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AMD XC4VSX35-12FF668C
- Part No.:
- XC4VSX35-12FF668C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VSX35-12FF668C.pdf
- Description:
- IC FPGA 448 I/O 668FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,263
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Product details
Overview
XC4VSX35-12FF668C from AMD is a Virtex-4 SX family FPGA featuring 34,560 logic cells, 352 I/O pins, and a -12 speed grade with guaranteed 840 MHz internal clocking. It integrates embedded PowerPC 405 processors, high-speed serial transceivers (up to 3.75 Gbps), and DSP48 slices for signal processing acceleration. Used in high-performance reconfigurable computing systems such as radar baseband processing and protocol acceleration.
For engineers reviewing the XC4VSX35-12FF668C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), transceiver compliance (RocketIO™), configuration interface (SelectMAP/JTAG), and thermal design requirements for the 668-pin Flip-Chip Fine-Pitch BGA package.
Technical Context
The XC4VSX35-12FF668C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (2,088 kbits), and dedicated digital signal processing (DSP48) slices. It supports multi-standard serial connectivity via RocketIO™ transceivers compliant with PCIe 1.0a, Serial RapidIO, and XAUI.
Configuration is performed through SelectMAP mode using parallel slave or master interfaces, or JTAG boundary-scan. The device requires separate VCCINT (1.2 V), VCCAUX (2.5 V), and VCCO (1.2–2.5 V) supplies, with thermal management guided by its 668-pin FF668 package's θJA of 11.2°C/W.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 34,560 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| I/O Pins | 352 - supports high-density board interconnect with banked voltage and slew rate control |
| Block RAM | 2,088 kbits - enables on-chip data buffering, FIFOs, and coefficient storage without external memory |
| RocketIO Transceivers | 8 channels × 3.75 Gbps - provides native SerDes for PCIe 1.0a, Serial RapidIO, and XAUI physical layer |
| DSP48 Slices | 128 - delivers 18×18-bit multiply-accumulate operations at up to 500 MHz for real-time filtering |
| Speed Grade | -12 - guarantees timing closure at 840 MHz internal clock frequency under worst-case conditions |
| Package | FF668 - 668-pin Flip-Chip Fine-Pitch BGA with 1.0 mm pitch, thermal pad, and 352 user I/Os |
Pinout & Package
The XC4VSX35-12FF668C is housed in a 668-pin Flip-Chip Fine-Pitch BGA (FF668) package with 352 user I/Os, 12 dedicated configuration pins, 8 RocketIO transceiver pairs, and thermal pad grounding. Pin functions are banked by voltage and I/O standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives synchronous loading of bitstream during SelectMAP or Master SPI configuration |
| DIN | Configuration Data Input | Serial data input for JTAG configuration or parallel data lane in SelectMAP mode |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating configuration memory readiness or error state |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| M0–M2 | Mode Selection Inputs | Set configuration interface mode (JTAG/Slave SelectMAP/Master SelectMAP/Serial) |
| GTxP/GTxN | Transceiver Differential Pair | High-speed serial transmit output pair supporting 622 Mbps–3.75 Gbps per channel |
Key Features
| Feature | Design Value |
|---|---|
| Embedded PowerPC 405 Cores | Two hardened RISC processors enable soft-core offload and system control without external MCU |
| Multi-Standard RocketIO Transceivers | 8 full-duplex lanes compliant with PCIe 1.0a, Serial RapidIO, and XAUI protocols |
| DSP48 Slices | 128 dedicated arithmetic units optimized for 18×18-bit MAC operations at >500 MHz |
| SelectMAP Configuration Interface | Parallel 8-/16-/32-bit bus interface enabling fast bitstream loading from microcontroller or flash |
| Triple-Voltage I/O Banks | Supports simultaneous 1.2 V, 1.5 V, 1.8 V, and 2.5 V signaling across independent banks |
Applications
| Radar Signal Processing | Protocol Acceleration Engine |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, CFAR, and interpolation algorithms; RocketIO links to ADC/DAC and host processor. Use Value: On-chip DSP48 slices reduce latency versus external DSP chips; 3.75 Gbps transceivers sustain raw ADC data throughput. | Use Scenario: Offloading TCP/IP, TLS, and packet classification in network appliances and security gateways. IC Role / Device Role / Timing Role: Configurable logic implements custom packet inspection engines; PowerPC cores manage control-plane tasks. Use Value: Parallel hardware acceleration improves throughput beyond software-only implementations; dual PowerPC 405 cores handle management traffic concurrently. |
| Medical Imaging Backend | Avionics Data Concentrator |
