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NXP Semiconductors XC56L307VL160

Part No.:
XC56L307VL160
Manufacturer:
NXP Semiconductors
Category:
DSP (Digital Signal Processors)
Package:
196-LBGA
Datasheet:
AetrixXC56L307VL160.pdf
Description:
IC DSP 24BIT FIXED POINT 196-BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,154

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Product details

Overview

XC56L307VL160 from Freescale Semiconductor is a 24-bit digital signal processor (DSP) in the DSP56300 family, featuring a 160 MHz core clock, 1.8 V core / 3.3 V I/O supply, and an integrated Enhanced Filter Coprocessor (EFCOP). It delivers 160 MMACS (320 MMACS with EFCOP active) and targets high-channel-count network infrastructure applications requiring real-time echo cancellation and FIR/IIR filtering.

For engineers reviewing the XC56L307VL160 datasheet, XC56L307VL160 pinout, XC56L307VL160 application, or XC56L307VL160 equivalent, key selection considerations include EFCOP-supported filter modes (real/complex FIR, DF1/DF2 IIR), programmable memory partitioning (up to 192 K × 24-bit RAM), six-channel DMA, OnCE™ JTAG debug support, and MAP-BGA packaging with 160-ball layout.

Technical Context

The XC56L307VL160 implements a fully pipelined DSP56000-compatible core with dual 56-bit accumulators, 24×24-bit MAC, and 56-bit barrel shifter. Its EFCOP operates synchronously at 160 MHz and supports adaptive LMS updates, 4-bit decimation, and four IIR output scaling factors (1×–16×).

Memory architecture includes configurable X/Y/Program RAM and instruction cache (1024×24-bit), with total internal RAM up to 192 K × 24 bits - including 4 K × 24-bit shared memory accessible by both core and EFCOP. External expansion supports two 256 K × 24-bit data spaces and one 256 K × 24-bit program space via glueless SRAM/DRAM interfaces.

Key Specifications

ParameterValue and Actual Design Meaning
Core Clock Speed160 MHz internal clock - enables deterministic 1-cycle-per-instruction execution for real-time signal processing.
Processing Performance160 MMACS base; 320 MMACS with EFCOP active - doubles throughput for parallel filter operations without core stall.
Memory Architecture192 K × 24-bit total on-chip RAM, programmable across X/Y/Program banks and instruction cache - supports flexible algorithm partitioning.
EFCOP Filter ModesReal/complex FIR, DF1/DF2 IIR, adaptive LMS (true/delayed), 4-bit decimation - covers echo cancellation, correlation, and convolution-based wireless baseband tasks.
Power Supply1.8 V core / 3.3 V I/O - enables low-power operation while maintaining compatibility with legacy 3.3 V peripheral buses.
Debug InterfaceOnCE™ module with JTAG TAP - provides non-intrusive real-time trace, breakpoint, and register access during development.
DMA ChannelsSix independent channels supporting 1D/2D/3D transfers and circular buffering - offloads memory movement from core for sustained throughput.

Pinout & Package

XC56L307VL160 is housed in a 160-ball Molded Array Plastic Ball Grid Array (MAP-BGA) package with 1.0 mm ball pitch, RoHS-compliant lead-free construction. Pinout follows standard DSP56300 external bus interface layout with dedicated YAB/XAB/PAB address buses, YDB/XDB/PDB data buses, GDB global data bus, MODx/IRQx multiplexed mode/interrupt pins, and peripheral-specific signals (ESSI, SCI, HI08, timers, GPIO).

Pin/TerminalCircuit RoleDesign Meaning
YAB[23:0], XAB[23:0], PAB[23:0]Address BusThree independent 24-bit address buses for Y-, X-, and program memory spaces - enables simultaneous multi-bank addressing.
YDB[23:0], XDB[23:0], PDB[23:0], GDB[23:0]Data BusFour 24-bit data paths (Y/X/P/G) support concurrent memory accesses and EFCOP-core data exchange.
MODA/IRQA through MODD/IRQDMode/InterruptMultiplexed pins configure external bus timing modes and serve as priority-encoded interrupt inputs.
ESSI_CLK, ESSI_DIN, ESSI_DOUT[2:0]Synchronous SerialTwo ESSI ports each with one receiver and three transmitters - enables six-channel audio or multi-antenna baseband I/O.
HI08_AD[7:0], HI08_CS, HI08_RD, HI08_WRHost Interface8-bit parallel host bus interface compatible with ISA and microprocessor buses - allows glueless connection to control processors.

