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AMD XC5VFX30T-1FFG665CES

Part No.:
XC5VFX30T-1FFG665CES
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
665-BBGA, FCBGA
Datasheet:
AetrixXC5VFX30T-1FFG665CES.pdf
Description:
IC FPGA 360 I/O 665FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,448

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Product details

Overview

XC5VFX30T-1FFG665CES from AMD is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps RocketIO GTP transceivers, and integrated PowerPC 440 processor cores. It supports PCI Express x4 endpoint functionality and operates at -1 speed grade with 1.0V core voltage. This device targets high-bandwidth embedded processing in radar signal conditioning systems.

For engineers reviewing the XC5VFX30T-1FFG665CES datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver data rate, embedded processor availability, I/O bank voltage flexibility, and thermal performance in conduction-cooled enclosures.

Technical Context

The XC5VFX30T-1FFG665CES implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (BRAM), and DSP48E slices. It integrates two PowerPC 440 hard-core processors running at up to 550 MHz, each with 32 KB instruction and 32 KB data L1 cache.

RocketIO GTP transceivers support protocols including SATA, Serial RapidIO, and PCIe Gen1. The device uses SelectIO technology with support for LVDS, SSTL, HSTL, and differential signaling standards across 16 I/O banks.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells30,816 - determines maximum combinational/sequential logic capacity for custom IP integration
GTP Transceivers8 × 2.5 Gbps - enables dual-lane Serial RapidIO or single-lane PCIe x4 physical layer
Block RAM1,584 Kbits - provides on-die memory for buffering, FIFOs, or lookup tables without external memory
PowerPC Cores2 × 440 - delivers deterministic real-time control and host interface management alongside programmable logic
I/O Banks16 - allows independent voltage assignment per bank for mixed-voltage system interfacing
Speed Grade-1 - specifies maximum operating frequency for timing-critical paths at industrial temperature range

Pinout & Package

XC5VFX30T-1FFG665CES is housed in a 665-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35 mm × 35 mm body size and 1.0 mm ball pitch. Thermal characteristics include 1.9°C/W junction-to-case resistance under standard mounting conditions.

Pin/TerminalCircuit RoleDesign Meaning
MGTREFCLK0P/NDifferential reference clock inputProvides low-jitter clock source for GTP transceiver PLLs; requires 100 Ω differential termination
POWERDOWNActive-low transceiver shutdownAsserting this signal disables GTP analog circuitry to reduce dynamic power by >90%
PROG_BConfiguration initiationPulling low resets configuration logic and initiates reconfiguration from external PROM or processor
INIT_BConfiguration status indicatorOpen-drain output signals completion of bitstream loading and internal CRC verification
CLK0/CLK1Dedicated global clock inputsConnect to low-skew clock distribution network; support up to 550 MHz operation with BUFG routing

Key Features

FeatureDesign Value
Integrated PowerPC 440 coresEnables tightly coupled software-defined control and hardware-accelerated datapath co-processing
RocketIO GTP transceiversSupports protocol-agnostic serial link implementation with programmable pre-emphasis and receiver equalization
SelectIO technologyAllows per-bank I/O standard selection including 1.2V–3.3V voltage support and slew-rate control
Partial reconfiguration capabilityPermits dynamic logic module swapping during operation without full device reset or service interruption

Applications

Radar Signal ProcessingMedical Imaging Backend

Use Scenario: Real-time pulse-Doppler processing in airborne SAR systems with adaptive beamforming.

IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and STAP algorithms while PowerPC cores manage sensor fusion and Ethernet packetization.

Use Value: On-chip transceivers interface directly to ADC/DAC FMC mezzanine cards at 1.25 GSPS, eliminating external serializer/deserializer latency.

Use Scenario: High-resolution ultrasound beamformer with 128-channel echo digitization and digital beam synthesis.

IC Role / Device Role / Timing Role: XC5VFX30T-1FFG665CES serves as the central timing and data aggregation hub between front-end ASICs and PCIe Gen1 host interface.

Use Value: Integrated BRAM buffers 256-sample channel delay lines; GTP links synchronize multi-board acquisition with <5 ns skew.

Avionics Data ConcentratorIndustrial Protocol Gateway

Use Scenario: ARINC 664 (AFDX) end-system implementing virtual link switching and health monitoring.

IC Role / Device Role / Timing Role: Configurable logic implements AFDX MAC layer and traffic shaping; PowerPC runs DO-178B certified stack.

Use Value: Dual-core isolation allows separation of safety-critical communication tasks from non-critical diagnostics reporting.

Use Scenario: Fieldbus-to-Ethernet gateway bridging PROFIBUS DP and Modbus TCP in hazardous area control cabinets.

