AMD XC4VSX35-12FFG668C

Overview

XC4VSX35-12FFG668C from AMD is a Virtex-4 SX family FPGA featuring 34,560 logic cells, 288 embedded 18×18 multipliers, and 2,304 Kbits of block RAM. It supports up to 720 user I/Os in a 668-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package and is rated for industrial temperature range (–40°C to +85°C). It is used in high-performance digital signal processing and reconfigurable computing systems.

For engineers reviewing the XC4VSX35-12FFG668C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count, DSP slice density, clock management tile capability, and support for SelectIO standards including LVDS, SSTL, and HSTL.

Technical Context

The XC4VSX35-12FFG668C integrates 12 Digital Clock Managers (DCMs), each supporting phase shifting, duty cycle correction, and frequency synthesis. Its architecture includes dedicated routing for high-speed serial interfaces and hard-wired PCI Express™ endpoints in higher-density Virtex-4 SX variants - though this specific part lacks integrated PCIe blocks.

It employs 90 nm copper process technology with triple-oxide transistors and supports configuration via Master SelectMAP, Slave SelectMAP, and JTAG modes. Configuration bitstream security is enabled through AES encryption support in compatible configuration PROMs.

Key Specifications

Pinout & Package

XC4VSX35-12FFG668C is housed in a 668-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 × 35 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) finish. Thermal performance is enhanced by an exposed thermal pad on the underside.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable computing applications.

Compared with XC4VSX35-12FFG668C, the XCVU9P offers vastly higher capacity and serial bandwidth but demands complete architectural reevaluation, while the XC6SLX45 reduces cost and power at the expense of DSP throughput, I/O count, and clock management flexibility - making it suitable only for scaled-down functional subsets.

Availability

XC4VSX35-12FFG668C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and industrial protocol gateway applications requiring stable component supply across extended product lifecycles.

Supply support for XC4VSX35-12FFG668C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions, with heritage in FPGA design through its acquisition of Xilinx in 2022.

The Virtex-4 SX family was designed specifically for compute-intensive embedded applications requiring high logic density, abundant DSP resources, and flexible I/O - targeting defense, aerospace, and medical imaging markets before the UltraScale transition.

FAQ

What is the maximum supported I/O standard voltage for XC4VSX35-12FFG668C?

XC4VSX35-12FFG668C supports I/O voltages from 1.2 V to 3.3 V across its 22 selectable I/O banks. Each bank operates independently with dedicated VCCO and reference voltage pins (VRP/VRN), enabling concurrent use of LVDS, SSTL-2, and HSTL-I on the same device. This flexibility allows direct interfacing with mixed-voltage subsystems without level-shifting components.

Does XC4VSX35-12FFG668C include built-in PCI Express support?

No, XC4VSX35-12FFG668C does not integrate hard PCIe endpoints. While higher-density Virtex-4 SX parts (e.g., XC4VSX55 and above) include dedicated PCI Express blocks, the XC4VSX35-12FFG668C relies on soft-core PCIe implementations using its logic fabric and RocketIO transceivers - which are also absent in this FFG668 package variant. External PHYs and custom logic are required for PCIe connectivity.

What configuration modes are supported by XC4VSX35-12FFG668C?

XC4VSX35-12FFG668C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Master SelectMAP uses internal oscillator to drive CCLK; Slave SelectMAP accepts external clock; JTAG enables boundary-scan and partial reconfiguration; SPI requires external flash memory. All modes support AES-encrypted bitstreams when paired with compatible Xilinx Platform Flash PROMs.

Is XC4VSX35-12FFG668C RoHS compliant?

Yes, XC4VSX35-12FFG668C is RoHS compliant and manufactured with lead-free (Pb-free) solder balls and packaging materials. The FFG668 package uses matte tin finish on the solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available in AMD's official product change notices (PCNs) for this device.

What is the thermal pad specification for XC4VSX35-12FFG668C?

XC4VSX35-12FFG668C features an exposed thermal pad measuring 29.0 mm × 29.0 mm centered on the underside of the FFG668 package. It must be soldered to a thermally enhanced PCB copper plane using a grid of vias (minimum 16 × 16 array, 0.3 mm diameter) to achieve θJA ≤ 12.5°C/W. The pad is electrically connected to device ground and requires no isolation.