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AMD XC5VFX130T-3FFG1738C
- Part No.:
- XC5VFX130T-3FFG1738C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1738-BBGA, FCBGA
- Datasheet:
-
XC5VFX130T-3FFG1738C.pdf
- Description:
- IC FPGA 840 I/O 1738FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,655
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Product details
Overview
XC5VFX130T-3FFG1738C from AMD is a high-performance Virtex-5 FPGA featuring 130,000 logic cells, 640 DSP48E slices, and integrated 3.2 Gbps RocketIO GTP transceivers. It implements complex digital signal processing, high-speed serial interface bridging, and real-time packet processing in radar and broadband wireless baseband systems.
For engineers reviewing the XC5VFX130T-3FFG1738C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver data rate, DSP slice count, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), and -3 speed grade timing performance.
Technical Context
The XC5VFX130T-3FFG1738C integrates dual-register 6-input LUTs, block RAM with byte-write enable, and clock management tiles with DCM and PLL. Its architecture supports simultaneous multi-standard protocol handling including PCI Express Gen1, Serial RapidIO, and CPRI.
It delivers deterministic timing closure for designs with >500 MHz system clocks and supports partial reconfiguration via ICAP. The device uses 65 nm copper process technology and operates across industrial temperature range (-40°C to +100°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 130,000 - Enables implementation of large-scale control and datapath logic, e.g., multi-channel MAC layers or video pipeline controllers. |
| DSP48E Slices | 640 - Supports parallel execution of 25×18-bit multiply-accumulate operations per slice, critical for FIR filtering and beamforming. |
| RocketIO GTP Transceivers | 16 channels @ 3.2 Gbps - Provides native SerDes for CPRI v4.1, OBSAI, or JESD204A links without external PHY. |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, Differential Signaling - Allows direct interfacing to DDR2/DDR3 memory, ADC/DAC, and optical module drivers. |
| Speed Grade | -3 - Guarantees timing closure at worst-case industrial temperature and voltage for designs targeting ≤500 MHz system clocks. |
| Package | FFG1738 - 1738-pin flip-chip BGA with 1.0 mm pitch; supports high-density routing and thermal dissipation up to 12 W typical. |
Pinout & Package
XC5VFX130T-3FFG1738C is housed in a 1738-pin flip-chip fine-pitch BGA (FFG) package with 1.0 mm ball pitch and 35 × 35 mm body size. Thermal pad on underside enables conduction cooling in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for logic and CLB circuitry; requires low-noise regulation and local decoupling. |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, SelectMAP interface, and transceiver reference circuits. |
| VCCO_0 | I/O bank power | Programmable 1.2–3.3 V output driver supply; sets voltage level for associated I/O pins in Bank 0. |
| MRCC/MRCC_N | Multi-Gigabit transceiver clock input | Differential pair accepting 100–625 MHz reference clocks for GTP PLL lock and data recovery. |
| INIT_B | Configuration status indicator | Open-drain active-low signal indicating successful bitstream loading or configuration error detection. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated GTP transceivers | Eliminates need for external SerDes PHYs in wireless infrastructure backhaul and fronthaul interfaces. |
| Partial reconfiguration support | Enables dynamic function swapping (e.g., modulation scheme change) without full FPGA reset or system interruption. |
| Block RAM with ECC | Provides single-bit error correction for safety-critical buffer storage in avionics and medical imaging subsystems. |
| DCM and PLL clock management | Allows jitter reduction, frequency synthesis, and phase alignment across multiple clock domains within one device. |
Applications
| Wireless Base Station Fronthaul | Radar Signal Processing |
|---|---|
Use Scenario: Interfacing between remote radio head (RRH) and baseband unit (BBU) using CPRI protocol over fiber. IC Role / Device Role / Timing Role: FPGA implements CPRI framing, 8b/10b encoding/decoding, and elastic buffer compensation for latency variation. Use Value: XC5VFX130T-3FFG1738C's 16 GTP transceivers directly support eight bidirectional CPRI lanes at 3.072 Gbps each, reducing component count by 4+ external PHYs. | Use Scenario: Real-time pulse-Doppler processing and beam steering in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA executes matched filtering, FFT computation, and adaptive nulling algorithms on digitized RF samples. Use Value: XC5VFX130T-3FFG1738C's 640 DSP48E slices deliver ≥2.5 GOPS at 200 MHz, enabling sub-millisecond response for threat tracking loops. |
| Medical Imaging Data Acquisition | High-Speed Test Equipment |
Use Scenario: Digitizing and preprocessing ultrasound echo signals from 128+ channel transducer arrays. IC Role / Device Role / Timing Role: FPGA performs channel gain calibration, beamforming summation, and digital down-conversion before transfer to host processor. Use Value: XC5VFX130T-3FFG1738C's 130K logic cells accommodate parallel 128-channel processing pipelines with <50 ns latency per stage. | Use Scenario: Generating and analyzing multi-gigabit serial patterns in automated test equipment for ASIC validation. IC Role / Device Role / Timing Role: FPGA acts as pattern generator and error detector with real-time BER calculation and eye diagram sampling. Use Value: XC5VFX130T-3FFG1738C's -3 speed grade ensures setup/hold timing margin for 3.2 Gbps PRBS31 sequences across industrial temperature range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2588K logic cells, 64 GTY transceivers @ 32.75 Gbps, higher power consumption. | Targets next-generation 5G NR mmWave and AI-accelerated test systems requiring >10 Gbps serial bandwidth. | Select when migrating from Virtex-5 legacy designs needing higher throughput and newer toolchain support (Vivado 2020.2+). |
| XC7VX690T-2FFG1927I | Virtex-7 architecture, 693,120 logic cells, 36 GTX transceivers @ 13.1 Gbps, lower static power than XC5VFX130T. | Suitable for cost-optimized upgrades where 3.2 Gbps transceivers remain sufficient and PCIe Gen3 integration is required. | Choose for drop-in replacement in existing PCBs using 1927-pin FFG package; same footprint but requires updated bitstream and timing constraints. |
Compared with XC5VFX130T-3FFG1738C, XCVU9P-2FLGA2104I offers 2.5× more logic and 10× transceiver speed but demands new thermal and power delivery design; XC7VX690T-2FFG1927I provides 5.3× logic density at 3.2 Gbps transceiver compatibility and identical pinout family, easing migration path.