IC Role / Device Role / Timing Role: XC5VFX30T-1FFG665CES acts as protocol translation engine with deterministic cycle timing for cyclic data exchange.

Use Value: SelectIO banks interface simultaneously to 5V PROFIBUS PHY and 3.3V Ethernet PHY without level-shifter components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance embedded FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC5VLX30T-1FFG665CNo PowerPC cores; 30K logic cells; same package and speed gradeLacks embedded processor; suitable only for pure logic accelerationSelect when software control is handled externally and transceiver count matches
XCVU3P-2FFVD1760EVirtex UltraScale+; 345K logic cells; 16.3 Gbps GTY transceivers; different packageHigher bandwidth and density but requires PCB redesign and new toolchainChoose for next-generation designs needing >10 Gbps serial I/O or AI inference acceleration

Compared with XC5VFX30T-1FFG665CES, XC5VLX30T-1FFG665C removes processor overhead but sacrifices integrated control, while XCVU3P-2FFVD1760E offers generational improvements at the cost of migration effort and higher BOM cost.

Availability

XC5VFX30T-1FFG665CES is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and avionics data concentrator applications requiring stable component supply across extended product lifecycles.

Supply support for XC5VFX30T-1FFG665CES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for aerospace, defense, and industrial markets.

The Virtex-5 family was engineered for embedded systems demanding both programmable logic density and hardened processor subsystems in a single die, targeting applications where deterministic latency and protocol flexibility are critical.

FAQ

What is the maximum operating temperature for XC5VFX30T-1FFG665CES?

The XC5VFX30T-1FFG665CES is rated for industrial temperature range (–40°C to +100°C case temperature). Its thermal design supports operation at full speed grade –1 under continuous 2.5 Gbps transceiver activity when mounted with standard thermal interface material and 2-layer copper heatsink.

Does XC5VFX30T-1FFG665CES support partial reconfiguration?

Yes, XC5VFX30T-1FFG665CES supports partial reconfiguration through Xilinx ISE Design Suite v14.7 tools. This capability allows dynamic replacement of logic modules-such as filter coefficients or protocol engines-without resetting the PowerPC cores or interrupting active transceiver links.

What JTAG configuration modes does XC5VFX30T-1FFG665CES support?

XC5VFX30T-1FFG665CES supports JTAG boundary-scan (IEEE 1149.1) for testing and in-system programming. It also enables configuration via Master SelectMAP, Slave SelectMAP, and Serial Peripheral Interface (SPI) modes using external PROM or processor-controlled boot.

Can XC5VFX30T-1FFG665CES interface directly with DDR2 SDRAM?

Yes, XC5VFX30T-1FFG665CES includes dedicated DDR2 memory controller logic supporting 400 Mbps data rates. It interfaces natively with 1.8V DDR2 components using DQS-based capture and phase-aligned clocking without external PHY.

Is XC5VFX30T-1FFG665CES RoHS compliant?

Yes, XC5VFX30T-1FFG665CES is RoHS-6 compliant (lead-free, mercury-free, cadmium-free, hexavalent chromium-free, PBB-free, PBDE-free) and meets JEDEC J-STD-020D moisture sensitivity level 3 requirements for surface-mount assembly.

XC5VFX30T-1FFG665CES Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 FXT
Package/Case:
665-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
2560
Number of Logic Elements/Cells:
32768
Total RAM Bits:
2506752
Number of I/O:
360
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
665-FCBGA (27x27)

XC5VFX30T-1FFG665CES FAQ

1.How can I place an order for XC5VFX30T-1FFG665CES through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VFX30T-1FFG665CES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VFX30T-1FFG665CES reliable?

The price and inventory of XC5VFX30T-1FFG665CES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VFX30T-1FFG665CES is usually 5 days.

3.What payment methods are accepted for XC5VFX30T-1FFG665CES?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VFX30T-1FFG665CES transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VFX30T-1FFG665CES?

XC5VFX30T-1FFG665CES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VFX30T-1FFG665CES order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VFX30T-1FFG665CES?

For technical support, including XC5VFX30T-1FFG665CES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VFX30T-1FFG665CES requirements.

6.How does Aetrix verify that XC5VFX30T-1FFG665CES is sourced from the original manufacturer or authorized distributors?

All XC5VFX30T-1FFG665CES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VFX30T-1FFG665CES meets industry standards.

7.What is the process for return or replacement of XC5VFX30T-1FFG665CES?

All XC5VFX30T-1FFG665CES units undergo pre-shipment inspection (PSI). If there is an issue with XC5VFX30T-1FFG665CES, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VFX30T-1FFG665CES part is unused and in its original packaging.

Return procedure for XC5VFX30T-1FFG665CES:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VFX30T-1FFG665CES Tags

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