AMD XC5VFX200T-1FFG1738C
- Part No.:
- XC5VFX200T-1FFG1738C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1738-BBGA, FCBGA
- Datasheet:
-
XC5VFX200T-1FFG1738C.pdf
- Description:
- IC FPGA 960 I/O 1738FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,524
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC5VFX200T-1FFG1738C from AMD is a Virtex-5 FXT family FPGA featuring 200K logic cells, 12.8 Gbps RocketIO GTP transceivers, and integrated PowerPC 440 processor cores. It implements high-speed serial I/O, DSP processing, and embedded control in aerospace-grade reconfigurable systems.
For engineers reviewing the XC5VFX200T-1FFG1738C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver data rate, embedded processor availability, logic density, thermal performance in conduction-cooled modules, and radiation-tolerant configuration memory architecture.
Technical Context
The XC5VFX200T-1FFG1738C integrates dual PowerPC 440 hard-core processors with 64 KB instruction and 64 KB data L1 caches, supporting symmetric multiprocessing. Its 24 RocketIO GTP transceivers operate at 1.0–3.75 Gbps per lane with built-in PRBS generators and error detectors.
Configurable logic blocks use 6-input LUTs with dual-register outputs; block RAM is organized as 36 Kb primitives with true dual-port capability. The device supports SelectIO standards including LVDS, SSTL-18/25, and HSTL Class I/III across 720 user I/O pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 200,160 – determines maximum combinational and sequential logic capacity for system-on-chip integration |
| GTP Transceivers | 24 × 1.0–3.75 Gbps – enables multi-lane serial protocols like Aurora, Serial RapidIO, and CPRI without external PHYs |
| Block RAM | 12,544 Kbits – supports large on-die buffering for video frame stores, packet queues, or FFT coefficient tables |
| Embedded Processor | Dual PowerPC 440 @ 550 MHz – provides real-time deterministic control co-processing alongside programmable logic |
| I/O Pins | 720 user-configurable – accommodates wide parallel buses, high-pin-count memory interfaces, or dense sensor arrays |
| Package | FFG1738 (Flip-Chip BGA, 1738-pin, 35×35 mm, 1.0 mm pitch) – optimized for low-inductance power delivery and thermal dissipation in ruggedized enclosures |
Pinout & Package
XC5VFX200T-1FFG1738C is housed in a 1738-pin Flip-Chip Ball Grid Array (FFG) package with 35×35 mm footprint, 1.0 mm ball pitch, and dedicated VCCINT/VCCAUX/VCCO banks for independent voltage domain management. Thermal and mechanical design supports conduction cooling via cold plate interface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core logic supply | 1.0 V ±3% input required; powers CLBs, interconnect, and embedded RAM |
| VCCAUX | Auxiliary supply | 2.5 V ±3% input powers configuration logic, clock management, and JTAG |
| VCCO_0 | I/O bank supply | Programmable 1.2–3.3 V output drive voltage per bank; supports mixed-voltage interfaces |
| MRCC/MRCC_N | Multi-Gigabit RefClk input | Differential reference clock pair for GTP transceivers; 100–300 MHz range |
| PROG_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error during startup |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 440 cores | Enables tightly coupled software-defined control with hardware acceleration in same die |
| 24 RocketIO GTP transceivers | Eliminates need for external SerDes in radar front-end, avionics data concentrators, and telemetry links |
| System Monitor (XADC) | On-chip 17-channel 1 MSPS analog-to-digital converter for real-time temperature, voltage, and current monitoring |
| PCI Express Endpoint v1.1 | Integrated hard IP block supporting x1/x2/x4 lanes with full link training and error reporting |
| Partial Reconfiguration support | Allows dynamic logic module swapping without interrupting active system operation or processor execution |
Applications
| Radar Signal Processing | Aerospace Data Concentrator |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in airborne synthetic aperture radar (SAR) systems. IC Role / Device Role / Timing Role: FPGA fabric executes beamforming and CFAR algorithms; PowerPC cores manage scan sequencing and health reporting. Use Value: 200K logic cells and 24 GTP lanes enable simultaneous multi-channel receive path processing at 2.5 Gbps aggregate throughput. | Use Scenario: Aggregation of ARINC 429, MIL-STD-1553, and discrete I/O from flight control surfaces in UAVs. IC Role / Device Role / Timing Role: Central I/O hub with protocol translation, time-stamping, and deterministic packet scheduling. Use Value: 720 I/O pins and mixed-voltage banks allow direct connection to legacy avionics buses without level-shifter components. |
| Satellite Payload Controller | Electronic Warfare Front-End |
Use Scenario: Onboard command execution, telemetry formatting, and radiation-hardened configuration scrubbing in LEO satellites. IC Role / Device Role / Timing Role: Dual PowerPC 440 handles mission-critical software stack; FPGA fabric implements custom encryption and CRC offload. Use Value: System Monitor (XADC) provides closed-loop thermal regulation and single-event upset detection for extended orbital life. | Use Scenario: Wideband digital receiver with real-time channelization and adaptive jamming waveform generation. IC Role / Device Role / Timing Role: High-speed ADC interface + DSP pipeline + RF DAC control in compact SWaP-constrained pod. Use Value: Block RAM depth and 36 Kb primitives support 1024-point FFTs and polyphase filter banks with sub-microsecond latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance reconfigurable computing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC5VLX330T-1FFG1738C | No embedded PowerPC cores; higher logic density (330K cells); identical GTP transceiver count and package | Better suited for pure logic-intensive tasks like packet inspection or video encoding where soft-core control suffices | Select when processor integration is unnecessary and maximum fabric utilization is prioritized |
| Xilinx XC5VSX95T-1FFG1136C | Faster DSP48E slices (256 vs. 192), smaller 1136-pin FFG package, no PowerPC cores, lower transceiver count (12 GTP) | Optimized for compute-accelerated signal processing in size-constrained platforms with moderate serial bandwidth needs | Choose for space-constrained EW subsystems requiring high arithmetic throughput but not full radar-level I/O or processing concurrency |
Compared with XC5VFX200T-1FFG1738C, the XC5VLX330T offers greater logic capacity without embedded processors, while the XC5VSX95T delivers denser DSP resources in a smaller footprint-neither provides the integrated dual-PowerPC + high-lane-count transceiver combination essential for full-spectrum radar or satellite payload control.
