AMD XC5VFX30T-1FFG665I
- Part No.:
- XC5VFX30T-1FFG665I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 665-BBGA, FCBGA
- Datasheet:
-
XC5VFX30T-1FFG665I.pdf
- Description:
- IC FPGA 360 I/O 665FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC5VFX30T-1FFG665I from AMD is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps RocketIO GTP transceivers, and integrated PowerPC 440 processor cores. It supports PCI Express x4 endpoint functionality and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-speed serial communication and embedded processing applications.
For engineers reviewing the XC5VFX30T-1FFG665I datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver data rate, embedded processor availability, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), and thermal performance under sustained logic utilization.
Technical Context
The XC5VFX30T-1FFG665I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (BRAM), and DSP48E slices. It integrates dual PowerPC 440 hard-core processors with 32 kB instruction and 32 kB data cache per core, and supports coherent cache operation via on-chip PLB bus.
This device includes 12 RocketIO GTP transceivers capable of 1.0–2.5 Gbps operation, supporting protocols including SATA, Serial RapidIO, and PCIe Gen1. I/O banks are independently configurable for multiple voltage standards and support source-synchronous interfaces such as DDR2 SDRAM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 30,816 - determines maximum combinational and sequential logic capacity for custom digital functions |
| GTP Transceivers | 12 × 1.0–2.5 Gbps - enables multi-protocol serial connectivity without external PHYs |
| Block RAM | 1,584 kbits - provides on-die memory for FIFOs, buffers, and lookup tables |
| DSP Slices | 64 - supports fixed-point arithmetic acceleration for filtering and math-intensive algorithms |
| Embedded Processors | 2 × PowerPC 440 - delivers hard-core RISC execution for real-time control and boot management |
| I/O Standards | Supports 1.2 V to 3.3 V - allows direct interfacing with diverse peripheral voltage domains |
| Speed Grade | -1 - specifies timing closure margin for worst-case industrial temperature and voltage conditions |
Pinout & Package
XC5VFX30T-1FFG665I is housed in a 665-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35×35 mm body size and 1.0 mm ball pitch. The package supports thermal dissipation up to 12 W under typical operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V supply for FPGA logic and embedded processor cores |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration circuitry, clock management, and transceiver reference |
| VCCO_0 | I/O bank power | Configurable 1.2–3.3 V supply for Bank 0 I/Os, defining signal voltage levels |
| MR | Master reset | Asynchronous active-low reset that clears configuration and processor state |
| CLK_IN | Primary clock input | Dedicated differential input for system clock feeding DCM and PLL clock management |
| GTPTXN/GTPTXP | Transceiver differential output | Low-voltage differential signaling pair for high-speed serial transmit path |
| GTPRXN/GTPRXP | Transceiver differential input | Low-voltage differential signaling pair for high-speed serial receive path |
| PPC_0_DATA | PowerPC data bus | 32-bit multiplexed data interface shared between PowerPC cores and PLB interconnect |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PowerPC 440 cores | Enables deterministic real-time software execution alongside programmable logic without external microprocessor |
| RocketIO GTP transceivers | Reduces board-level component count by integrating SerDes with built-in encoding/decoding and clock recovery |
| Multi-standard I/O banks | Eliminates level-shifting components when interfacing with mixed-voltage peripherals such as DDR2, Ethernet PHYs, and ADCs |
| DCM and PLL clock management | Provides jitter-reduced clock synthesis, phase shifting, and frequency multiplication for synchronous system design |
| Partial reconfiguration support | Allows dynamic logic module updates during operation, enabling adaptive hardware functionality |
Applications
| High-Speed Communications | Defense Radar Processing |
|---|---|
Use Scenario: Line-card implementation in 10G Ethernet and CPRI-based wireless base stations. IC Role / Device Role / Timing Role: FPGA fabric handles packet classification and forwarding; GTP transceivers manage serial data links; PowerPC cores run control-plane software. Use Value: Single-chip integration reduces latency between protocol stack and physical layer while maintaining deterministic timing for time-sensitive traffic. | Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar front-ends. IC Role / Device Role / Timing Role: DSP48E slices execute FIR filter chains; BRAM buffers ADC sample streams; PowerPC manages sensor fusion and health monitoring. Use Value: Hardware-accelerated math combined with embedded control enables sub-millisecond response to target detection events. |
| Medical Imaging Interface | Industrial Machine Vision |
Use Scenario: High-bandwidth image acquisition and preprocessing in MRI and CT scanner subsystems. IC Role / Device Role / Timing Role: Configurable I/O interfaces directly connect to ADCs and LVDS camera sensors; logic fabric performs pixel correction and compression. Use Value: Support for 2.5 Gbps transceivers and multi-voltage I/O allows direct connection to high-resolution imaging sensors without glue logic. | Use Scenario: Smart camera controller handling multi-camera synchronization and real-time defect analysis. IC Role / Device Role / Timing Role: FPGA logic implements precise trigger distribution and frame buffering; PowerPC runs vision algorithm libraries and network stack. Use Value: Coexistence of hard-core processor and reconfigurable logic enables concurrent real-time I/O control and compute-intensive image analysis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance embedded FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX30T-1FFG665I | Lacks PowerPC 440 cores and GTP transceivers; retains same CLB count and I/O structure | Suitable for logic-intensive but non-serial, non-embedded-control applications | Select when serial connectivity and embedded processing are unnecessary and cost reduction is prioritized |
| XCVU9P-2FFVB2104I | UltraScale architecture with higher logic density (2,586K LC), 16.3 Gbps GTY transceivers, and dual Cortex-A53 cores | Targets next-generation systems requiring higher bandwidth, AI inference acceleration, and Linux-capable processing | Choose for migration paths demanding greater throughput, security features, and heterogeneous compute capability |
Compared with XC5VFX30T-1FFG665I, the XC5VLX30T variant trades embedded processing and serial I/O for lower unit cost and power, while the XCVU9P offers architectural advancement at higher complexity and thermal load-making XC5VFX30T-1FFG665I optimal for balanced embedded serial processing within legacy Virtex-5 infrastructure.
