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NXP Semiconductors XC56309VF100AR2

Part No.:
XC56309VF100AR2
Manufacturer:
NXP Semiconductors
Category:
DSP (Digital Signal Processors)
Package:
196-LBGA
Datasheet:
AetrixXC56309VF100AR2.pdf
Description:
IC DSP 24BIT 100MHZ 196-MABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,902

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Product details

Overview

XC56309VF100AR2 from Freescale Semiconductor is a 24-bit programmable digital signal processor (DSP) based on the DSP56300 core, delivering 100 MMACS at 100 MHz with 3.3 V supply, featuring 20,480 × 24-bit program RAM, dual 7,168 × 24-bit X/Y data RAM, and integrated six-channel DMA. It targets wireless infrastructure baseband processing where large on-chip memory reduces external bus contention.

For engineers reviewing the XC56309VF100AR2 datasheet, XC56309VF100AR2 pinout, XC56309VF100AR2 application, or XC56309VF100AR2 equivalent, key selection criteria include internal memory configuration flexibility, PLL-based clock synthesis with skew elimination, OnCE™ debug support, ESSI/SCI peripheral integration, and TQFP-144 packaging for high-density RF subsystems.

Technical Context

The XC56309VF100AR2 implements the full DSP56300 instruction set with position-independent code support, nested DO loops, and fast auto-return interrupts. Its data path includes a fully pipelined 24×24-bit MAC unit feeding two 56-bit accumulators and a 56-bit barrel shifter for normalization and bit-stream operations.

Memory architecture supports dynamic allocation across program, X-data, and Y-data spaces - default configuration allocates 20,480 × 24-bit program RAM, 7,168 × 24-bit X RAM, and 7,168 × 24-bit Y RAM, all accessible without wait states. The external bus interface enables glueless expansion to 256 K × 24-bit data and program memory spaces via dedicated address/data buses.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureDSP56300 24-bit fixed-point core with 56-bit ALU, MAC, and barrel shifter
Performance100 MMACS @ 100 MHz, 3.3 V nominal supply
Internal RAM20,480 × 24-bit program RAM + 7,168 × 24-bit X RAM + 7,168 × 24-bit Y RAM (default config)
DMA ChannelsSix independent channels supporting 1D/2D/3D transfers and circular buffering
PeripheralsHI08 host interface, dual ESSI (1R/3T each), SCI, triple timer, 34 GPIO
PLL & ClockOn-chip PLL with skew-eliminated output clock and DF reconfiguration without loss of lock
Debug InterfaceOnCE™ module with JTAG TAP for real-time emulation and breakpoint control

Pinout & Package

XC56309VF100AR2 is housed in a 144-pin Thin Quad Flat Package (TQFP) with 0.5 mm pitch, thermally enhanced for sustained 100 MHz operation in wireless baseband modules.

Pin/TerminalCircuit RoleDesign Meaning
EXTAL / XTALCrystal oscillator input/outputSupports fundamental-mode crystal up to 10 MHz; drives internal PLL reference
RESETActive-low asynchronous resetInitializes core registers, disables peripherals, clears DMA pointers and interrupt flags
PINIT/NMINon-maskable interrupt inputTriggers highest-priority exception vector; used for critical fault recovery or watchdog timeout
MODA–MODD / IRQA–IRQDMulti-function I/O pinsConfigurable as peripheral module selects (MODx) or external interrupt inputs (IRQx)
XM_EB / YM_EB / PM_EB / PIO_EBExternal bus enable signalsAsserted to activate external memory space access for X-data, Y-data, program, or peripheral I/O
DAB / DDB / PAB / PDB / XAB / XDB / YAB / YDBAddress/data bus linesSeparate 24-bit address and 24-bit data buses for concurrent X/Y/program memory access

Key Features

FeatureDesign Value
Instruction Cache ControlHardware-managed cache controller enabling zero-wait-state execution from internal program RAM
Power Management ModesWait and Stop modes reduce dynamic power by gating clocks to unused units while preserving register state
ESSI Channel FlexibilityEach ESSI provides one receiver and three transmitters, supporting simultaneous multi-channel audio or TDMA frame transmission
Bootstrap ROM192 × 24-bit mask-ROM executes initial boot sequence and supports field-upgradable firmware loading
Glueless DRAM InterfaceIntegrated DRAM controller handles RAS/CAS timing, refresh cycles, and bank management without external logic

Applications

Wireless Base Station TransceiverDSL Line Card Signal Processing

Use Scenario: Real-time channel equalization, FFT-based OFDM modulation, and adaptive filtering in 3G/4G macrocell baseband units.

IC Role / Device Role / Timing Role: Primary baseband DSP executing Layer 1 physical layer algorithms with deterministic latency under 10 µs per frame.

Use Value: 20 KB program RAM eliminates external flash fetch stalls; dual 7 KB data RAM banks enable ping-pong buffering for continuous ADC/DAC streaming.

Use Scenario: Echo cancellation, line probing, and QAM demodulation in ADSL2+ central office line cards.

IC Role / Device Role / Timing Role: Dedicated signal processor handling upstream/downstream PHY layer tasks synchronized to DSL framing clock.

Use Value: Six-channel DMA offloads 90% of data movement from CPU; ESSI interfaces directly to analog front-end codecs without glue logic.

VoIP Gateway Media ProcessingIndustrial Motor Control Loop

Use Scenario: Concurrent G.729/G.711 codec execution, jitter buffer management, and packetization in carrier-grade VoIP gateways.

IC Role / Device Role / Timing Role: Real-time media engine managing multiple voice channels with sub-15 ms end-to-end delay.

