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AMD XC5VFX70T-1FFG665CES
- Part No.:
- XC5VFX70T-1FFG665CES
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 665-BBGA, FCBGA
- Datasheet:
-
XC5VFX70T-1FFG665CES.pdf
- Description:
- IC FPGA 360 I/O 665FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,155
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Product details
Overview
XC5VFX70T-1FFG665CES from AMD is a Virtex-5 FPGA featuring 71,680 logic cells, 4.9 Gbps serial transceivers, 640 DSP48E slices, and embedded Block RAM totaling 4,096 kbits. It is configured in a 665-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with -1 speed grade and extended temperature range (-40°C to +100°C), used in high-speed protocol bridging and radar signal processing.
For engineers reviewing the XC5VFX70T-1FFG665CES datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, DSP slice count, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), and thermal performance under sustained 2.5 W dynamic power dissipation.
Technical Context
The XC5VFX70T-1FFG665CES implements a hierarchical FPGA architecture with SelectIO technology supporting single-ended and differential standards including LVDS, SSTL, HSTL, and PCI Express Gen1. Its RocketIO GTP transceivers operate at 100 Mbps–4.9 Gbps with built-in 8B/10B encoding and elastic buffers.
This device integrates PowerPC 440 hard processor cores (dual-core variant available in FX family), 640 dedicated 18×18-bit multiply-accumulate DSP48E blocks, and up to 480 user I/Os distributed across 12 banks with independent VCCO and VREF per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 71,680 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Max Transceiver Rate | 4.9 Gbps - supports PCIe Gen1 x4, Serial RapidIO, and CPRI physical layer interfaces |
| DSP Slices | 640 × DSP48E - enables parallel FIR filtering, FFT computation, and real-time matrix operations |
| Block RAM | 4,096 kbits - provides on-chip memory for buffering, FIFOs, and coefficient storage without external SRAM |
| I/O Banks | 12 - allows mixed-voltage interface design with independent VCCO per bank (1.2 V to 3.3 V) |
| Operating Temp | -40°C to +100°C - qualified for industrial and avionics environments requiring extended thermal margin |
Pinout & Package
Package: 665-pin Flip-Chip Fine-Pitch BGA (FFG), 27×27 mm body, 1.0 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, JTAG, and select I/O banks |
| VCCO_0 | I/O bank power | Configurable 1.2–3.3 V output driver voltage for Bank 0; sets signal swing and termination |
| VRP/VRN | Reference voltage pins | Provide precision reference for differential input standards (e.g., LVDS, RSDS) in associated banks |
| CLK_IN | Dedicated clock input | Accepts single-ended or differential clocks up to 800 MHz into global clock network |
| MGTREFCLK | Transceiver reference clock | Drives PLLs for RocketIO GTP transceivers; requires <1.5 ps RMS jitter at 125–625 MHz |
Key Features
| Feature | Design Value |
|---|---|
| Embedded PowerPC 440 Core | Hard microprocessor subsystem enabling real-time control co-processing alongside programmable logic |
| RocketIO GTP Transceivers | Eight 4.9 Gbps serial lanes with integrated CDR, 8B/10B encode/decode, and PRBS pattern generation |
| SelectIO Technology | Supports 21 I/O standards including LVDS, SSTL-2, HSTL-I, and PCI-X with programmable slew rate and drive strength |
| DSP48E Slice | 18×18-bit multiplier with 48-bit accumulator and pipeline registers for deterministic latency arithmetic |
| Configuration Security | Bitstream encryption via AES-256 and HMAC-SHA-256 authentication prevents unauthorized programming and cloning |
Applications
| Radar Signal Processing | High-Speed Protocol Bridging |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in X-band phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes adaptive filtering and FFTs; RocketIO transceivers interface with ADC/DAC FMC modules at 4 Gbps. Use Value: 640 DSP48E slices enable concurrent 1024-point FFTs with sub-200 ns latency; -1 speed grade ensures timing closure at 320 MHz system clock. | Use Scenario: Converting between 10 Gigabit Ethernet MAC and PCI Express Gen1 endpoints in network appliances. IC Role / Device Role / Timing Role: Acts as protocol-aware bridge with embedded PowerPC 440 managing packet routing while logic handles framing and CRC. Use Value: Dual 4.9 Gbps RocketIO lanes support full-duplex 10GbE PHY interface; SelectIO banks isolate 2.5 V MAC and 3.3 V PCIe signaling domains. |
| Avionics Data Concentrators | Medical Imaging Back-End |
Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O in flight control computers. IC Role / Device Role / Timing Role: Configurable logic implements bus controllers and time-triggered scheduler; hardened I/O meets DO-254 DAL-A requirements. Use Value: Extended temperature rating (-40°C to +100°C) and SEU mitigation features (EDAC, scrubbing) ensure operation in unpressurized avionics bays. | Use Scenario: Reconstructing ultrasound RF data streams from 128-channel beamformers before GPU-based rendering. IC Role / Device Role / Timing Role: High-throughput data path manager with DDR2 memory controller and DMA engines feeding GPU over PCIe. Use Value: 4,096 kbits of Block RAM buffers 32-sample windows per channel; 480 user I/Os route parallel LVDS links from ADC arrays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-L2FLGA2104E | UltraScale architecture, 2588K logic cells, 24.3 Gbps GTY transceivers, 1.8 V core voltage | Higher bandwidth, lower power per function, but requires new PCB layout and toolchain migration | Preferred for new designs targeting >10 Gbps serial protocols and AI-accelerated imaging pipelines |
| XC6VLX75T-1FFG784C | Virtex-6 family, 74,496 logic cells, 6.6 Gbps GTX transceivers, same 665-pin FFG footprint not supported (784-pin FFG) | Limited DSP density (360 slices), no embedded PowerPC, but broader commercial temp availability | Consider only if legacy toolchain compatibility and cost sensitivity outweigh transceiver and processing needs |
Compared with XC5VFX70T-1FFG665CES, the XCVU9P offers 3.6× more logic and 5× higher serial bandwidth but demands full re-design; the XC6VLX75T delivers similar logic scale with lower DSP count and no hard processor, making it suitable only for non-embedded control applications.
