-11FFG668C?
All XC4VSX35-11FFG668C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VSX35-11FFG668C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VSX35-11FFG668C part is unused and in its original packaging.
Return procedure for XC4VSX35-11FFG668C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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