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AMD XC5VFX30T-3FFG665C

Part No.:
XC5VFX30T-3FFG665C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
665-BBGA, FCBGA
Datasheet:
AetrixXC5VFX30T-3FFG665C.pdf
Description:
IC FPGA 360 I/O 665FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,733

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Product details

Overview

XC5VFX30T-3FFG665C from AMD is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps serial transceivers, and integrated PowerPC 440 processor cores - deployed in high-speed communications infrastructure and radar signal processing systems.

For engineers reviewing the XC5VFX30T-3FFG665C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (Xilinx Aurora, PCIe Gen1), embedded processor availability, and -3 speed grade timing performance for deterministic real-time processing.

Technical Context

The XC5VFX30T-3FFG665C implements a multi-die architecture with dedicated RocketIO GTP transceivers, Block RAM (BRAM) organized in 36 Kb dual-port configurations, and DSP48E slices supporting 25×18-bit multiply-accumulate operations at 550 MHz. It supports SelectIO standards including LVDS, SSTL-2, and HSTL.

Configuration occurs via Master SelectMAP mode using external SPI flash or JTAG, with bitstream encryption enabled through AES-256 and HMAC-SHA-256 authentication. The device operates across industrial temperature range (-40°C to +100°C) with core voltage of 1.0 V ±3%.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells30,816 - provides gate count equivalent to ~120K ASIC gates for complex digital logic implementation
Transceiver Speed2.5 Gbps - supports XAUI, Serial RapidIO, and CPRI protocols without external retiming
DSP Slices64 - enables parallel execution of 64 independent 25×18-bit MAC operations per clock cycle
Block RAM2,088 Kb - configurable as true dual-port memory for FIFOs, buffers, or lookup tables
Speed Grade-3 - guarantees maximum operating frequency of 550 MHz for critical path timing closure
I/O StandardsLVDS, SSTL-2, HSTL - allows direct interface to DDR2 memory, ADCs, and high-speed SERDES PHYs

Pinout & Package

XC5VFX30T-3FFG665C is housed in a 665-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 2.0 mm pitch, thermal lid, and exposed thermal pad for enhanced heat dissipation in high-power FPGA applications.

Pin/TerminalCircuit RoleDesign Meaning
M0–M2Mode ConfigurationDetermines boot source (SPI, BPI, or JTAG) and configuration width during power-up
CCLKConfiguration ClockDrives internal configuration logic; externally generated or internally derived from DCM
DINSerial Data InputCarries configuration bitstream from SPI flash into FPGA fabric
INIT_BConfiguration StatusActive-low open-drain signal indicating configuration memory readiness or error state
PROGRAM_BConfiguration ResetActive-low signal that clears configuration memory and initiates reconfiguration sequence
HR Bank 0–15I/O Voltage DomainSupports independent VCCO assignment per bank for mixed-voltage interface design

Key Features

FeatureDesign Value
Integrated PowerPC 440 CoreEnables soft-processor offload for control-plane tasks while FPGA fabric handles data-plane acceleration
RocketIO GTP TransceiversDelivers native 2.5 Gbps serial links with built-in 8B/10B encoding and elastic buffer for jitter tolerance
AES-256 Bitstream EncryptionPrevents reverse engineering and unauthorized cloning by securing configuration memory against readback attacks
DCM and PLL Clock ManagementProvides jitter-reduced clock synthesis, phase shifting, and frequency multiplication for synchronous system design
SelectIO TechnologySupports 20+ I/O standards with programmable drive strength, slew rate, and on-die termination for signal integrity optimization

Applications

Wireless Baseband ProcessingAvionics Digital Signal Processing

Use Scenario: Real-time modulation/demodulation and channel coding in LTE and WiMAX base stations.

IC Role / Device Role / Timing Role: FPGA fabric executes FFT, Viterbi decoding, and MIMO precoding; PowerPC core manages protocol stack and resource allocation.

Use Value: XC5VFX30T-3FFG665C delivers deterministic latency under 500 ns for closed-loop RF feedback control loops.

Use Scenario: Radar pulse compression and synthetic aperture imaging in airborne SAR systems.

IC Role / Device Role / Timing Role: DSP48E slices perform real-time matched filtering; BRAM buffers high-throughput ADC samples at 125 MSPS.

Use Value: XC5VFX30T-3FFG665C sustains 2.5 Gbps transceiver throughput for sensor data aggregation over fiber-optic backplane links.

Medical Imaging AccelerationIndustrial Ethernet Gateway

Use Scenario: CT scan image reconstruction using iterative algorithms requiring massive parallel compute resources.

IC Role / Device Role / Timing Role: Logic cells implement custom pipeline stages for back-projection; PowerPC core coordinates DMA transfers between DDR2 memory and PCIe endpoint.

Use Value: XC5VFX30T-3FFG665C achieves 98% utilization of 64 DSP slices for floating-point intensive reconstruction kernels.

Use Scenario: Deterministic time-synchronized packet forwarding in PROFINET IRT and EtherCAT master controllers.

IC Role / Device Role / Timing Role: FPGA fabric implements hardware timestamping and cyclic redundancy check; PowerPC core runs real-time OS and fieldbus protocol stack.

