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AMD XC5VFX70T-1FFG665C

Part No.:
XC5VFX70T-1FFG665C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
665-BBGA, FCBGA
Datasheet:
AetrixXC5VFX70T-1FFG665C.pdf
Description:
IC FPGA 360 I/O 665FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,464

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Product details

Overview

XC5VFX70T-1FFG665C from AMD is a Virtex-5 FPGA with 71,680 logic cells, 4.25 Gbps serial transceivers, and integrated PowerPC 440 processor cores. It features 128 DSP48E slices, 4.9 Mb of block RAM, and supports PCI Express x8 Gen1. Used in high-performance reconfigurable computing and radar signal processing systems.

For engineers reviewing the XC5VFX70T-1FFG665C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver speed, embedded processor availability, block RAM depth, DSP slice count, and thermal performance in compact form factor designs.

Technical Context

The XC5VFX70T-1FFG665C implements a multi-voltage, multi-standard SelectIO interface supporting LVDS, SSTL, HSTL, and differential signaling up to 1.25 Gbps. Its RocketIO GTP transceivers operate at 600 Mbps–4.25 Gbps with built-in 8B/10B encoding and elastic buffers.

This device integrates two PowerPC 440 hard processor cores running at up to 550 MHz, each with 32 kB instruction and 32 kB data L1 cache, and supports coherent AXI bus interconnect for tightly coupled software-defined hardware acceleration.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells71,680 – determines maximum combinational and sequential logic capacity for custom RTL implementation
Block RAM4.9 Mb – supports large on-chip data buffering, FIFOs, and coefficient storage without external memory
DSP Slices128 × DSP48E – enables parallel multiply-accumulate operations for filtering, FFT, and matrix math
Transceiver Speed600 Mbps–4.25 Gbps – meets PCIe Gen1 x8, Serial RapidIO, and CPRI line rates
Processor Cores2 × PowerPC 440 @ 550 MHz – provides real-time control, protocol stack handling, and boot management
I/O StandardsLVDS, SSTL-2, HSTL-I, Differential SSTL-18 – ensures compatibility with DDR2, ADCs, DACs, and FPGAs

Pinout & Package

XC5VFX70T-1FFG665C is housed in a 665-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 0.8 mm pitch, designed for high I/O density and thermal dissipation in compact PCB layouts.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supply1.0 V ±3% supply for FPGA fabric and embedded processors
VCCAUXAuxiliary power supply2.5 V supply for configuration logic, clock management, and transceivers
VCCOI/O bank powerProgrammable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface support
MRCC/MRCC_NMulti-Gigabit Transceiver RefClk inputDedicated differential reference clock pair for GTP transceivers with <1.5 ps jitter tolerance
CLK0/CLK1Global clock inputsConnect to DCM or PLL for low-skew clock distribution across fabric and I/O
PROGRAM_BConfiguration resetActive-low asynchronous reset that clears configuration memory and initiates reconfiguration

Key Features

FeatureDesign Value
Integrated PowerPC 440 coresEnables hybrid software-hardware system partitioning with deterministic real-time control and offload-capable firmware execution
RocketIO GTP transceiversSupports wire-speed serialization/deserialization without external PHY, reducing board area and signal integrity complexity
DCM and PLL clock managementProvides frequency synthesis, phase shifting, and duty-cycle correction for synchronous design timing closure
SelectIO technologyAllows per-bank I/O voltage and standard assignment, simplifying interface to heterogeneous peripherals
Partial reconfiguration supportPermits dynamic logic module swapping during operation, enabling adaptive waveform or protocol updates

Applications

Radar Signal ProcessingMedical Imaging Backend

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical digital down-conversion and CFAR detection; PowerPC cores manage Ethernet transport and health monitoring.

Use Value: On-chip DSP slices and 4.25 Gbps transceivers eliminate external ADC/DAC interface bottlenecks and reduce latency below 500 ns.

Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanners.

IC Role / Device Role / Timing Role: Configurable logic processes raw k-space data; embedded processors coordinate DMA transfers to DDR2 memory and host PC communication.

Use Value: 4.9 Mb block RAM enables full-frame buffering at 12-bit depth, avoiding external memory access stalls during reconstruction.

Avionics Data ConcentratorHigh-Speed Test Equipment

Use Scenario: ARINC 429, MIL-STD-1553, and discrete I/O aggregation in flight control computers.

IC Role / Device Role / Timing Role: FPGA implements protocol engines and time-triggered scheduling; PowerPC handles ARINC 664 (AFDX) stack and diagnostics.

Use Value: Dual-core isolation and AXI coherency allow safety-critical and non-critical partitions to share memory safely under DO-254 compliance.

Use Scenario: Bit-error-rate testing and protocol validation for 3G/4G baseband components.

IC Role / Device Role / Timing Role: Generates and analyzes high-speed serial patterns via GTP transceivers; logic fabric implements PRBS generators and error counters.

