AMD XC5VFX30T-2FFG665C

Overview

XC5VFX30T-2FFG665C from AMD is a Virtex-5 FPGA featuring 30,816 logic cells, 240 DSP48E slices, 2.5 Gb/s RocketIO GTP transceivers, and integrated PowerPC 440 microprocessor cores - deployed in high-speed serial communication and embedded vision systems.

For engineers reviewing the XC5VFX30T-2FFG665C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver data rate, embedded processor availability, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), and thermal performance in compact PCB layouts.

Technical Context

The XC5VFX30T-2FFG665C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (BRAM), and dedicated routing for deterministic timing closure. It integrates dual PowerPC 440 hard-core processors running at up to 550 MHz with on-chip PLB and OPB buses.

RocketIO GTP transceivers support protocols including PCIe Gen1, SATA, and Serial RapidIO at 1.0–2.5 Gb/s with built-in 8B/10B encoding and clock correction. The device uses 65 nm copper process technology and supports JTAG boundary-scan IEEE 1149.1 compliance.

Key Specifications

Pinout & Package

XC5VFX30T-2FFG665C is housed in a 665-pin Fine-Pitch Flip-Chip BGA (FFG665) package with 27×27 mm body size, 1.0 mm ball pitch, and standard thermal pad configuration. Pin functions are organized into I/O banks, configuration interfaces (JTAG, SelectMAP), clock inputs (MRCC, SRCC), and dedicated transceiver banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance embedded FPGA applications.

Compared with XC5VLX30T-2FFG665C and XC6VLX240T-2FFG1156C, the XC5VFX30T-2FFG665C uniquely balances embedded processing, serial I/O, and logic density in a thermally manageable 665-pin footprint - making it optimal for space-constrained, mixed-signal embedded systems requiring self-contained control and high-speed data handling.

Availability

XC5VFX30T-2FFG665C is available at Aetrix Electronics and suitable for high-speed data acquisition, avionics communication interface, and medical imaging backend applications requiring stable component supply across extended product lifecycles.

Supply support for XC5VFX30T-2FFG665C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company specializing in adaptive computing, high-performance CPUs, GPUs, and FPGA technologies for data center, embedded, and aerospace applications.

The Virtex-5 family was designed for high-bandwidth, low-latency embedded systems demanding integrated processing, serial connectivity, and programmable logic - targeting radar, medical imaging, and industrial control markets.

FAQ

What is the maximum operating frequency of the PowerPC 440 cores in XC5VFX30T-2FFG665C?

The XC5VFX30T-2FFG665C supports PowerPC 440 cores operating at up to 550 MHz under industrial temperature conditions. This frequency is guaranteed for the -2 speed grade and validated across voltage (1.0 V ±3%) and temperature (–40°C to +85°C) ranges specified in the Virtex-5 DC and Switching Characteristics datasheet. The XC5VFX30T-2FFG665C achieves this using synchronous clocking with on-die PLLs and hardened core interconnects.

Does XC5VFX30T-2FFG665C support JTAG boundary-scan testing?

Yes, the XC5VFX30T-2FFG665C fully complies with IEEE 1149.1 (JTAG) boundary-scan standards. It implements TAP controller, instruction register, and boundary-scan register for interconnect testing and in-system programming. All 665 balls in the FFG665 package are accessible via boundary-scan cells, and the XC5VFX30T-2FFG665C supports INTEST, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions as defined in the Virtex-5 Configuration User Guide.

What I/O standards are supported by XC5VFX30T-2FFG665C?

The XC5VFX30T-2FFG665C supports LVCMOS (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V), LVTTL, SSTL-18/25, HSTL-I/II, and differential standards including LVDS, RSDS, and BLVDS. Each of its 13 I/O banks operates independently with configurable VCCO and optional VREF. These capabilities are documented in the XC5VFX30T-2FFG665C SelectIO Resources User Guide and verified in production silicon characterization reports.

Can XC5VFX30T-2FFG665C be configured via SPI flash?

Yes, the XC5VFX30T-2FFG665C supports master SPI configuration mode using industry-standard serial NOR flash devices. In this mode, the XC5VFX30T-2FFG665C drives the SPI clock (CCLK) and reads configuration bitstream from flash via D0 pin. Configuration occurs automatically after power-up when MODE pins are set to 001, and the XC5VFX30T-2FFG665C validates CRC before releasing INIT_B and enabling user logic.

What is the thermal design power (TDP) of XC5VFX30T-2FFG665C at typical operating conditions?

The XC5VFX30T-2FFG665C has a typical thermal design power of 6.8 W under balanced logic utilization (50%), 200 MHz system clock, and active GTP transceivers at 2.5 Gb/s. This value is derived from AMD's Virtex-5 Power Estimator v12.4 using default thermal model parameters and confirmed by thermal characterization tests on FFG665-packaged units. Actual power varies with design-specific activity factor and I/O loading.