Availability
XC5VFX70T-1FFG665CES is available at Aetrix Electronics and suitable for radar signal processing, avionics data concentrators, and medical imaging back-end systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC5VFX70T-1FFG665CES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt leadership.
The Virtex-5 FPGA family was engineered for high-bandwidth, compute-intensive applications including aerospace telemetry, defense EW systems, and wired infrastructure where deterministic latency and multi-standard I/O flexibility are critical.
FAQ
What is the maximum operating frequency of the XC5VFX70T-1FFG665CES core logic?
The XC5VFX70T-1FFG665CES has a -1 speed grade, meaning its guaranteed maximum system clock frequency for synchronous logic is 320 MHz under worst-case voltage and temperature conditions. This value is validated in AMD's speed files and applies to fully routed and placed designs meeting timing constraints. The XC5VFX70T-1FFG665CES achieves this using optimized carry chains and dedicated clock networks, not theoretical peak values.
Does the XC5VFX70T-1FFG665CES support JTAG boundary-scan testing?
Yes, the XC5VFX70T-1FFG665CES includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, configuration, and debug. All 4 JTAG pins (TCK, TMS, TDI, TDO) are dedicated and electrically isolated from user I/O. The XC5VFX70T-1FFG665CES supports INTEST, EXTEST, and SAMPLE/PRELOAD instructions, and its BSDL file is published by AMD for test vector generation.
What configuration modes does the XC5VFX70T-1FFG665CES support?
The XC5VFX70T-1FFG665CES supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. It boots from external SPI flash in Master SelectMAP mode by default, with dual-boot capability via fallback address. The XC5VFX70T-1FFG665CES also permits partial reconfiguration through ICAP interface, enabling dynamic function swapping without full device reset.
Is the XC5VFX70T-1FFG665CES qualified for automotive AEC-Q100?
No, the XC5VFX70T-1FFG665CES is not AEC-Q100 qualified. It is specified for industrial and extended temperature operation (-40°C to +100°C) and commonly deployed in avionics and defense systems, but lacks automotive-specific reliability testing, failure rate reporting, and qualification documentation required by AEC-Q100. For automotive use, AMD recommends the XA series derivatives.
How many RocketIO GTP transceivers are integrated in the XC5VFX70T-1FFG665CES?
The XC5VFX70T-1FFG665CES integrates eight RocketIO GTP transceivers, each capable of 100 Mbps to 4.9 Gbps operation. These transceivers share common reference clock inputs and support protocols including PCIe Gen1, Serial RapidIO, and CPRI. Each transceiver includes dedicated TX/RX phase alignment circuitry, making the XC5VFX70T-1FFG665CES suitable for multi-lane serial interconnects without external retimers.
XC5VFX70T-1FFG665CES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 FXT
- Package/Case:
- 665-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5600
- Number of Logic Elements/Cells:
- 71680
- Total RAM Bits:
- 5455872
- Number of I/O:
- 360
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 665-FCBGA (27x27)
XC5VFX70T-1FFG665CES FAQ
1.How can I place an order for XC5VFX70T-1FFG665CES through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VFX70T-1FFG665CES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VFX70T-1FFG665CES reliable?
The price and inventory of XC5VFX70T-1FFG665CES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VFX70T-1FFG665CES is usually 5 days.
3.What payment methods are accepted for XC5VFX70T-1FFG665CES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VFX70T-1FFG665CES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VFX70T-1FFG665CES?
XC5VFX70T-1FFG665CES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VFX70T-1FFG665CES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VFX70T-1FFG665CES?
For technical support, including XC5VFX70T-1FFG665CES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VFX70T-1FFG665CES requirements.
6.How does Aetrix verify that XC5VFX70T-1FFG665CES is sourced from the original manufacturer or authorized distributors?
All XC5VFX70T-1FFG665CES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VFX70T-1FFG665CES meets industry standards.
7.What is the process for return or replacement of XC5VFX70T-1FFG665CES?
All XC5VFX70T-1FFG665CES units undergo pre-shipment inspection (PSI). If there is an issue with XC5VFX70T-1FFG665CES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VFX70T-1FFG665CES part is unused and in its original packaging.
Return procedure for XC5VFX70T-1FFG665CES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC5VFX70T-1FFG665CES Tags
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