Use Value: Nested DO loops and conditional ALU instructions accelerate speech compression kernels; SCI links to Ethernet MAC controller for RTP transport.

Use Scenario: Field-oriented control (FOC) computation, PWM waveform generation, and current sensing feedback in servo drives.

IC Role / Device Role / Timing Role: Deterministic motor control co-processor synchronizing with PWM timers and ADC sampling triggers.

Use Value: Triple timer module generates precise 3-phase PWM dead-time and captures encoder quadrature edges; GPIO pins drive gate drivers directly.

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital signal processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC56311VF100AR2Same DSP56300 core, but with 32 KB program RAM and enabled instruction cache (1 KB); identical pinout and clock specsPreferred for larger algorithm footprints requiring cached instruction fetch; higher memory bandwidth in burst-mode executionSelect when application code exceeds 20 KB and benefits from cache hit rate >85%
ADSP-21992BSTZAnalog Devices SHARC-based 32-bit floating-point DSP; 160 MIPS, 256 KB on-chip RAM; different ISA and toolchainBetter suited for floating-point math (e.g., beamforming, spectral analysis); requires full software portingChoose only if algorithm requires IEEE-754 precision or complex FFT libraries not available for 24-bit fixed-point

Compared with XC56309VF100AR2, XC56311VF100AR2 offers higher program memory and cache for larger firmware, while ADSP-21992BSTZ provides floating-point capability at the cost of ISA incompatibility and increased power - both require PCB layout review due to differing thermal and decoupling requirements.

Availability

XC56309VF100AR2 is available at Aetrix Electronics and suitable for wireless infrastructure, DSL line card, and VoIP gateway designs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from original manufacturer channels.

Supply support for XC56309VF100AR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) designed high-performance, low-power embedded processors for communications, automotive, and industrial markets.

The DSP56300 family - including XC56309VF100AR2 - was engineered specifically for wireless infrastructure and broadband access equipment demanding deterministic real-time signal processing with minimal external memory dependency.

FAQ

What is the maximum operating frequency of the XC56309VF100AR2?

The XC56309VF100AR2 operates at a maximum internal clock frequency of 100 MHz, achieved via its integrated PLL using an external 10 MHz crystal reference. This yields 100 million multiply-accumulates per second (MMACS) at 3.3 V supply, with timing validated across commercial temperature range (0°C to 70°C). The XC56309VF100AR2 maintains full functionality down to 0 Hz in static mode, supporting ultra-low-power standby.

Does the XC56309VF100AR2 support external memory expansion?

Yes, the XC56309VF100AR2 supports external memory expansion through dedicated buses: two 256 K × 24-bit data memory spaces and one 256 K × 24-bit program memory space. Its chip select logic and integrated DRAM controller enable glueless interface to SRAM and SDRAM, eliminating need for address latches or bus transceivers. The XC56309VF100AR2 retains full DMA and interrupt support during external memory accesses.

How many general-purpose I/O pins does the XC56309VF100AR2 provide?

The XC56309VF100AR2 provides up to thirty-four programmable general-purpose input/output (GPIO) pins, with actual count dependent on peripheral enable configuration. Pins shared with MOD/IRQ functions or ESSI/SCI signals become unavailable when those peripherals are active. All GPIOs support configurable pull-up/down and interrupt-on-change capability, and the XC56309VF100AR2 allows runtime reassignment via peripheral control registers.

What debug capabilities does the XC56309VF100AR2 include?

The XC56309VF100AR2 integrates the OnCE™ (On-Chip Emulation) module with JTAG TAP, enabling non-intrusive real-time debugging, hardware breakpoints, watchpoint triggers, and register visibility without halting execution. It supports full instruction trace and memory access monitoring, and the XC56309VF100AR2 is compatible with Freescale's CodeWarrior DSP tools for source-level development and profiling.

Is the XC56309VF100AR2 RoHS-compliant?

Yes, the XC56309VF100AR2 is offered in both lead-free (RoHS-compliant) and lead-bearing versions, as confirmed in the Freescale DSP56309 Product Brief Rev. 1. The "VF" suffix denotes lead-free TQFP packaging, and the device meets JEDEC J-STD-020 moisture sensitivity level 3. The XC56309VF100AR2 requires standard Pb-free reflow profiles and is qualified for industrial temperature operation.

XC56309VF100AR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
DSP563xx
Package/Case:
196-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
Fixed Point
Interface:
Host Interface, SSI, SCI
Clock Rate:
100MHz
Non-Volatile Memory:
ROM (576B)
On-Chip RAM:
24kB
Voltage - I/O:
3.30V
Voltage - Core:
3.30V
Operating Temperature:
-40°C ~ 105°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15x15)

XC56309VF100AR2 FAQ

1.How can I place an order for XC56309VF100AR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for XC56309VF100AR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC56309VF100AR2 reliable?

The price and inventory of XC56309VF100AR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC56309VF100AR2 is usually 5 days.

3.What payment methods are accepted for XC56309VF100AR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC56309VF100AR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC56309VF100AR2?

XC56309VF100AR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC56309VF100AR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC56309VF100AR2?

For technical support, including XC56309VF100AR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC56309VF100AR2 requirements.

6.How does Aetrix verify that XC56309VF100AR2 is sourced from the original manufacturer or authorized distributors?

All XC56309VF100AR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC56309VF100AR2 meets industry standards.

7.What is the process for return or replacement of XC56309VF100AR2?

All XC56309VF100AR2 units undergo pre-shipment inspection (PSI). If there is an issue with XC56309VF100AR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC56309VF100AR2 part is unused and in its original packaging.

Return procedure for XC56309VF100AR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC56309VF100AR2 Tags

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