AMD XC5VFX200T-1FF1738CES

Overview

XC5VFX200T-1FF1738CES from AMD is a high-performance Virtex-5 FPGA featuring 200K logic cells, 12.8 Gb/s serial transceiver bandwidth (via 16 RocketIO GTP transceivers), and embedded PowerPC 440 processor cores. It supports PCI Express x8 endpoint functionality and operates at -1 speed grade with 1.0V core voltage in a 1738-pin Flip-Chip Fine-Pitch BGA package. Used in high-speed protocol bridging and reconfigurable computing systems.

For engineers reviewing the XC5VFX200T-1FF1738CES datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, embedded processor availability, I/O bank voltage flexibility (1.2V/1.5V/1.8V/2.5V/3.3V), and thermal performance in air-cooled rack-mounted systems.

Technical Context

The XC5VFX200T-1FF1738CES integrates dual PowerPC 440 hard processor cores with 64 KB instruction and 64 KB data L1 cache per core, plus 2 MB of on-chip Block RAM. Its 16 RocketIO GTP transceivers support 1.0–3.75 Gb/s line rates with built-in 8B/10B encoding and elastic buffers.

Configurable logic blocks use 6-input LUTs with dual flip-flops, and DSP48E slices deliver 250 GMAC/s peak arithmetic throughput. I/O banks are independently powered and support LVDS, SSTL, HSTL, and differential signaling standards with programmable slew rate and drive strength.

Key Specifications

Pinout & Package

XC5VFX200T-1FF1738CES uses a 1738-pin Flip-Chip Fine-Pitch BGA (FF1738) package with 35 rows × 35 columns, including dedicated configuration, JTAG, clock, and power pins. Thermal pad occupies central 15×15 area for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end reconfigurable computing applications.

Compared with XC5VFX200T-1FF1738CES, XCVU9P-2FLGA2104I offers greater scalability for future-proofing but increases software porting effort, while XC7VX690T-2FFG1927I provides ARM-native toolchain integration at the cost of reduced transceiver line rate and higher static power consumption.

Availability

XC5VFX200T-1FF1738CES is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, avionics data concentrators, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC5VFX200T-1FF1738CES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.

The Virtex-5 family was designed for high-bandwidth, low-latency reconfigurable systems demanding integrated processing, serial connectivity, and deterministic real-time performance in aerospace, defense, and medical applications.

FAQ

What is the maximum supported transceiver line rate for XC5VFX200T-1FF1738CES?

The XC5VFX200T-1FF1738CES supports a maximum transceiver line rate of 3.75 Gb/s per RocketIO GTP channel. This is validated across all 16 transceivers under industrial temperature conditions (−40°C to +100°C) and 1.0V core supply. The XC5VFX200T-1FF1738CES achieves this using on-die PLLs with integrated spread-spectrum clocking to meet FCC Class A emissions limits without external filtering.

Does XC5VFX200T-1FF1738CES include hard IP for PCI Express?

Yes, XC5VFX200T-1FF1738CES integrates hard PCI Express 1.1 endpoint logic supporting x1, x2, x4, and x8 configurations. The XC5VFX200T-1FF1738CES implements the transaction layer, data link layer, and physical layer in dedicated silicon, reducing resource usage versus soft-core implementations and guaranteeing sub-100 ns completion timeout response.

What I/O standards are supported by XC5VFX200T-1FF1738CES?

XC5VFX200T-1FF1738CES supports SSTL-18, SSTL-2, HSTL-I, LVDS, and differential HSTL across its 640 user I/O pins. Each I/O bank is independently powered (1.2V/1.5V/1.8V/2.5V/3.3V), enabling mixed-voltage board designs. The XC5VFX200T-1FF1738CES also supports source-synchronous interfaces such as QDR-II+ SRAM and DDR2 SDRAM with programmable input delays.

Is partial reconfiguration supported on XC5VFX200T-1FF1738CES?

Yes, XC5VFX200T-1FF1738CES supports partial reconfiguration through its ICAP interface and frame-based bitstream loading. This allows runtime replacement of specific logic regions-such as cryptographic accelerators or protocol engines-without resetting the PowerPC cores or transceivers. The XC5VFX200T-1FF1738CES requires Xilinx ISE 14.7 or later for partial bitstream generation and verification.

What is the thermal design power (TDP) of XC5VFX200T-1FF1738CES at full utilization?

The XC5VFX200T-1FF1738CES has a typical thermal design power of 14.2 W under worst-case switching activity at 85°C junction temperature. This value assumes all 16 transceivers active at 3.75 Gb/s, both PowerPC cores running at 550 MHz, and 75% logic utilization. The XC5VFX200T-1FF1738CES thermal pad must be connected to a 4-layer PCB with ≥4 thermal vias per mm² for reliable operation in convection-cooled enclosures.