Key Features

FeatureDesign Value
EFCOP Parallel ExecutionRuns filtering algorithms concurrently with core instructions - eliminates pipeline stalls and preserves full 160 MHz core utilization.
Configurable Memory MappingMSW0/MSW1 bits select among eight RAM/cache partitions - optimizes memory layout for specific algorithm memory access patterns.
Glueless DRAM SupportIntegrated DRAM controller supports up to 100 MHz DRAMs - reduces BOM count and PCB complexity in memory-intensive systems.
Triple Timer ModuleThree independent 16-bit timers with capture/compare and PWM output - enables precise timing control for frame sync, sampling clocks, and system watchdogs.
Low-Power OperationWait/Stop modes and instruction-dependent power gating - extends runtime in battery-backed or thermally constrained infrastructure equipment.

Applications

Wireless Base Station TransceiverMulti-Channel VoIP Gateway

Use Scenario: Cellular infrastructure unit performing real-time uplink/downlink channel filtering, echo cancellation, and adaptive beamforming in multi-carrier TDMA/CDMA systems.

IC Role / Device Role / Timing Role: Primary DSP engine executing baseband physical layer (PHY) algorithms with EFCOP accelerating FIR/IIR filters and LMS adaptation.

Use Value: 320 MMACS throughput enables simultaneous processing of >32 voice channels with <100 µs latency per frame - meeting 3GPP TS 25.x timing requirements.

Use Scenario: Carrier-grade VoIP media gateway handling 64+ concurrent G.711/G.729 calls with jitter buffering, packet loss concealment, and DTMF detection.

IC Role / Device Role / Timing Role: Central signal processor managing codec execution, echo suppression, and TDM-to-packet conversion via ESSI and HI08 interfaces.

Use Value: Shared 4 K × 24-bit memory between core and EFCOP allows zero-copy coefficient/data exchange - reducing inter-processor latency by 40% vs. discrete DSP+FPGA solutions.

DSP Resource Board for R&DHigh-Speed Modem Bank Controller

Use Scenario: Reconfigurable DSP evaluation platform used by algorithm developers to prototype custom filtering, spectral analysis, and modulation schemes.

IC Role / Device Role / Timing Role: Standalone compute node with boot ROM, instruction cache, and external memory expansion - hosting real-time MATLAB/Simulink-generated C code.

Use Value: OnCE™ JTAG debug support enables cycle-accurate profiling and live register inspection - cutting firmware validation time by 35% compared to emulator-based toolchains.

Use Scenario: DSL/cable modem termination system (MTS) aggregating 256+ subscriber lines with line probing, SNR estimation, and adaptive equalization.

IC Role / Device Role / Timing Role: Per-line DSP coprocessor implementing time-domain equalizers (TDEQ) and frequency-domain FFT-based crosstalk cancellation.

Use Value: Six-channel DMA with circular buffering sustains 125 MB/s sustained memory bandwidth - matching ADSL2+ 24 Mbps downstream burst rates without CPU intervention.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DSP processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC56L305VL160No EFCOP; 160 MMACS only; identical core, memory map, and peripherals except filtering accelerator.Lacks hardware-accelerated echo cancellation and adaptive filtering - requires software-only implementation with ~4× higher MIPS load.Select when cost sensitivity outweighs real-time filter throughput needs and algorithm complexity is low.
TMS320C6713BZUT132-bit floating-point VLIW DSP; 2250 MIPS @ 225 MHz; no EFCOP-equivalent but higher raw compute; different instruction set and memory model.Better suited for floating-point math (FFT, matrix ops); less optimized for fixed-point telecom filtering than XC56L307VL160's EFCOP.Select for mixed-precision algorithms or when migrating from TI C6000 ecosystem; requires full software porting.

Compared with XC56L307VL160, XC56L305VL160 offers identical footprint and software compatibility but sacrifices EFCOP acceleration, while TMS320C6713BZUT1 provides higher peak performance at the cost of fixed-point filtering efficiency and legacy code compatibility.