Use Value: Native 4.25 Gbps transceiver operation eliminates need for external clock multipliers or retimers in test head design.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance reconfigurable computing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Xilinx XC5VLX110T-1FFG1136CNo embedded PowerPC cores; higher logic density (110K LC); same GTP transceiver specLacks hard processor for control-plane tasks; requires external microcontroller for protocol stacksChoose when logic capacity is primary constraint and software-defined control is handled externally
Xilinx XC6VLX130T-1FFG1156CVirtex-6 generation; 130K logic cells; GTX transceivers up to 6.6 Gbps; no PowerPCHigher bandwidth but lacks integrated processor; requires migration of PowerPC-based firmware to soft-core or external hostChoose for next-generation designs requiring >4.25 Gbps links and larger fabric, accepting software porting effort

Compared with XC5VFX70T-1FFG665C, the XC5VLX110T offers more logic but removes processor integration, while the XC6VLX130T increases transceiver speed and scale but abandons hard-core processing-making XC5VFX70T-1FFG665C uniquely suited for tightly coupled compute-control workloads.

Availability

XC5VFX70T-1FFG665C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentrators, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC5VFX70T-1FFG665C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and aerospace applications.

The Virtex-5 family was engineered for high-bandwidth, low-latency reconfigurable systems demanding integrated processing, high-speed serial I/O, and deterministic real-time performance in harsh environments.

FAQ

What is the maximum operating frequency of the PowerPC 440 cores in XC5VFX70T-1FFG665C?

The XC5VFX70T-1FFG665C integrates two PowerPC 440 processor cores rated for operation up to 550 MHz under specified thermal and voltage conditions. This frequency is guaranteed across the commercial temperature range (0°C to 85°C) with proper cooling and 1.0 V ±3% VCCINT supply. The XC5VFX70T-1FFG665C datasheet defines timing margins and derating curves for junction temperatures above 85°C.

Does XC5VFX70T-1FFG665C support partial reconfiguration?

Yes, XC5VFX70T-1FFG665C supports partial reconfiguration through Xilinx ISE design tools and associated bitstream generation flow. This capability allows dynamic replacement of logic modules without resetting the entire device, enabling runtime adaptation in protocols, filters, or waveforms. The XC5VFX70T-1FFG665C architecture allocates dedicated configuration logic and routing resources to maintain active functionality during partial bitstream loads.

What I/O standards are supported by XC5VFX70T-1FFG665C banks?

XC5VFX70T-1FFG665C supports LVDS, SSTL-2, SSTL-18, HSTL-I, HSTL-II, and differential versions of these standards across its 24 I/O banks. Each bank operates independently at voltages from 1.2 V to 3.3 V, allowing mixed-interface designs. The XC5VFX70T-1FFG665C documentation specifies termination requirements, drive strength settings, and timing parameters per standard and voltage combination.

How many RocketIO GTP transceivers does XC5VFX70T-1FFG665C include?

XC5VFX70T-1FFG665C includes twelve RocketIO GTP transceivers, each capable of operation from 600 Mbps to 4.25 Gbps. These transceivers support protocols including PCI Express Gen1 x1/x2/x4/x8, Serial RapidIO, and CPRI. The XC5VFX70T-1FFG665C pinout assigns dedicated differential reference clock inputs and power supplies to ensure jitter compliance and signal integrity.

What is the total block RAM capacity of XC5VFX70T-1FFG665C?

The XC5VFX70T-1FFG665C provides 4.9 Mb of total block RAM distributed across 288 BRAM blocks, each configurable as 18 Kb dual-port RAM or 36 Kb single-port RAM. This capacity supports deep buffering, large lookup tables, and coefficient storage in signal processing pipelines. The XC5VFX70T-1FFG665C architecture enables simultaneous read/write access with independent clocks per port.

XC5VFX70T-1FFG665C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 FXT
Package/Case:
665-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
5600
Number of Logic Elements/Cells:
71680
Total RAM Bits:
5455872
Number of I/O:
360
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
665-FCBGA (27x27)

XC5VFX70T-1FFG665C FAQ

1.How can I place an order for XC5VFX70T-1FFG665C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VFX70T-1FFG665C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VFX70T-1FFG665C reliable?

The price and inventory of XC5VFX70T-1FFG665C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VFX70T-1FFG665C is usually 5 days.

3.What payment methods are accepted for XC5VFX70T-1FFG665C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VFX70T-1FFG665C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VFX70T-1FFG665C?

XC5VFX70T-1FFG665C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VFX70T-1FFG665C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VFX70T-1FFG665C?

For technical support, including XC5VFX70T-1FFG665C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VFX70T-1FFG665C requirements.

6.How does Aetrix verify that XC5VFX70T-1FFG665C is sourced from the original manufacturer or authorized distributors?

All XC5VFX70T-1FFG665C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VFX70T-1FFG665C meets industry standards.

7.What is the process for return or replacement of XC5VFX70T-1FFG665C?

All XC5VFX70T-1FFG665C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VFX70T-1FFG665C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VFX70T-1FFG665C part is unused and in its original packaging.

Return procedure for XC5VFX70T-1FFG665C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VFX70T-1FFG665C Tags

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