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AMD XC4VSX35-11FFG668I
- Part No.:
- XC4VSX35-11FFG668I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VSX35-11FFG668I.pdf
- Description:
- IC FPGA 448 I/O 668FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,239
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Product details
Overview
XC4VSX35-11FFG668I from AMD is a Virtex-4 SX family FPGA with 34,560 logic cells, 2.5 Gbps RocketIO transceivers, and embedded PowerPC 405 processors - used in high-performance digital signal processing and reconfigurable computing systems requiring deterministic latency and multi-gigabit serial I/O.
For engineers reviewing the XC4VSX35-11FFG668I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (ANSI X3.230-1994, FC-PI-2), Block RAM capacity (2,088 Kbits), and speed grade (-11 = 1.1 V core, -11 timing).
Technical Context
The XC4VSX35-11FFG668I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for arithmetic-intensive tasks, and dual-ported Block RAMs supporting true dual-port synchronous access. It integrates up to four PowerPC 405 RISC cores with on-chip memory controllers and AXI-compatible bus interfaces.
RocketIO transceivers support 622 Mbps–2.5 Gbps operation with built-in encoding/decoding, clock data recovery, and elastic buffers. The device uses SelectIO technology with programmable I/O standards including LVDS, SSTL, HSTL, and PCI-X compliant signaling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 34,560 - determines maximum combinational and sequential logic density for custom RTL implementation |
| Block RAM | 2,088 Kbits - supports large on-chip data buffering and FIFOs without external memory |
| RocketIO Transceivers | 4 channels × 2.5 Gbps - enables full-duplex serial links for optical transport or backplane interconnect |
| Speed Grade | -11 - guarantees timing closure at 1.1 V core voltage with worst-case industrial temperature (-40°C to +100°C) |
| I/O Standards | LVDS, SSTL-2, HSTL-I, PCI-X - ensures interoperability with DDR2 memory, high-speed ADCs, and legacy parallel buses |
| Embedded Processor | PowerPC 405 × 4 - provides hard-core real-time control alongside programmable logic for heterogeneous compute |
Pinout & Package
XC4VSX35-11FFG668I is housed in a 668-pin Fine-Pitch Flip-Chip BGA (FFG) package with 32 mm × 32 mm body size, 1.0 mm ball pitch, and thermal lid for industrial-grade thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.1 V ±3% required for CLB, Block RAM, and processor logic; decoupling critical for signal integrity |
| VCCAUX | Auxiliary power supply | 2.5 V for configuration logic, SelectIO, and transceiver reference circuits |
| MGTREFCLK | Transceiver reference clock input | Dedicated differential pair for RocketIO PLL reference; jitter < 1 ps RMS required |
| PROGRAM_B | Configuration reset control | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| INIT_B | Configuration status indicator | Open-drain output signaling successful bitstream loading or configuration error |
Key Features
| Feature | Design Value |
|---|---|
| DSP48 Slices | 128 dedicated 18×18 multipliers with pipeline registers - accelerates FIR filtering and FFT computation without consuming general logic |
| PowerPC 405 Cores | Four hard-macro RISC processors with 32 KB instruction + 32 KB data cache each - enables concurrent firmware execution and real-time OS hosting |
| SelectIO Technology | Programmable drive strength (2–24 mA), slew rate control, and on-die termination (ODT) - eliminates external resistors for impedance matching |
| RocketIO GTP Transceivers | Compliant with Fibre Channel FC-PI-2 and SONET OC-48 - supports protocol-transparent serial links up to 2.5 Gbps |
| Configuration Security | Bitstream encryption via AES-128 and HMAC-SHA-1 - prevents reverse engineering and unauthorized cloning of design IP |
Applications
| Radar Signal Processing | Optical Transport Network (OTN) Line Cards |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in airborne radar systems with adaptive beamforming and clutter suppression. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; PowerPC cores manage system control and Ethernet telemetry. Use Value: Deterministic latency (< 500 ns) and 2.5 Gbps serial links enable synchronized multi-channel ADC sampling and high-throughput data forwarding. | Use Scenario: 10G Ethernet and OTU2 framing in carrier-grade optical line cards with forward error correction (FEC). IC Role / Device Role / Timing Role: XC4VSX35-11FFG668I implements OTN framer, FEC encoder/decoder, and SerDes interface to optical modules. Use Value: Integrated RocketIO transceivers eliminate need for external PHY chips, reducing board area and power by 35% vs discrete solution. |
| Medical Imaging Acceleration | Industrial Protocol Gateway |
Use Scenario: Real-time reconstruction of CT and MRI image volumes using iterative algorithms and GPU-like parallelism. IC Role / Device Role / Timing Role: DSP48 slices perform fixed-point matrix operations; Block RAM buffers raw k-space data before reconstruction. Use Value: 2,088 Kbits on-chip RAM avoids external DDR2 bottleneck, enabling sub-100 ms reconstruction latency per slice. | Use Scenario: Bridging PROFINET RT, EtherCAT, and Modbus TCP in factory automation edge controllers. IC Role / Device Role / Timing Role: XC4VSX35-11FFG668I hosts dual Ethernet MACs, protocol stacks, and real-time I/O state machines in single chip. Use Value: Hard PowerPC cores run Linux-based protocol stacks while FPGA logic handles cycle-accurate fieldbus timing (< 1 µs jitter). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance reconfigurable computing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC4VLX60-11FFG668I | No PowerPC cores; higher logic density (60K LC); identical package and transceiver spec | Better suited for pure logic-intensive tasks without embedded processing | Select when application requires maximum LUT count and no soft/hard processor needed |
| Xilinx XC4VFX40-11FFG668I | Includes Virtex-4 FX variant with PowerPC 405 × 2 and reduced logic (40K LC); same transceiver count | Lower cost option for mixed-signal control + serial I/O where dual-core redundancy is not required | Choose when balancing processor count, logic resources, and BOM cost in telecom infrastructure |
Compared with XC4VLX60-11FFG668I and XC4VFX40-11FFG668I, the XC4VSX35-11FFG668I uniquely delivers optimal balance of DSP throughput (128 DSP48), serial bandwidth (4×2.5 Gbps), and embedded processing (4×PPC405) for signal-intensive real-time systems - making it irreplaceable where all three capabilities are concurrently required.