Availability
XC5VFX200T-1FFG1738C is available at Aetrix Electronics and suitable for radar signal processing, aerospace data concentration, and satellite payload control requiring stable component supply across extended production lifecycles.
Supply support for XC5VFX200T-1FFG1738C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and aerospace applications.
The Virtex-5 FXT family was engineered specifically for high-bandwidth, processor-integrated reconfigurable systems in defense, space, and high-reliability industrial environments.
FAQ
What is the operating temperature range for XC5VFX200T-1FFG1738C?
The XC5VFX200T-1FFG1738C is rated for commercial temperature range (0°C to +85°C ambient). It is not qualified for extended industrial or military temperature grades; thermal derating must be applied above 70°C case temperature in conduction-cooled configurations. The device's System Monitor (XADC) provides real-time die temperature feedback to support dynamic thermal management in deployed XC5VFX200T-1FFG1738C systems.
Does XC5VFX200T-1FFG1738C support partial reconfiguration?
Yes, XC5VFX200T-1FFG1738C supports hardware-accelerated partial reconfiguration through Xilinx ISE design tools and associated bitstream generation flow. This allows runtime replacement of logic modules-such as modulator/demodulator blocks in electronic warfare systems-without resetting the PowerPC cores or halting active I/O channels. Configuration time for a typical 10K-LUT module is under 12 ms using ICAP interface on XC5VFX200T-1FFG1738C.
What configuration modes are supported by XC5VFX200T-1FFG1738C?
XC5VFX200T-1FFG1738C supports Master SelectMAP, Slave SelectMAP, Serial Peripheral Interface (SPI), and JTAG configuration modes. Master SelectMAP enables autonomous boot from external flash; SPI mode supports quad-I/O for faster bitstream loading. All modes are accessible via dedicated configuration pins (e.g., CCLK, DIN, DOUT, BUSY) mapped to specific balls in the FFG1738 package of XC5VFX200T-1FFG1738C.
Is XC5VFX200T-1FFG1738C compatible with Xilinx Vivado tools?
No, XC5VFX200T-1FFG1738C requires Xilinx ISE Design Suite 14.7 or earlier for synthesis, place-and-route, and bitstream generation. Vivado does not support Virtex-5 architecture. Legacy ISE toolchain remains fully functional for XC5VFX200T-1FFG1738C development, including ChipScope Pro for in-system debugging and PlanAhead for floorplanning critical paths.
What is the maximum data rate supported by the RocketIO GTP transceivers in XC5VFX200T-1FFG1738C?
The RocketIO GTP transceivers in XC5VFX200T-1FFG1738C support a maximum line rate of 3.75 Gbps per lane. This is validated across all 24 transceivers under worst-case voltage and temperature conditions. Applications such as Serial RapidIO Gen1 (1.25/2.5 Gbps) and CPRI Option 3 (3.072 Gbps) operate within specification margins on XC5VFX200T-1FFG1738C without retiming or gearbox logic.
XC5VFX200T-1FFG1738C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 FXT
- Package/Case:
- 1738-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 15360
- Number of Logic Elements/Cells:
- 196608
- Total RAM Bits:
- 16809984
- Number of I/O:
- 960
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1738-FCBGA (42.5x42.5)
XC5VFX200T-1FFG1738C FAQ
1.How can I place an order for XC5VFX200T-1FFG1738C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VFX200T-1FFG1738C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VFX200T-1FFG1738C reliable?
The price and inventory of XC5VFX200T-1FFG1738C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VFX200T-1FFG1738C is usually 5 days.
3.What payment methods are accepted for XC5VFX200T-1FFG1738C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VFX200T-1FFG1738C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VFX200T-1FFG1738C?
XC5VFX200T-1FFG1738C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VFX200T-1FFG1738C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VFX200T-1FFG1738C?
For technical support, including XC5VFX200T-1FFG1738C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VFX200T-1FFG1738C requirements.
6.How does Aetrix verify that XC5VFX200T-1FFG1738C is sourced from the original manufacturer or authorized distributors?
All XC5VFX200T-1FFG1738C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VFX200T-1FFG1738C meets industry standards.
7.What is the process for return or replacement of XC5VFX200T-1FFG1738C?
All XC5VFX200T-1FFG1738C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VFX200T-1FFG1738C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VFX200T-1FFG1738C part is unused and in its original packaging.
Return procedure for XC5VFX200T-1FFG1738C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC5VFX200T-1FFG1738C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

