NXP Semiconductors XC56309AG100AR2

Overview

XC56309AG100AR2 from Freescale Semiconductor is a 24-bit digital signal processor (DSP) based on the DSP56300 core, delivering 100 MMACS at 100 MHz with 3.3 V supply, featuring 20,480 × 24-bit program RAM, dual 7,168 × 24-bit X/Y data RAM, and integrated six-channel DMA. It targets wireless infrastructure baseband processing where large on-chip memory reduces external bus traffic.

For engineers reviewing the XC56309AG100AR2 datasheet, XC56309AG100AR2 pinout, XC56309AG100AR2 application, or XC56309AG100AR2 equivalent, key selection criteria include internal memory configuration flexibility, ESSI/SCI peripheral support for multi-channel audio or telecom interfaces, PLL clock synthesis with skew elimination, OnCE™ debug capability, and TQFP-144 packaging for thermal and layout predictability in dense RF subsystems.

Technical Context

The XC56309AG100AR2 implements the full DSP56300 instruction set with position-independent code support, nested hardware DO loops, and fast auto-return interrupts. Its data path includes a fully pipelined 24×24-bit MAC unit feeding two 56-bit accumulators and a 56-bit barrel shifter for normalization and bit-stream operations.

Memory architecture supports dynamic allocation across program, X-data, and Y-data spaces - e.g., 20,480 × 24-bit program RAM + 7,168 × 24-bit X/Y RAM with instruction cache disabled. The external bus interface provides glueless expansion to 256K-word program and two 256K-word data spaces using standard address/data lines and chip-select logic.

Key Specifications

Pinout & Package

XC56309AG100AR2 is housed in a 144-pin Thin Quad Flat Package (TQFP) with 0.5 mm pitch, thermally enhanced for sustained DSP operation in wireless base station cards and DSLAM line cards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DSP-based signal processing applications.

Compared with XC56309AG100AR2, XC56311AG100AR2 trades data RAM for instruction cache to accelerate branching-heavy code, while ADSP-21992BSTZ offers floating-point fidelity at the cost of software compatibility and board-level redesign - making XC56309AG100AR2 optimal for cost-sensitive, memory-bound fixed-point telecom processing.

Availability

XC56309AG100AR2 is available at Aetrix Electronics and suitable for wireless infrastructure, DSLAM line cards, and home theater audio processors requiring stable component supply across extended production lifecycles.

Supply support for XC56309AG100AR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor was a leading designer of embedded processors, analog, and connectivity solutions, later acquired by NXP Semiconductors in 2015. Its DSP portfolio powered foundational wireless and audio infrastructure through the 2000s.

The DSP56300 family - including XC56309AG100AR2 - was engineered specifically for high-throughput, low-latency fixed-point signal processing in telecom baseband and multi-channel audio systems, emphasizing memory bandwidth, deterministic interrupt response, and glueless peripheral integration.

FAQ

What is the maximum operating frequency and voltage range for XC56309AG100AR2?

The XC56309AG100AR2 operates at a maximum internal clock frequency of 100 MHz with a nominal supply voltage of 3.3 V, specified over a 3.0–3.6 V range. Its fully static CMOS design allows operation down to 0 Hz (DC), supporting ultra-low-power stop modes without clock gating complexity. All timing parameters in the datasheet assume 3.3 V ±5% and ambient temperature between –40°C and +85°C.

Does XC56309AG100AR2 support external memory expansion, and what interfaces are provided?

Yes, XC56309AG100AR2 supports external memory expansion via a multiplexed 24-bit address/data bus with dedicated chip-select logic. It enables expansion to one 256K × 24-bit program space and two 256K × 24-bit data spaces. The device integrates a DRAM controller and SRAM-compatible control signals - allowing glueless connection to standard asynchronous SRAMs and page-mode DRAMs without external address latches or bus transceivers.

How does the OnCE™ debug interface function on XC56309AG100AR2?

The OnCE™ (On-Chip Emulation) module in XC56309AG100AR2 provides non-intrusive real-time debugging via the IEEE 1149.1 JTAG TAP. It supports full visibility into core registers, memory contents, and peripheral states without halting instruction execution - enabling breakpoint insertion, watchpoint monitoring, and trace capture during live I/O operation. This capability is essential for validating timing-critical wireless PHY-layer code in XC56309AG100AR2-based systems.

Can XC56309AG100AR2 execute code from external memory, and how is bootloading handled?

XC56309AG100AR2 boots from its internal 192 × 24-bit bootstrap ROM, which executes a configurable boot sequence selecting between internal RAM, external memory, or host interface (HI08) loading. While program execution can occur from external memory after boot, the default configuration loads initial code into internal program RAM for deterministic latency. External program execution requires proper wait-state configuration and is typically used for firmware updates or large algorithm libraries not fitting in internal memory.

What peripheral interfaces are integrated into XC56309AG100AR2 for audio and communications applications?

XC56309AG100AR2 integrates two Enhanced Synchronous Serial Interfaces (ESSI), each supporting one receiver and three transmitters - enabling native six-channel TDM or I²S audio routing. It also includes a Serial Communications Interface (SCI) with baud-rate generator for UART-style control links, a triple timer for frame synchronization, and an 8-bit Host Interface (HI08) for glueless connection to microcontrollers or FPGAs - collectively supporting full-duplex audio transport and system-level coordination in XC56309AG100AR2-based designs.