NXP Semiconductors XC56L307VL150
- Part No.:
- XC56L307VL150
- Manufacturer:
- NXP Semiconductors
- Category:
- DSP (Digital Signal Processors)
- Package:
- 196-LBGA
- Datasheet:
-
XC56L307VL150.pdf
- Description:
- IC DSP 24BIT 150MHZ 196-MABGA
- Quantity:
- Payment:

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Product details
Overview
XC56L307VL150 from Freescale Semiconductor is a 24-bit digital signal processor (DSP) in the DSP56300 family, designed for high-throughput network and wireless infrastructure applications. It delivers 160 MMACS core performance (320 MMACS with EFCOP), features 192 K × 24-bit on-chip RAM (configurable as 16 K program RAM + 1024-word instruction cache + 24 K X/Y data RAM), operates at 160 MHz internal clock with 1.8 V core / 3.3 V I/O, and integrates an Enhanced Filter Coprocessor for parallel echo cancellation and FIR/IIR filtering.
For engineers reviewing the XC56L307VL150 datasheet, XC56L307VL150 pinout, XC56L307VL150 application, or XC56L307VL150 equivalent, key selection criteria include EFCOP-accelerated filtering throughput, configurable memory mapping, 6-channel DMA support, PLL-based clock generation with skew elimination, and compatibility with legacy DSP56000 code for migration from earlier Freescale DSP platforms.
Technical Context
The XC56L307VL150 implements a fully pipelined DSP56300 core with 24×24-bit MAC, 56-bit barrel shifter, and position-independent code support. Its dual-bus architecture separates program and data paths, enabling simultaneous instruction fetch and operand access - critical for real-time filtering and multi-channel telephony processing.
The integrated Enhanced Filter Coprocessor (EFCOP) runs filter algorithms-including real/complex FIR, DF1/DF2 IIR, and adaptive LMS-concurrently with the main core at full 160 MHz speed. Memory configuration is controlled via MSW0/MSW1 bits, allowing dynamic allocation of up to 47 K × 24-bit program RAM and 20 K × 24-bit X/Y data RAM, with 4 K × 24-bit shared between core and EFCOP.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Performance | 160 MMACS at 160 MHz; 320 MMACS with EFCOP active - enables real-time multi-channel echo cancellation without degrading channel count. |
| Memory Architecture | 192 K × 24-bit total on-chip RAM, configurable across program RAM, instruction cache, X/Y data RAM, and 4 K × 24-bit core/EFCOP shared memory. |
| Power Supply | 1.8 V core voltage with independent 3.3 V I/O - supports mixed-voltage system interfacing while minimizing dynamic power consumption. |
| DMA Capability | Six-channel DMA supporting 1D/2D/3D transfers and circular buffering - reduces CPU overhead for high-bandwidth data streaming in modem banks. |
| Filter Acceleration | EFCOP supports real/complex FIR, DF1/DF2 IIR, adaptive LMS, and 4× decimation - accelerates cellular base station signal conditioning without software intervention. |
| Clock System | Integrated PLL with skew-eliminated output and low-power divide factor adjustment - ensures stable timing across temperature/voltage variations in telecom equipment. |
Pinout & Package
XC56L307VL150 is housed in a molded array plastic-ball grid array (MAP-BGA) package. Pin assignments follow the standard DSP56300 family layout with dedicated buses (XAB/XDB, YAB/YDB, PAB/PDB), peripheral interfaces (ESSI, SCI, HI08), and control signals (RESET, INIT/NMI, EXTAL/XTAL).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| YAB[23:0], XAB[23:0], PAB[23:0] | Address Bus (Y/X/Program) | Three independent 24-bit address buses enable simultaneous access to separate Y-data, X-data, and program memory spaces. |
| YDB[23:0], XDB[23:0], PDB[23:0], GDB[23:0] | Data Bus (Y/X/Program/Global) | Four 24-bit data buses support concurrent data movement across memory domains and peripherals - essential for zero-wait-state filtering pipelines. |
| MODA–MODD / IRQA–IRQD | Multi-function I/O / Interrupt Input | Configurable pins serving as external interrupt sources or general-purpose I/O - used for event-driven control in packet telephony gateways. |
| SCI_TX, SCI_RX | Serial Communications Interface | Asynchronous UART-style interface for host diagnostics, firmware updates, or inter-processor messaging at programmable baud rates. |
| ESSI_CLK, ESSI_DATx | Enhanced Synchronous Serial Interface | Supports six-channel audio streaming (e.g., home theater) with independent transmit/receive clocks and frame sync - no external glue logic required. |
