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AMD XC4VSX55-11FF1148I
- Part No.:
- XC4VSX55-11FF1148I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1148-BBGA, FCBGA
- Datasheet:
-
XC4VSX55-11FF1148I.pdf
- Description:
- IC FPGA 640 I/O 1148FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,414
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Product details
Overview
XC4VSX55-11FF1148I from AMD is a high-performance Virtex-4 SX family FPGA featuring 55,296 logic cells, 320 embedded 18×18 multipliers, and 4.9 Mb of block RAM. It supports DDR2 memory interfaces up to 400 MHz and operates with -11 speed grade (1.1 ns CLB delay) in industrial temperature range (-40°C to +100°C). It is used in high-bandwidth digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC4VSX55-11FF1148I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (720 user I/Os), differential signaling support (LVDS, RSDS, HSTL), embedded PowerPC 405 cores, clock management tile (CMT) with DCM and PLL, and compliance with IEEE 1149.1 JTAG boundary-scan.
Technical Context
The XC4VSX55-11FF1148I integrates two PowerPC 405 RISC processor cores with on-chip instruction and data caches, enabling embedded soft-core processing alongside programmable logic. Its clock management tiles provide four DCMs and two PLLs for precise clock synthesis, phase shifting, and jitter reduction across multiple domains.
It implements SelectIO technology supporting 24 I/O standards including LVCMOS, SSTL, HSTL, and differential protocols (LVDS, RSDS, BLVDS), with programmable slew rate and drive strength per bank. Configuration is performed via Master SelectMAP, Slave SelectMAP, or JTAG modes using external PROM or processor-controlled interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 55,296 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| Block RAM | 4.9 Mb - supports large on-chip data buffering, FIFOs, and coefficient storage without external memory |
| Embedded Multipliers | 320 × 18×18 - enables parallel DSP operations such as FIR filtering, FFT, and matrix math at system clock rates |
| User I/O Pins | 720 - provides high-density interconnect for multi-chip interfaces, memory buses, and peripheral expansion |
| Speed Grade | -11 - guarantees 1.1 ns CLB propagation delay, enabling operation at up to 500 MHz system clock in critical paths |
| Operating Temperature | -40°C to +100°C - qualified for industrial and extended-temperature embedded applications |
| Configuration Interface | JTAG, Master/Slave SelectMAP - allows in-system programming, debug access, and field firmware updates |
Pinout & Package
XC4VSX55-11FF1148I is housed in a 1148-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG1148) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) solder balls. The package supports thermal dissipation up to 12 W under typical operating conditions and is compatible with standard surface-mount reflow processes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration circuitry, SelectIO banks, and clock management tiles |
| VCCO | I/O bank power | Programmable voltage per I/O bank (1.2–3.3 V) enabling mixed-voltage interface design |
| PROGRAM_B | Configuration reset | Active-low asynchronous input that clears configuration memory and initiates reload sequence |
| DONE | Configuration status | Open-drain output indicating successful configuration completion and readiness for user mode |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1-compliant test access port for boundary-scan, debugging, and ISP |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Enables hard-core embedded processing with cache coherency and AXI bus integration for SoC-like architectures |
| Four DCMs + Two PLLs | Provides independent clock domain management, frequency synthesis, and phase alignment for multi-rate systems |
| SelectIO Technology | Supports per-bank I/O voltage and standard selection, allowing concurrent interfacing to DDR2, PCI-X, and LVDS peripherals |
| Embedded Block RAM | Configurable as true dual-port RAM, ROM, or shift register - eliminates need for external memory in many control and buffering tasks |
| Multi-Standard Transceivers (in SX variant) | Includes RocketIO GTP transceivers supporting 622 Mbps–3.125 Gbps serial links for optical, backplane, and chip-to-chip communication |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels; PowerPC cores manage system control and data packaging. Use Value: 320 embedded multipliers enable simultaneous channel processing at 100+ MSPS sample rates with deterministic latency. | Use Scenario: High-speed image reconstruction in CT and MRI scanners using iterative algorithms. IC Role / Device Role / Timing Role: Configurable logic implements custom interpolation and filtering pipelines; block RAM stores projection data buffers. Use Value: 4.9 Mb on-chip RAM reduces off-chip memory bandwidth bottlenecks, improving reconstruction throughput by >3× vs. external DRAM-only solutions. |
| Industrial Protocol Gateway | Avionics Data Concentrator |
Use Scenario: Bridging EtherCAT, PROFINET, and CANopen networks in factory automation controllers. IC Role / Device Role / Timing Role: FPGA implements protocol state machines and timing-critical MAC layers; PowerPC handles TCP/IP stack and HMI interface. Use Value: 720 user I/Os allow direct connection to multiple PHYs and fieldbus transceivers without glue logic. | Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O in flight control computers. IC Role / Device Role / Timing Role: FPGA manages deterministic time-triggered scheduling; CMT ensures synchronized sampling across all sensor inputs. Use Value: -11 speed grade and industrial temp rating ensure reliable operation under avionics EMI and thermal cycling conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture; 1.1M LUTs, 648 DSP slices, 72.5 Mb BRAM; 16 nm process; no embedded PowerPC | Targets AI inference acceleration and 100G+ networking where software-defined logic density outweighs legacy processor integration | Choose when migrating from Virtex-4 to modern toolchain and requiring higher bandwidth, lower power, but accepting architectural discontinuity |
| XC5VLX110T-2FF1136I | Virtex-5 LX family; 110K logic cells, no PowerPC cores, 6.4 Mb BRAM, 240 DSP48E slices; supports PCIe Gen1/2 | Suitable for compute-accelerated storage and video transcoding where PowerPC is unnecessary and PCIe endpoint capability is required | Prefer for incremental upgrades within same vendor ecosystem where PowerPC is unused and PCIe integration simplifies host interface design |
Compared with XC4VSX55-11FF1148I, XCVU9P-2FLGA2104I offers vastly higher logic and memory resources but lacks PowerPC cores and requires full RTL/toolchain migration, while XC5VLX110T-2FF1136I retains similar I/O and clocking architecture but omits embedded processors and targets different interface priorities.