Use Scenario: Reconstructing ultrasound RF data streams and applying real-time image enhancement filters. IC Role / Device Role / Timing Role: FPGA processes digitized echo signals using pipelined FIR and CIC filters; block RAM stores line buffers and coefficients. Use Value: Integrated 2,088 kbits block RAM eliminates external SRAM for line buffering; 352 I/Os interface directly to multiple ADCs and display controllers. | Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O in flight control computers. IC Role / Device Role / Timing Role: FPGA implements protocol-specific transceivers and time-triggered scheduling logic; PowerPC handles health monitoring and diagnostics. Use Value: Single-chip integration reduces SWaP-C versus discrete ASIC + processor solutions; triple-voltage I/O supports legacy avionics voltage standards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VSX55-12FF1148C | Higher logic density (55,296 CLBs), more I/O (576), larger FF1148 package (1.27 mm pitch) | Required for designs needing >34K logic cells or >352 I/Os; higher power and thermal footprint | Select when scalability beyond XC4VSX35-12FF668C resources is required; not pin-compatible |
| XCVU9P-2FLGA2104I | Virtex UltraScale+ architecture; 960K logic cells, 24.3 Gbps GTY transceivers, 4x DDR4 controller bandwidth | Targets next-gen 5G, AI inference, and high-throughput compute; requires new PCB layout and toolchain migration | Choose for new designs requiring >10× logic capacity or PCIe Gen4/DDR4 support; no backward compatibility |
Compared with XC4VSX35-12FF668C, the XC4VSX55-12FF1148C offers scalable logic and I/O but demands larger board area and thermal design, while the XCVU9P-2FLGA2104I enables generational performance leaps at the cost of full architectural and toolchain requalification.
Availability
XC4VSX35-12FF668C is available at Aetrix Electronics and suitable for radar signal processing, protocol acceleration, and medical imaging backend systems requiring stable component supply across extended production lifecycles.
Supply support for XC4VSX35-12FF668C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Virtex-4 SX family, including XC4VSX35-12FF668C, was engineered for high-performance signal processing and embedded computing applications demanding integrated processors, high-speed serial I/O, and DSP acceleration in a single device.
FAQ
What is the maximum operating frequency of the XC4VSX35-12FF668C?
The XC4VSX35-12FF668C has a -12 speed grade, guaranteeing internal clock operation up to 840 MHz under worst-case voltage and temperature conditions. This rating applies to the FPGA fabric and embedded PowerPC 405 cores, verified per AMD's Virtex-4 timing characterization methodology.
Does the XC4VSX35-12FF668C support PCIe Gen1 x1 or x4 configurations?
Yes, the XC4VSX35-12FF668C supports PCIe 1.0a (Gen1) via its RocketIO transceivers, which are certified for 2.5 Gbps operation. It can implement x1, x2, x4, or x8 link widths depending on design configuration and board routing, with full compliance to the PCI Express Base Specification 1.0a.
What configuration modes does the XC4VSX35-12FF668C support?
The XC4VSX35-12FF668C supports four primary configuration modes: JTAG boundary-scan, Slave SelectMAP, Master SelectMAP, and Serial PROM. Mode selection is controlled by M0–M2 pins at power-up, and all modes are fully documented in the Virtex-4 Configuration User Guide (UG071).
Is the XC4VSX35-12FF668C RoHS-compliant and lead-free?
Yes, the XC4VSX35-12FF668C is manufactured in a RoHS-compliant, lead-free process. Its FF668 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements.
Can the XC4VSX35-12FF668C operate with mixed I/O voltages on different banks?
Yes, the XC4VSX35-12FF668C supports independent VCCO voltages per I/O bank, allowing concurrent operation at 1.2 V, 1.5 V, 1.8 V, and 2.5 V. Each bank must be powered at a single voltage, and I/O standards (LVCMOS, SSTL, HSTL) are selected per-bank in the UCF or XDC constraints file.
XC4VSX35-12FF668C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 SX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3840
- Number of Logic Elements/Cells:
- 34560
- Total RAM Bits:
- 3538944
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VSX35-12FF668C FAQ
1.How can I place an order for XC4VSX35-12FF668C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VSX35-12FF668C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VSX35-12FF668C reliable?
The price and inventory of XC4VSX35-12FF668C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VSX35-12FF668C is usually 5 days.
3.What payment methods are accepted for XC4VSX35-12FF668C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VSX35-12FF668C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VSX35-12FF668C?
XC4VSX35-12FF668C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VSX35-12FF668C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VSX35-12FF668C?
For technical support, including XC4VSX35-12FF668C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VSX35-12FF668C requirements.
6.How does Aetrix verify that XC4VSX35-12FF668C is sourced from the original manufacturer or authorized distributors?
All XC4VSX35-12FF668C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VSX35-12FF668C meets industry standards.
7.What is the process for return or replacement of XC4VSX35-12FF668C?
All XC4VSX35-12FF668C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VSX35-12FF668C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VSX35-12FF668C part is unused and in its original packaging.
Return procedure for XC4VSX35-12FF668C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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