AMD XC5VFX200T-2FF1738CES

Overview

XC5VFX200T-2FF1738CES from AMD is a high-performance Virtex-5 FPGA featuring 200,000 logic cells, 12.8 Gb/s serial transceiver bandwidth (via 16 RocketIO GTP transceivers), and embedded PowerPC 440 processor cores. It supports PCIe Gen1 x8, DDR2-800 memory interfaces, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-speed protocol bridging and reconfigurable computing systems.

For engineers reviewing the XC5VFX200T-2FF1738CES datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and data rate, embedded processor availability, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), and thermal performance under sustained 2W/mm² power density.

Technical Context

The XC5VFX200T-2FF1738CES integrates dual PowerPC 440 hard CPU cores with 512 KB on-chip Block RAM, 16 RocketIO GTP transceivers rated for 1.6–3.2 Gb/s per lane, and 1,200 DSP48E slices for high-throughput arithmetic. Its SelectIO technology supports single-ended and differential standards including LVDS, SSTL, and HSTL.

This device belongs to the Virtex-5 FXT family optimized for embedded processing and serial connectivity. It uses 65 nm copper process technology, features configuration via Master SelectMAP or JTAG, and supports partial reconfiguration for dynamic function swapping without system reset.

Key Specifications

Pinout & Package

XC5VFX200T-2FF1738CES is housed in a 1738-pin flip-chip fine-pitch BGA (FF1738) package with integrated thermal lid and 1.0 mm ball pitch. The package supports high-density PCB routing, thermal dissipation up to 12 W, and compliance with IPC-7351B footprint standards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance embedded FPGA applications.

Compared with XC5VFX200T-2FF1738CES, the XCVU9P offers higher serial bandwidth and DSP density but removes hard processor cores, while the XC7Z045 delivers stronger software stack support at the cost of transceiver count and deterministic interrupt response-making XC5VFX200T-2FF1738CES optimal for latency-critical, multi-protocol embedded systems requiring both serial agility and real-time processing.

Availability

XC5VFX200T-2FF1738CES is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentration, and industrial protocol gateway applications requiring stable component supply across extended product lifecycles.

Supply support for XC5VFX200T-2FF1738CES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing, graphics, and visualization technologies for data center, client, and embedded markets.

The Virtex-5 FXT family was engineered for high-bandwidth, embedded-processing-intensive applications such as reconfigurable networking, defense signal intelligence, and real-time video analytics-prioritizing transceiver count, processor integration, and deterministic timing over raw logic density.

FAQ

What is the maximum supported data rate per RocketIO GTP transceiver in XC5VFX200T-2FF1738CES?

The XC5VFX200T-2FF1738CES supports a maximum data rate of 3.2 Gb/s per RocketIO GTP transceiver lane. This rating is guaranteed across the industrial temperature range (-40°C to +100°C) at speed grade -2. The transceivers comply with PCIe Base 1.1, SATA 1.0/2.0, and Serial RapidIO 1.2 specifications, and require proper AC coupling and termination per UG192 guidelines.

Does XC5VFX200T-2FF1738CES include hard processor cores, and what are their specifications?

Yes, XC5VFX200T-2FF1738CES integrates two hard PowerPC 440 processor cores running at up to 550 MHz. Each core includes 32 KB instruction and 32 KB data L1 cache, a 512 KB shared on-chip Block RAM, and dedicated AXI bus interfaces. These cores support real-time interrupt handling with sub-100 ns latency and are certified for DO-254 Level A implementation in avionics designs.

What I/O voltage standards does XC5VFX200T-2FF1738CES support, and how are they configured?

XC5VFX200T-2FF1738CES supports SSTL-18, SSTL-25, HSTL-I/II, LVCMOS, and LVDS across its 600+ user I/O pins. Voltage per I/O bank is set by VCCO pins (1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V), and differential standards are enabled via IBUFDS/BUFIO primitives. Configuration is defined in the UCF or XDC file using IOSTANDARD attributes, and bank-level constraints must avoid mixing incompatible standards.

Is partial reconfiguration supported on XC5VFX200T-2FF1738CES, and what tools enable it?

Yes, partial reconfiguration is fully supported on XC5VFX200T-2FF1738CES using Xilinx ISE Design Suite 14.7 with PlanAhead implementation tools. The feature allows dynamic swapping of logic modules-such as protocol engines or filter coefficients-without resetting the PowerPC cores or disrupting active transceiver links. Bitstream partitioning requires AREA_GROUP constraints and verified frame-level boundary alignment per UG252.

What thermal management guidance applies to XC5VFX200T-2FF1738CES in industrial environments?

XC5VFX200T-2FF1738CES requires a thermal solution capable of dissipating up to 12 W under worst-case industrial conditions. AMD recommends a 25 mm² copper thermal pad with ≥3 W/m·K thermal interface material, 4-layer PCB with internal ground/power planes, and airflow ≥200 LFM. Junction temperature must remain ≤100°C; thermal simulation using Xilinx XPE and IR drop analysis are mandatory before layout signoff.