Key Features
| Feature | Design Value |
|---|---|
| EFCOP Parallel Filtering | Offloads echo cancellation and convolution-based algorithms from main core - preserves full 160 MMACS for control-plane tasks in wireless base stations. |
| Configurable Memory Mapping | MSW0/MSW1 bits select among eight RAM partition modes - allows runtime optimization for memory-intensive FFT or sparse matrix operations. |
| 6-Channel DMA with Circular Buffering | Enables continuous data flow between external ADC/DAC and internal RAM - eliminates CPU polling in high-speed modem banks. |
| OnCE™ Debug Support | Hardware emulation via JTAG TAP - permits non-intrusive real-time trace, breakpoint insertion, and register inspection during live signal processing. |
| Glueless External Memory Interface | Integrated DRAM controller and SRAM chip-select logic - simplifies expansion to 256 K × 24-bit external program/data spaces without FPGA or ASIC support logic. |
Applications
| Wireless Base Station Processing | Multi-Channel VoIP Gateway |
|---|---|
Use Scenario: Real-time downlink/uplink signal conditioning in cellular macrocells requiring echo cancellation, channel equalization, and interference suppression across dozens of simultaneous users. IC Role / Device Role / Timing Role: Primary DSP engine executing Layer 1 physical-layer algorithms; EFCOP handles adaptive FIR filtering while core manages scheduling and protocol stack integration. Use Value: Achieves 320 MMACS aggregate throughput - supports >64 concurrent voice channels with <100 µs latency per frame using hardware-accelerated LMS updates. | Use Scenario: Packet telephony gateway aggregating analog PSTN lines into SIP/RTP streams, performing codec translation (G.711/G.729), jitter buffering, and DTMF detection. IC Role / Device Role / Timing Role: Central media processor managing time-critical audio sample buffering, compression/decompression, and packet assembly with deterministic interrupt response. Use Value: Six-channel ESSI and dual 24 K × 24-bit data RAM banks enable simultaneous full-duplex voice path handling without external memory bottlenecks. |
| High-Speed DSL Modem Bank | DSP Resource Board for Telecom R&D |
Use Scenario: Line card in carrier-class DSLAM hosting up to 256 ADSL2+ subscribers, performing DMT symbol processing, bit-loading, and noise margin adaptation per line. IC Role / Device Role / Timing Role: Dedicated per-line DSP coprocessor executing time-domain equalization and trellis-coded modulation - coordinated via HI08 host interface. Use Value: HI08 parallel interface provides glueless connection to x86 host controllers; 160 MHz core ensures sub-frame latency compliance for G.992.5 Annex M. | Use Scenario: Reconfigurable DSP development platform for algorithm prototyping in wireless standards (WiMAX, LTE PHY layer), requiring rapid iteration of filter coefficients and memory-mapped I/O testing. IC Role / Device Role / Timing Role: Standalone evaluation target with bootstrap ROM, OnCE™ debug, and external memory expansion - used for cycle-accurate profiling of custom C/assembly kernels. Use Value: Instruction cache and 1024-word cache size reduce instruction fetch stalls; shared 4 K × 24-bit RAM enables synchronized coefficient exchange between core and EFCOP. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DSP processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC56L305VL150 | No EFCOP; 128 K × 24-bit total RAM; same 160 MHz core and instruction set. | Lacks hardware filter acceleration - requires software-only FIR/IIR implementation, reducing available MMACS for control tasks. | Select when EFCOP functionality is unnecessary and cost reduction is prioritized over filtering throughput. |
| TMS320C6713BZUT1 | 32-bit VLIW DSP; 2250 MIPS at 300 MHz; different ISA, memory map, and peripheral set. | Higher raw compute but no native echo-cancellation coprocessor; requires full algorithm porting and board redesign. | Select for new designs targeting TI ecosystem tools and higher floating-point throughput, not for drop-in replacement. |
Compared with XC56L307VL150, XC56L305VL150 sacrifices EFCOP acceleration and RAM capacity for lower BOM cost, while TMS320C6713BZUT1 offers greater scalar performance but demands complete software/hardware re-architecture - making XC56L307VL150 optimal for legacy-compatible, filter-intensive telecom upgrades.