Availability

XC56L307VL160 is available at Aetrix Electronics and suitable for wireless infrastructure, VoIP gateways, and DSP resource boards requiring stable component supply and long-term obsolescence management.

Supply support for XC56L307VL160 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The DSP56L307VL160 belongs to the DSP56300 family - engineered specifically for high-channel-density telecommunications infrastructure where deterministic real-time filtering, low-latency memory access, and hardware-accelerated echo cancellation are critical.

FAQ

What is the maximum operating frequency of the XC56L307VL160?

The XC56L307VL160 operates with an internal 160 MHz clock, enabling single-cycle instruction execution and delivering 160 MMACS in base mode. Its PLL supports stable clock generation at this frequency with skew elimination, and the EFCOP runs synchronously at the same 160 MHz rate to achieve 320 MMACS during parallel filter operations. This frequency is specified under 1.8 V core supply conditions.

Does the XC56L307VL160 support external memory expansion?

Yes, the XC56L307VL160 supports external memory expansion via dedicated address and data buses. It can expand data memory to two 256 K × 24-bit word spaces and program memory to one 256 K × 24-bit word space. The device includes chip select logic for glueless SRAM interfacing and an integrated DRAM controller supporting DRAMs up to 100 MHz - all documented in the DSP56L307 Technical Data manual.

How does the Enhanced Filter Coprocessor (EFCOP) in the XC56L307VL160 improve filtering performance?

The EFCOP in the XC56L307VL160 executes FIR and IIR filtering operations in parallel with the main DSP core, eliminating pipeline stalls and preserving full 160 MHz core utilization. It supports real/complex FIR, DF1/DF2 IIR, adaptive LMS updates, and 4-bit decimation - enabling XC56L307VL160 to deliver 320 MMACS for filtering workloads while the core handles control, protocol, and I/O tasks concurrently.

What debug capabilities does the XC56L307VL160 provide for firmware development?

The XC56L307VL160 integrates the OnCE™ (On-Chip Emulation) module with JTAG test access port (TAP), supporting non-intrusive real-time debugging, hardware breakpoints, register inspection, and instruction trace. This allows full visibility into XC56L307VL160 execution flow without performance impact - essential for validating time-critical DSP algorithms in telecom infrastructure applications.

Is the XC56L307VL160 pin-compatible with other devices in the DSP56300 family?

The XC56L307VL160 shares the same 160-ball MAP-BGA package and external bus interface pinout with other members of the DSP56L3xx series, including XC56L305VL160. However, functional differences - such as presence/absence of EFCOP - mean that while PCB layout may be reused, firmware and memory mapping must be validated per device. Full pin compatibility is confirmed only within the L307/L305 VL160 variant group.

XC56L307VL160 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
DSP563xx
Package/Case:
196-LBGA
Packaging:
Tray
Product Status:
Obsolete
Type:
Fixed Point
Interface:
Host Interface, SSI, SCI
Clock Rate:
160MHz
Non-Volatile Memory:
ROM (576B)
On-Chip RAM:
576kB
Voltage - I/O:
3.30V
Voltage - Core:
1.80V
Operating Temperature:
-40°C ~ 100°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15x15)

XC56L307VL160 FAQ

1.How can I place an order for XC56L307VL160 through Aetrix?

Please submit a Request for Quotation (RFQ) for XC56L307VL160 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC56L307VL160 reliable?

The price and inventory of XC56L307VL160 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC56L307VL160 is usually 5 days.

3.What payment methods are accepted for XC56L307VL160?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC56L307VL160 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC56L307VL160?

XC56L307VL160 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC56L307VL160 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC56L307VL160?

For technical support, including XC56L307VL160 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC56L307VL160 requirements.

6.How does Aetrix verify that XC56L307VL160 is sourced from the original manufacturer or authorized distributors?

All XC56L307VL160 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC56L307VL160 meets industry standards.

7.What is the process for return or replacement of XC56L307VL160?

All XC56L307VL160 units undergo pre-shipment inspection (PSI). If there is an issue with XC56L307VL160, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC56L307VL160 part is unused and in its original packaging.

Return procedure for XC56L307VL160:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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