Availability
XC4VSX55-11FF1148I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentration requiring stable component supply across long-lifecycle industrial programs.
Supply support for XC4VSX55-11FF1148I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive and embedded computing solutions, with leadership in FPGA, adaptive SoC, and AI acceleration technologies.
The Virtex-4 SX family was designed for high-performance embedded computing applications requiring integrated processing cores, high-speed serial I/O, and deterministic real-time signal processing capabilities.
FAQ
What is the configuration method supported by XC4VSX55-11FF1148I?
The XC4VSX55-11FF1148I supports three primary configuration methods: Master SelectMAP (using external PROM), Slave SelectMAP (controlled by external processor), and IEEE 1149.1 JTAG boundary-scan. All methods are fully documented in UG070 and validated for production use. The JTAG interface also enables in-circuit debugging and partial reconfiguration verification. XC4VSX55-11FF1148I does not support passive serial or SPI flash configuration modes.
Does XC4VSX55-11FF1148I include embedded processor cores?
Yes, XC4VSX55-11FF1148I integrates two hardened PowerPC 405 RISC processor cores, each with 32 kB instruction cache and 32 kB data cache, and AXI bus interface. These cores are fully functional in the -11 speed grade and operate across the full industrial temperature range. XC4VSX55-11FF1148I supports symmetric multiprocessing (SMP) configurations and cache coherency protocols when both cores are enabled.
What serial transceiver capabilities does XC4VSX55-11FF1148I provide?
XC4VSX55-11FF1148I includes RocketIO GTP transceivers capable of 622 Mbps to 3.125 Gbps operation, supporting protocols including Serial RapidIO, Aurora, and custom 8b/10b encoded links. It does not support PCIe, SATA, or Ethernet MAC-level protocols natively. XC4VSX55-11FF1148I transceivers require external reference clocks and comply with ANSI TIA/EIA-644 for LVDS physical layer signaling.
Is XC4VSX55-11FF1148I RoHS compliant and lead-free?
Yes, XC4VSX55-11FF1148I is manufactured in a Pb-free (lead-free) process and complies with EU RoHS Directive 2011/65/EU and JEDEC JS709D. The FFG1148 package uses matte tin-plated copper pillars and lead-free solder balls. XC4VSX55-11FF1148I is rated for MSL Level 3 per J-STD-020 and requires moisture-sensitive handling prior to reflow.
What is the maximum supported DDR2 memory interface speed for XC4VSX55-11FF1148I?
XC4VSX55-11FF1148I supports DDR2 SDRAM interfaces up to 400 MHz data rate (200 MHz clock frequency) using dedicated DQS capture logic and source-synchronous timing. This capability is verified in UG071 and applies to all I/O banks configured for SSTL_18. XC4VSX55-11FF1148I does not support DDR3 or LPDDR2 interfaces. Memory controller IP must be implemented in fabric or instantiated from Xilinx CoreGen libraries.
XC4VSX55-11FF1148I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 SX
- Package/Case:
- 1148-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6144
- Number of Logic Elements/Cells:
- 55296
- Total RAM Bits:
- 5898240
- Number of I/O:
- 640
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1148-FCPBGA (35x35)
XC4VSX55-11FF1148I FAQ
1.How can I place an order for XC4VSX55-11FF1148I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VSX55-11FF1148I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VSX55-11FF1148I reliable?
The price and inventory of XC4VSX55-11FF1148I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VSX55-11FF1148I is usually 5 days.
3.What payment methods are accepted for XC4VSX55-11FF1148I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VSX55-11FF1148I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VSX55-11FF1148I?
XC4VSX55-11FF1148I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VSX55-11FF1148I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VSX55-11FF1148I?
For technical support, including XC4VSX55-11FF1148I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VSX55-11FF1148I requirements.
6.How does Aetrix verify that XC4VSX55-11FF1148I is sourced from the original manufacturer or authorized distributors?
All XC4VSX55-11FF1148I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VSX55-11FF1148I meets industry standards.
7.What is the process for return or replacement of XC4VSX55-11FF1148I?
All XC4VSX55-11FF1148I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VSX55-11FF1148I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VSX55-11FF1148I part is unused and in its original packaging.
Return procedure for XC4VSX55-11FF1148I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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