Availability
XC56L307VL150 is available at Aetrix Electronics and suitable for wireless infrastructure, multi-channel VoIP gateways, and high-speed DSL modem banks requiring stable component supply and long-term lifecycle support.
Supply support for XC56L307VL150 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors, microcontrollers, and analog chips for automotive, industrial, and networking markets.
The DSP56L307VL150 belongs to the DSP56300 family, engineered specifically for high-channel-count telecommunications infrastructure where deterministic real-time filtering, memory bandwidth, and code compatibility with legacy DSP56000 systems are critical.
FAQ
What is the maximum operating frequency of the XC56L307VL150?
The XC56L307VL150 operates with an internal 160 MHz clock derived from its integrated PLL. This frequency drives both the main DSP core and the Enhanced Filter Coprocessor (EFCOP), enabling synchronous execution of core instructions and parallel filter operations. The device maintains full 160 MMACS core performance and achieves 320 MMACS aggregate throughput when EFCOP is active - verified in Freescale's DSP56L307 Product Brief Rev. 2.
Does the XC56L307VL150 support external memory expansion?
Yes, the XC56L307VL150 supports external memory expansion via dedicated address and data buses. It can expand data memory to two 256 K × 24-bit spaces and program memory to one 256 K × 24-bit space. Integrated chip-select logic enables glueless interface to SRAM, and an on-chip DRAM controller supports DRAMs up to 100 MHz - all documented in the XC56L307VL150 Technical Data manual.
How does the Enhanced Filter Coprocessor (EFCOP) in the XC56L307VL150 improve system performance?
The EFCOP in the XC56L307VL150 executes FIR, IIR, and adaptive LMS filtering algorithms concurrently with the main DSP core at full 160 MHz speed. This offloads computationally intensive signal conditioning tasks - such as echo cancellation in VoIP gateways - freeing the core for protocol stack and control functions. As a result, XC56L307VL150 achieves 320 MMACS aggregate throughput without increasing latency or reducing channel count.
What debugging capabilities does the XC56L307VL150 provide?
The XC56L307VL150 includes the OnCE™ (On-Chip Emulation) module with JTAG test access port (TAP), enabling non-intrusive real-time debugging. Engineers can perform cycle-accurate tracing, set hardware breakpoints, inspect registers and memory, and control execution flow without halting real-time signal processing - a capability confirmed in the XC56L307VL150 User's Manual and Product Brief.
Is the XC56L307VL150 pin-compatible with other DSP56300 family members?
The XC56L307VL150 uses the same MAP-BGA package footprint and signal naming convention as other high-pin-count DSP56300 devices like XC56L305VL150 and XC56L309VL150, but pin assignments differ due to peripheral enablement and memory mapping options. While electrical signaling and bus structures are consistent, direct pin-to-pin replacement requires verification of peripheral usage and MSW configuration - as detailed in the XC56L307VL150 datasheet pinout diagrams.
XC56L307VL150 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- DSP563xx
- Package/Case:
- 196-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Host Interface, SSI, SCI
- Clock Rate:
- 150MHz
- Non-Volatile Memory:
- ROM (576B)
- On-Chip RAM:
- 576kB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.80V
- Operating Temperature:
- -40°C ~ 100°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 196-LBGA (15x15)
XC56L307VL150 FAQ
1.How can I place an order for XC56L307VL150 through Aetrix?
Please submit a Request for Quotation (RFQ) for XC56L307VL150 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC56L307VL150 reliable?
The price and inventory of XC56L307VL150 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC56L307VL150 is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC56L307VL150?
For technical support, including XC56L307VL150 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC56L307VL150 requirements.
6.How does Aetrix verify that XC56L307VL150 is sourced from the original manufacturer or authorized distributors?
All XC56L307VL150 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC56L307VL150 meets industry standards.
7.What is the process for return or replacement of XC56L307VL150?
All XC56L307VL150 units undergo pre-shipment inspection (PSI). If there is an issue with XC56L307VL150, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC56L307VL150 part is unused and in its original packaging.
Return procedure for XC56L307VL150:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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