AMD XC5VFX130T-1FFG1738I

Overview

XC5VFX130T-1FFG1738I from AMD is a high-performance Virtex-5 FPGA featuring 130,000 logic cells, 12.8 Gb/s serial transceiver bandwidth (via 16 RocketIO GTP transceivers), and embedded PowerPC 440 processor cores. It supports PCIe Gen1 x8, DDR2 SDRAM up to 533 MHz, and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-speed protocol bridging and reconfigurable computing systems.

For engineers reviewing the XC5VFX130T-1FFG1738I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count and data rate, embedded processor availability, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), and thermal performance under sustained logic utilization.

Technical Context

The XC5VFX130T-1FFG1738I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (6.4 Mb total), DSP48E slices (240 units), and clock management tiles (CMTs) supporting phase-matched dual-output DCMs and PLLs. Its RocketIO GTP transceivers operate from 100 Mb/s to 3.75 Gb/s per lane with built-in 8B/10B encoding and elastic buffers.

This device belongs to the Virtex-5 FXT family, integrating hard PowerPC 440 cores with 32 kB instruction and 32 kB data L1 cache, AXI bus interface, and dedicated on-chip memory controllers for DDR2/DDR3. It targets deterministic real-time processing within programmable logic fabric.

Key Specifications

Pinout & Package

XC5VFX130T-1FFG1738I is housed in a 1738-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free/NiPdAu surface finish. Thermal characteristics include θ_JA = 3.8°C/W and θ_JB = 1.5°C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integration FPGA applications.

Compared with XC5VFX130T-1FFG1738I, XCVU9P-2FLGA2104I offers superior serial bandwidth and logic scale but removes PowerPC compatibility, while XC6VLX240T-1FF1156I retains Virtex-family tooling continuity at lower transceiver performance and no embedded processor-making it a transitional option rather than drop-in replacement.

Availability

XC5VFX130T-1FFG1738I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentration, and industrial protocol gateway applications requiring stable component supply across extended product lifecycles.

Supply support for XC5VFX130T-1FFG1738I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing high-performance computing, adaptive SoCs, and FPGA solutions for data center, aerospace, and industrial markets.

The Virtex-5 FXT family, including XC5VFX130T-1FFG1738I, was engineered for compute-intensive embedded systems requiring tightly coupled software and hardware execution in harsh-environment applications.

FAQ

What is the maximum supported DDR2 memory interface speed for XC5VFX130T-1FFG1738I?

The XC5VFX130T-1FFG1738I supports DDR2 SDRAM interfaces up to 533 MHz data rate (266 MHz clock), implemented via dedicated memory controller logic and calibrated I/O timing. This capability is verified in Xilinx UG190 and applies specifically to the -1 speed grade under industrial temperature conditions. XC5VFX130T-1FFG1738I does not support DDR3 or LPDDR2 standards.

Does XC5VFX130T-1FFG1738I include built-in configuration memory?

No, XC5VFX130T-1FFG1738I requires external non-volatile configuration memory (e.g., SPI Flash) to store its bitstream. Configuration occurs at power-up via Master SelectMAP, Slave SelectMAP, or JTAG modes. The XC5VFX130T-1FFG1738I itself contains no on-chip flash or EEPROM for bitstream retention.

What thermal management requirements apply to XC5VFX130T-1FFG1738I in continuous operation?

XC5VFX130T-1FFG1738I requires a heatsink with thermal resistance ≤ 4.5°C/W when operating at full utilization in industrial ambient (up to +100°C case temperature). Its θ_JA is 3.8°C/W and θ_JB is 1.5°C/W, measured per JEDEC JESD51-2. Board layout must include ≥ 6 thermal vias per power ball and solid ground/power planes per UG190 guidelines for XC5VFX130T-1FFG1738I.

Can XC5VFX130T-1FFG1738I be used in safety-critical avionics applications?

Yes, XC5VFX130T-1FFG1738I has been deployed in DO-254-compliant avionics hardware, supported by Xilinx's Design Assurance Program documentation, failure-in-time (FIT) data, and radiation tolerance reports. Its dual PowerPC 440 cores enable lockstep or dual-channel monitoring configurations. XC5VFX130T-1FFG1738I is qualified for use in airborne environments per RTCA DO-160 Section 20.

What configuration modes does XC5VFX130T-1FFG1738I support?

XC5VFX130T-1FFG1738I supports four primary configuration modes: Master SelectMAP (parallel), Slave SelectMAP (parallel), JTAG boundary-scan, and Serial Peripheral Interface (SPI) slave. Mode selection is controlled by mode pins M[2:0] at power-up. All modes are electrically and functionally validated per Xilinx DS100 specification for XC5VFX130T-1FFG1738I.