Availability
XC5VFX30T-1FFG665I is available at Aetrix Electronics and suitable for high-speed communications, defense radar processing, and medical imaging interface applications requiring stable component supply across extended product lifecycles.
Supply support for XC5VFX30T-1FFG665I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.
The Virtex-5 family was designed for applications demanding tightly coupled hardware and software execution, high-speed serial connectivity, and reliable operation in harsh environments-targeting aerospace, defense, and industrial automation markets.
FAQ
What is the maximum data rate supported by the transceivers in XC5VFX30T-1FFG665I?
The XC5VFX30T-1FFG665I integrates RocketIO GTP transceivers rated for 1.0–2.5 Gbps operation. Each transceiver supports protocol-specific encoding schemes and includes built-in clock data recovery. This data rate enables compliance with PCIe Gen1, SATA II, and Serial RapidIO 1.x standards. The XC5VFX30T-1FFG665I does not support rates beyond 2.5 Gbps per lane.
Does XC5VFX30T-1FFG665I include embedded processor cores?
Yes, XC5VFX30T-1FFG665I contains two hard-core PowerPC 440 processors, each with 32 kB instruction and 32 kB data cache. These cores operate independently and communicate via the on-chip Processor Local Bus (PLB). The XC5VFX30T-1FFG665I uses these cores for real-time control, configuration management, and boot code execution without requiring external microprocessors.
What I/O voltage standards are supported by XC5VFX30T-1FFG665I?
XC5VFX30T-1FFG665I supports I/O voltages ranging from 1.2 V to 3.3 V across independent I/O banks. Each bank can be configured for LVCMOS, LVTTL, SSTL, HSTL, or differential standards including LVDS and RSDS. This flexibility allows direct interfacing with DDR2 SDRAM, Ethernet PHYs, and analog-to-digital converters without external level shifters. The XC5VFX30T-1FFG665I requires proper VCCO assignment per bank during PCB design.
What is the operating temperature range for XC5VFX30T-1FFG665I?
The XC5VFX30T-1FFG665I is specified for industrial temperature operation from –40°C to +100°C. This rating applies to the junction temperature under defined thermal conditions and power dissipation limits. The -1 speed grade ensures timing closure across this full range. The XC5VFX30T-1FFG665I is not qualified for extended or military temperature grades unless explicitly marked with alternate suffixes.
Is partial reconfiguration supported on XC5VFX30T-1FFG665I?
Yes, XC5VFX30T-1FFG665I supports partial reconfiguration through its SelectMAP interface and dedicated configuration logic. This capability allows dynamic updating of specific logic regions while the rest of the device remains operational. Partial reconfiguration is used in applications such as adaptive filtering, protocol switching, and runtime hardware optimization. The XC5VFX30T-1FFG665I requires use of Xilinx ISE Design Suite 14.7 or earlier with appropriate license and constraints.
XC5VFX30T-1FFG665I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 FXT
- Package/Case:
- 665-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2560
- Number of Logic Elements/Cells:
- 32768
- Total RAM Bits:
- 2506752
- Number of I/O:
- 360
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 665-FCBGA (27x27)
XC5VFX30T-1FFG665I FAQ
1.How can I place an order for XC5VFX30T-1FFG665I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VFX30T-1FFG665I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VFX30T-1FFG665I reliable?
The price and inventory of XC5VFX30T-1FFG665I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VFX30T-1FFG665I is usually 5 days.
3.What payment methods are accepted for XC5VFX30T-1FFG665I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VFX30T-1FFG665I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VFX30T-1FFG665I?
XC5VFX30T-1FFG665I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VFX30T-1FFG665I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VFX30T-1FFG665I?
For technical support, including XC5VFX30T-1FFG665I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VFX30T-1FFG665I requirements.
6.How does Aetrix verify that XC5VFX30T-1FFG665I is sourced from the original manufacturer or authorized distributors?
All XC5VFX30T-1FFG665I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VFX30T-1FFG665I meets industry standards.
7.What is the process for return or replacement of XC5VFX30T-1FFG665I?
All XC5VFX30T-1FFG665I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VFX30T-1FFG665I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VFX30T-1FFG665I part is unused and in its original packaging.
Return procedure for XC5VFX30T-1FFG665I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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