AMD XC4VSX55-11FF1148C
- Part No.:
- XC4VSX55-11FF1148C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1148-BBGA, FCBGA
- Datasheet:
-
XC4VSX55-11FF1148C.pdf
- Description:
- IC FPGA 640 I/O 1148FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,930
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC4VSX55-11FF1148C from AMD is a Virtex-4 SX family FPGA with 55,168 logic cells, 360 DSP48 slices, and 4.9 Mb of total block RAM. It features 1148-pin Flip-Chip Fine-Pitch Ball Grid Array (FF) packaging and operates at -1 speed grade (1.1 V core, 1.2 GHz internal clock), targeting high-performance embedded signal processing in radar and software-defined radio systems.
For engineers reviewing the XC4VSX55-11FF1148C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (720 user I/Os), differential signaling support (LVDS, RSDS, HSTL), embedded PowerPC 405 cores, and compliance with IEEE 1149.1 JTAG boundary-scan.
Technical Context
The XC4VSX55-11FF1148C integrates two embedded PowerPC 405 RISC processors, each with 32 kB instruction and 32 kB data cache, enabling tightly coupled hardware/software co-design. It supports up to 720 user-configurable I/Os across 24 banks with programmable drive strength, slew rate, and on-chip termination.
Its architecture includes 360 dedicated 18×18-bit signed/unsigned multiplier-accumulator DSP48 slices, 4.9 Mb of distributed and block RAM (including 18-kb Block RAMs), and SelectIO technology supporting LVDS, RSDS, SSTL, and HSTL standards at up to 840 Mbps per differential pair.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 55,168 - provides gate count equivalent to ~2.5M ASIC gates for complex RTL implementation |
| DSP Slices | 360 × DSP48 - enables parallel multiply-accumulate operations for real-time FIR/IIR filtering |
| Block RAM | 4.9 Mb - supports large coefficient buffers, FFT twiddle tables, or frame memory in video/radar |
| User I/Os | 720 - allows high-bandwidth interface to ADCs, DACs, memory, and FMC/HSMC mezzanine connectors |
| Speed Grade | -1 - guarantees timing closure at 1.2 GHz internal clock with 1.1 V core supply |
| I/O Standards | LVDS, RSDS, HSTL, SSTL - ensures compatibility with high-speed data converters and memory interfaces |
| Embedded Processors | 2 × PowerPC 405 - enables asymmetric multiprocessing for control-plane + data-plane partitioning |
Pinout & Package
XC4VSX55-11FF1148C uses a 1148-pin Flip-Chip Fine-Pitch Ball Grid Array (FF1148) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid. The package supports 24 I/O banks, dual VCCO supplies per bank, and dedicated configuration, JTAG, and clock pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master serial or slave selectMAP mode |
| DONE | Configuration Status Output | Signals completion of bitstream loading and device initialization |
| INIT_B | Configuration Initialization | Active-low open-drain output indicating readiness to accept new configuration data |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant programming, debugging, and interconnect testing |
| MRCC/PRCC | Dedicated Clock Inputs | Low-skew global clock routing to regional clock networks for high-fanout timing paths |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Enables hard real-time control tasks alongside programmable logic acceleration without external microcontroller |
| 360 DSP48 Slices | Delivers 1.4 GOPS peak arithmetic throughput for streaming signal processing workloads |
| 720 User I/Os with Per-Bank VCCO | Allows mixed-voltage interface design (e.g., 3.3 V I/Os interfacing to 1.8 V ADCs) |
| 4.9 Mb Block RAM + Distributed RAM | Supports dual-port, true dual-port, and byte-write enable configurations for flexible memory mapping |
| SelectIO Technology | Provides programmable input delay, output phase alignment, and on-die termination for signal integrity at >800 Mbps |
Applications
| Radar Signal Processing | Software-Defined Radio (SDR) |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; PowerPC cores manage system scheduling and Ethernet transport. Use Value: 360 DSP48 slices enable simultaneous 1024-point FFT + adaptive filtering within single frame latency. | Use Scenario: Multi-band, multi-standard wireless baseband processing in military and public safety radios. IC Role / Device Role / Timing Role: Configurable logic implements channelization, modulation/demodulation, and protocol stacks; embedded processors handle MAC layer and host interface. Use Value: 720 I/Os support concurrent RF front-end interfaces (AD9361, AD9371) and high-speed backhaul (PCIe, SRIO). |
| Medical Imaging Acceleration | High-Speed Data Acquisition |
Use Scenario: Real-time image reconstruction in portable ultrasound and digital tomosynthesis systems. IC Role / Device Role / Timing Role: FPGA processes raw echo data streams; PowerPC cores run DICOM stack and touchscreen UI. Use Value: 4.9 Mb block RAM stores full-frame line buffers and convolution kernels for sub-50 ms reconstruction latency. | Use Scenario: 16-channel, 250 MSPS digitizer for oscilloscopes and automated test equipment. IC Role / Device Role / Timing Role: FPGA synchronizes multiple high-speed ADCs, performs real-time decimation and histogramming. Use Value: LVDS I/Os at 840 Mbps sustain aggregate bandwidth >10 Gbps across 720 pins for lossless data capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance signal-processing FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2588K logic cells, higher DSP density (2,592 UltraScale+ DSP slices), 12.5 Gb/s GTY transceivers | Targets next-gen SDR with 5G NR waveforms and millimeter-wave beam management | Choose XCVU9P when migrating to PCIe Gen4, 100G Ethernet, or requiring hardened 100G MAC/PCS |
| XC6VLX240T-1FF1156C | Virtex-6 architecture, 240,000 logic cells, 720 DSP48E1 slices, no embedded processors, lower power consumption | Suitable for cost-sensitive radar subsystems where PowerPC integration is unnecessary | Choose XC6VLX240T when prioritizing power efficiency over dual-core control and legacy IP reuse |
Compared with XC4VSX55-11FF1148C, XCVU9P offers scalable bandwidth and transceiver capability for future-proof designs, while XC6VLX240T delivers higher DSP density and lower static power but lacks integrated processors-making it ideal for pure datapath acceleration where host control is offloaded.