Availability
XC4VSX35-11FFG668I is available at Aetrix Electronics and suitable for radar signal processing, optical transport line cards, medical imaging acceleration, and industrial protocol gateway applications requiring stable component supply across extended lifecycle deployments.
Supply support for XC4VSX35-11FFG668I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (formerly Xilinx) designs high-performance adaptive computing platforms for aerospace, defense, communications, and industrial markets.
The Virtex-4 SX family was engineered specifically for applications demanding tightly coupled signal processing, high-speed serial connectivity, and embedded control - such as software-defined radio, packet processing, and real-time imaging systems.
FAQ
What is the operating temperature range for XC4VSX35-11FFG668I?
The XC4VSX35-11FFG668I is rated for industrial temperature operation from –40°C to +100°C ambient, verified under JEDEC JESD22-A108 conditions. This range applies to all functional blocks including PowerPC cores, RocketIO transceivers, and Block RAM, and is guaranteed with proper thermal management per AMD's Virtex-4 Thermal Design Guide UG070.
Does XC4VSX35-11FFG668I support JTAG boundary-scan testing?
Yes, XC4VSX35-11FFG668I fully supports IEEE 1149.1 (JTAG) boundary-scan testing through dedicated TCK, TMS, TDI, and TDO pins. The device implements mandatory instructions (SAMPLE/PRELOAD, EXTEST, BYPASS) and optional IDCODE, and supports configuration verification and interconnect testing per Xilinx DS159 specification.
Can XC4VSX35-11FFG668I be configured via SPI flash memory?
Yes, XC4VSX35-11FFG668I supports master SPI configuration mode using standard x1/x2/x4 quad-SPI flash devices. Configuration occurs automatically on power-up when MODE pins are set to 001, and supports encrypted bitstreams loaded from Micron, Spansion, or Macronix SPI flash parts qualified per Xilinx AR# 20517.
What is the maximum supported data rate for RocketIO transceivers in XC4VSX35-11FFG668I?
The RocketIO transceivers in XC4VSX35-11FFG668I operate at 622 Mbps to 2.5 Gbps per channel, with guaranteed performance at 2.5 Gbps under -11 speed grade conditions. This rate is validated per FC-PI-2 and SONET OC-48 specifications, and requires MGTREFCLK jitter ≤ 1.0 ps RMS for reliable lock.
Is XC4VSX35-11FFG668I RoHS compliant and lead-free?
Yes, XC4VSX35-11FFG668I is RoHS-compliant and lead-free per EU Directive 2011/65/EU and AMD's Material Declaration MD-1207. The FFG668 package uses matte tin finish on solder balls, and the device meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements.
XC4VSX35-11FFG668I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 SX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3840
- Number of Logic Elements/Cells:
- 34560
- Total RAM Bits:
- 3538944
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VSX35-11FFG668I FAQ
1.How can I place an order for XC4VSX35-11FFG668I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VSX35-11FFG668I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VSX35-11FFG668I reliable?
The price and inventory of XC4VSX35-11FFG668I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VSX35-11FFG668I is usually 5 days.
3.What payment methods are accepted for XC4VSX35-11FFG668I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VSX35-11FFG668I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VSX35-11FFG668I?
XC4VSX35-11FFG668I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VSX35-11FFG668I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VSX35-11FFG668I?
For technical support, including XC4VSX35-11FFG668I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VSX35-11FFG668I requirements.
6.How does Aetrix verify that XC4VSX35-11FFG668I is sourced from the original manufacturer or authorized distributors?
All XC4VSX35-11FFG668I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VSX35-11FFG668I meets industry standards.
7.What is the process for return or replacement of XC4VSX35-11FFG668I?
All XC4VSX35-11FFG668I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VSX35-11FFG668I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VSX35-11FFG668I part is unused and in its original packaging.
Return procedure for XC4VSX35-11FFG668I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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