Use Value: XC5VFX30T-3FFG665C meets sub-1 µs jitter requirement for synchronized motion control networks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104IUltraScale architecture, 258K logic cells, 16.3 Gbps transceivers, no embedded processorTargets AI inference acceleration and 100G Ethernet line cards where software-defined control is handled externallyChoose when higher transceiver bandwidth and logic density outweigh need for integrated PowerPC core
XC7VX485T-2FFG1761IVirtex-7 architecture, 485K logic cells, 13.1 Gbps transceivers, dual ARM Cortex-A9 MPCoreSuitable for software-defined radio and video transcoding where Linux-capable processing is required alongside FPGA accelerationChoose when ARM-based application-level OS support and larger fabric capacity are mandatory

Compared with XC5VFX30T-3FFG665C, the XCVU9P offers 8× more logic and 6.5× faster transceivers but lacks an embedded processor; the XC7VX485T provides ARM-based software execution and 15× more logic, yet requires higher power and board area - making XC5VFX30T-3FFG665C optimal for compact, processor-augmented signal processing where 2.5 Gbps I/O suffices.

Availability

XC5VFX30T-3FFG665C is available at Aetrix Electronics and suitable for wireless infrastructure, avionics subsystems, and medical imaging equipment requiring stable component supply across extended product lifecycles.

Supply support for XC5VFX30T-3FFG665C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.

The Virtex-5 family was engineered for high-bandwidth, low-latency signal processing in mission-critical systems where deterministic timing, embedded processing, and multi-protocol serial connectivity converge.

FAQ

What is the maximum operating frequency of the XC5VFX30T-3FFG665C?

The XC5VFX30T-3FFG665C carries the -3 speed grade, guaranteeing a maximum system clock frequency of 550 MHz for fully routed and timing-closed designs. This rating applies to internal logic paths and accounts for worst-case voltage and temperature conditions across the industrial range (-40°C to +100°C). The XC5VFX30T-3FFG665C achieves this performance using 65 nm bulk CMOS process technology and optimized routing architecture.

Does the XC5VFX30T-3FFG665C include an embedded processor?

Yes, the XC5VFX30T-3FFG665C integrates two hard-core PowerPC 440 processors running at up to 550 MHz, each with 32 KB instruction and 32 KB data cache. These processors operate independently of the FPGA fabric and support full Linux kernel execution when paired with external DDR2 memory. The XC5VFX30T-3FFG665C uses these cores for protocol stack handling, system management, and real-time control tasks.

What transceiver protocols does the XC5VFX30T-3FFG665C support natively?

The XC5VFX30T-3FFG665C features RocketIO GTP transceivers rated at 2.5 Gbps and supports native physical layer implementation of XAUI, Serial RapidIO 1.2, CPRI, and Aurora 2.0 protocols. It includes built-in 8B/10B encoding/decoding, elastic buffers, and clock correction logic. The XC5VFX30T-3FFG665C does not support PCIe Gen2 or higher-speed protocols due to its GTP transceiver generation limit.

How is configuration security implemented in the XC5VFX30T-3FFG665C?

The XC5VFX30T-3FFG665C implements AES-256 encryption for bitstream confidentiality and HMAC-SHA-256 authentication for integrity verification. Configuration memory is protected against readback via eFUSE-based key locking. Secure configuration requires external SPI flash with encrypted bitstream and proper key provisioning during manufacturing. The XC5VFX30T-3FFG665C enforces these protections at every power-on and reconfiguration event.

What I/O standards are supported by the XC5VFX30T-3FFG665C HR banks?

The XC5VFX30T-3FFG665C HR (High-Range) I/O banks support LVDS, SSTL-2 Class I/II, HSTL Class I/III, and differential signaling standards including RSDS and BLVDS. Each bank operates at selectable VCCO voltages from 1.2 V to 3.3 V, enabling mixed-voltage interfaces on a single device. The XC5VFX30T-3FFG665C provides programmable drive strength, slew rate control, and on-die termination for all HR bank pins.

XC5VFX30T-3FFG665C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 FXT
Package/Case:
665-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
2560
Number of Logic Elements/Cells:
32768
Total RAM Bits:
2506752
Number of I/O:
360
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
665-FCBGA (27x27)

XC5VFX30T-3FFG665C FAQ

1.How can I place an order for XC5VFX30T-3FFG665C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VFX30T-3FFG665C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VFX30T-3FFG665C reliable?

The price and inventory of XC5VFX30T-3FFG665C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VFX30T-3FFG665C is usually 5 days.

3.What payment methods are accepted for XC5VFX30T-3FFG665C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VFX30T-3FFG665C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VFX30T-3FFG665C?

XC5VFX30T-3FFG665C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VFX30T-3FFG665C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VFX30T-3FFG665C?

For technical support, including XC5VFX30T-3FFG665C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VFX30T-3FFG665C requirements.

6.How does Aetrix verify that XC5VFX30T-3FFG665C is sourced from the original manufacturer or authorized distributors?

All XC5VFX30T-3FFG665C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VFX30T-3FFG665C meets industry standards.

7.What is the process for return or replacement of XC5VFX30T-3FFG665C?

All XC5VFX30T-3FFG665C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VFX30T-3FFG665C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VFX30T-3FFG665C part is unused and in its original packaging.

Return procedure for XC5VFX30T-3FFG665C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VFX30T-3FFG665C Tags

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