Availability
XC5VFX130T-3FFG1738C is available at Aetrix Electronics and suitable for wireless infrastructure, defense radar, and medical imaging systems requiring stable component supply and long-term obsolescence management.
Supply support for XC5VFX130T-3FFG1738C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.
The Virtex-5 family was engineered for high-bandwidth, compute-intensive applications in aerospace, defense, and wired/wireless communications where deterministic timing and integrated transceivers are essential.
FAQ
What is the maximum supported transceiver data rate for XC5VFX130T-3FFG1738C?
The XC5VFX130T-3FFG1738C integrates RocketIO GTP transceivers rated for operation up to 3.2 Gbps per channel. This rate is guaranteed across the full industrial temperature range (-40°C to +100°C) and supports protocols including CPRI v4.1, Serial RapidIO 1.2, and PCI Express Gen1. The XC5VFX130T-3FFG1738C does not support rates above 3.2 Gbps without external retiming.
Does XC5VFX130T-3FFG1738C support partial reconfiguration?
Yes, XC5VFX130T-3FFG1738C supports hardware-based partial reconfiguration through its Internal Configuration Access Port (ICAP). This capability allows dynamic modification of specific logic regions while the rest of the design remains operational-critical for applications like adaptive radar waveform switching or protocol stack updates in wireless base stations. The XC5VFX130T-3FFG1738C requires use of Xilinx ISE 14.7 or later tools for implementation.
What I/O standards are supported by XC5VFX130T-3FFG1738C?
XC5VFX130T-3FFG1738C supports LVCMOS (1.2 V to 3.3 V), LVDS, BLVDS, RSDS, differential SSTL, and HSTL I/O standards across its 700+ user I/O pins. Each I/O bank is independently configurable for voltage and standard, enabling direct connection to DDR2/DDR3 memory, analog front-end ADCs, and optical module drivers without level-shifting components. The XC5VFX130T-3FFG1738C does not support MIPI D-PHY or LPDDR4 native interfaces.
What is the purpose of the MRCC and MRCC_N pins on XC5VFX130T-3FFG1738C?
The MRCC and MRCC_N pins form a dedicated differential input pair for supplying reference clocks to the RocketIO GTP transceivers' PLLs. These pins accept frequencies from 100 MHz to 625 MHz and must be terminated with 100 Ω differential impedance. They are distinct from general-purpose clock inputs and are required for stable transceiver lock and low-jitter data recovery. The XC5VFX130T-3FFG1738C requires this dedicated reference for all active GTP channels.
Is XC5VFX130T-3FFG1738C qualified for automotive applications?
No, XC5VFX130T-3FFG1738C is specified only for industrial temperature range (-40°C to +100°C junction) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, fault injection coverage, and extended lifetime qualification. For automotive ADAS or infotainment systems, AMD recommends evaluating the XA series derivatives or newer Versal ACAP automotive-grade variants. The XC5VFX130T-3FFG1738C remains appropriate for industrial and defense platforms meeting MIL-STD-883 Class B screening requirements.
XC5VFX130T-3FFG1738C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 FXT
- Package/Case:
- 1738-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10240
- Number of Logic Elements/Cells:
- 131072
- Total RAM Bits:
- 10985472
- Number of I/O:
- 840
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1738-FCBGA (42.5x42.5)
XC5VFX130T-3FFG1738C FAQ
1.How can I place an order for XC5VFX130T-3FFG1738C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VFX130T-3FFG1738C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VFX130T-3FFG1738C reliable?
The price and inventory of XC5VFX130T-3FFG1738C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VFX130T-3FFG1738C is usually 5 days.
3.What payment methods are accepted for XC5VFX130T-3FFG1738C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VFX130T-3FFG1738C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VFX130T-3FFG1738C?
XC5VFX130T-3FFG1738C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VFX130T-3FFG1738C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VFX130T-3FFG1738C?
For technical support, including XC5VFX130T-3FFG1738C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VFX130T-3FFG1738C requirements.
6.How does Aetrix verify that XC5VFX130T-3FFG1738C is sourced from the original manufacturer or authorized distributors?
All XC5VFX130T-3FFG1738C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VFX130T-3FFG1738C meets industry standards.
7.What is the process for return or replacement of XC5VFX130T-3FFG1738C?
All XC5VFX130T-3FFG1738C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VFX130T-3FFG1738C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VFX130T-3FFG1738C part is unused and in its original packaging.
Return procedure for XC5VFX130T-3FFG1738C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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