Availability
XC4VSX55-11FF1148C is available at Aetrix Electronics and suitable for radar signal processing, software-defined radio development, and medical imaging acceleration requiring stable component supply across long-lifecycle industrial programs.
Supply support for XC4VSX55-11FF1148C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI acceleration technologies for data centers, embedded systems, and high-performance computing.
The Virtex-4 SX family was designed specifically for compute-intensive signal processing applications requiring tightly integrated processor cores, high-density DSP resources, and high-speed I/O-targeting defense, aerospace, and medical imaging markets.
FAQ
What is the core voltage requirement for XC4VSX55-11FF1148C?
The XC4VSX55-11FF1148C requires a nominal 1.1 V ±3% core supply (VCCINT) to meet its -1 speed grade timing specifications. This voltage must be tightly regulated with low-noise, high-current capability due to dynamic switching currents exceeding 10 A peak during intensive DSP operation. The XC4VSX55-11FF1148C datasheet specifies separate 2.5 V VCCAUX and bank-specific VCCO supplies for I/O compliance.
Does XC4VSX55-11FF1148C support partial reconfiguration?
Yes, the XC4VSX55-11FF1148C supports partial reconfiguration through its hierarchical design flow and dedicated configuration logic. This allows dynamic swapping of functional modules (e.g., different filter banks or modulation schemes) without resetting the entire device. The XC4VSX55-11FF1148C requires use of Xilinx ISE 14.7 or later tools and specific floorplanning constraints to ensure safe context isolation during bitstream updates.
How many clock regions does XC4VSX55-11FF1148C have, and what is their function?
The XC4VSX55-11FF1148C contains eight independent clock regions, each with dedicated global and regional clock buffers and routing networks. These regions allow localized clock domain management to minimize skew and reduce clock-related power consumption. Each region supports up to four primary clock inputs (MRCC/PRCC), and the XC4VSX55-11FF1148C's clocking architecture enables synchronous operation across heterogeneous logic blocks including PowerPC cores and DSP slices.
What JTAG standards does XC4VSX55-11FF1148C comply with?
The XC4VSX55-11FF1148C complies fully with IEEE Std 1149.1-2013 (JTAG Boundary-Scan) for configuration, debugging, and interconnect testing. Its TAP controller supports INTEST, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions, and the XC4VSX55-11FF1148C supports boundary-scan testing of all user I/Os and internal logic states via standard JTAG chains in multi-FPGA systems.
Can XC4VSX55-11FF1148C interface directly with DDR2 SDRAM?
Yes, the XC4VSX55-11FF1148C supports direct DDR2 SDRAM interfacing using its SelectIO technology and dedicated memory controller primitives. It meets JEDEC DDR2-800 timing requirements with programmable input delays and output phase alignment. The XC4VSX55-11FF1148C requires external termination resistors and careful PCB layout for signal integrity, and reference designs validate operation up to 400 MHz clock frequency with 16-bit data buses.
XC4VSX55-11FF1148C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 SX
- Package/Case:
- 1148-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6144
- Number of Logic Elements/Cells:
- 55296
- Total RAM Bits:
- 5898240
- Number of I/O:
- 640
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1148-FCPBGA (35x35)
XC4VSX55-11FF1148C FAQ
1.How can I place an order for XC4VSX55-11FF1148C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VSX55-11FF1148C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VSX55-11FF1148C reliable?
The price and inventory of XC4VSX55-11FF1148C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VSX55-11FF1148C is usually 5 days.
3.What payment methods are accepted for XC4VSX55-11FF1148C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VSX55-11FF1148C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VSX55-11FF1148C?
XC4VSX55-11FF1148C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VSX55-11FF1148C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VSX55-11FF1148C?
For technical support, including XC4VSX55-11FF1148C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VSX55-11FF1148C requirements.
6.How does Aetrix verify that XC4VSX55-11FF1148C is sourced from the original manufacturer or authorized distributors?
All XC4VSX55-11FF1148C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VSX55-11FF1148C meets industry standards.
7.What is the process for return or replacement of XC4VSX55-11FF1148C?
All XC4VSX55-11FF1148C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VSX55-11FF1148C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VSX55-11FF1148C part is unused and in its original packaging.
Return procedure for XC4VSX55-11FF1148C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC4VSX55-11FF1148C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

