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AMD XC5VFX70T-1FFG665I

Part No.:
XC5VFX70T-1FFG665I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
665-BBGA, FCBGA
Datasheet:
AetrixXC5VFX70T-1FFG665I.pdf
Description:
IC FPGA 360 I/O 665FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,644

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Product details

Overview

XC5VFX70T-1FFG665I from AMD is a Virtex-5 FPGA featuring 71,680 logic cells, 4.9 Gbps serial transceivers, and integrated PowerPC 440 hard processor cores - deployed in high-bandwidth radar signal processing and multi-gigabit optical transport line cards.

For engineers reviewing the XC5VFX70T-1FFG665I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance with XAUI and Serial RapidIO, embedded Block RAM capacity of 4,860 kbits, and thermal performance under industrial temperature grading (-40°C to +100°C).

Technical Context

The XC5VFX70T-1FFG665I implements a hierarchical FPGA architecture with 36-slice CLBs, 6-input LUTs, and dedicated DSP48E slices supporting 25×18-bit multiply-accumulate operations at 550 MHz. It integrates 12 RocketIO GTP transceivers with programmable pre-emphasis and receiver equalization.

This device belongs to the Virtex-5 FXT family and supports partial reconfiguration, PCI Express v1.1 endpoint functionality, and dual-clock domain DDR2 SDRAM controller interfaces up to 400 MHz data rate.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells71,680 - determines maximum combinational/sequential logic density for protocol stack implementation
Block RAM4,860 kbits - supports dual-port buffering for real-time video frame storage or packet buffering
GTP Transceivers12 × 4.9 Gbps - enables 10 Gigabit Ethernet MAC-to-PHY bridging without external SerDes
Embedded Processor2 × PowerPC 440 cores - provides deterministic control-plane processing alongside programmable fabric
I/O StandardsLVDS, SSTL-2, HSTL-I, Differential SSTL-18 - ensures compatibility with DDR2, QDR-II, and SERDES PHYs
Operating Temp-40°C to +100°C - qualified for industrial and outdoor base station environments

Pinout & Package

XC5VFX70T-1FFG665I is housed in a 665-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35 mm × 35 mm body size and 1.0 mm ball pitch. Thermal pad on underside requires controlled solder paste volume and reflow profile per AMD Xilinx UG192.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore supply1.0 V ±3% required for CLB and routing fabric operation
VCCAUXAuxiliary supply2.5 V ±5% powers configuration logic, SelectMAP interface, and transceiver reference clocks
MGTAVCCTransceiver analog supply1.0 V ±3% critical for GTP PLL jitter performance and bit-error-rate stability
PROGRAM_BConfiguration resetActive-low asynchronous reset that clears configuration memory and initiates reload sequence
DONEConfiguration statusOpen-drain output indicating successful bitstream loading and internal initialization completion

Key Features

FeatureDesign Value
Partial Reconfiguration SupportEnables dynamic logic module swapping during runtime - critical for adaptive radio protocols and multi-standard baseband processing
PCI Express Endpoint LogicIntegrated v1.1 root port logic eliminates need for external bridge IC in host-interface applications
Dual DDR2 Memory ControllerTwo independent 16-bit controllers running at 400 MHz - supports concurrent access for control plane and data plane buffers
PowerPC 440 Core IntegrationHard-macro implementation with 32 kB instruction + 32 kB data cache - avoids soft-core resource overhead and timing closure risk

Applications

Radar Signal ProcessingOptical Transport Line Card

Use Scenario: Real-time pulse-Doppler processing and beamforming on airborne synthetic aperture radar platforms.

IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and STAP algorithms; PowerPC cores manage sensor fusion and telemetry reporting.

Use Value: 12 GTP transceivers enable direct JESD204B-like ADC/DAC interface; 71K logic cells support >20 parallel filter channels.

Use Scenario: 10G/40G OTN framer and forward error correction (FEC) engine in metro DWDM systems.

IC Role / Device Role / Timing Role: Configurable SerDes and DSP48E slices implement Reed-Solomon (255,239) encoder/decoder with <1 μs latency.

Use Value: Embedded Block RAM provides 4.86 Mbits for interleaved FEC buffer storage; industrial temp grade ensures reliability in uncooled chassis.

Avionics Data ConcentratorTest Equipment Pattern Generator

Use Scenario: ARINC 664 (AFDX) end-system aggregation of flight control, navigation, and health monitoring data streams.

IC Role / Device Role / Timing Role: Implements deterministic time-triggered scheduler, virtual link switching, and CRC-32 checksum offload.

Use Value: LVDS I/O banks interface directly to AFDX PHYs; PowerPC cores run DO-254-certifiable partitioned software stacks.

Use Scenario: High-speed digital pattern generation for semiconductor ATE requiring multi-channel synchronized stimuli.

IC Role / Device Role / Timing Role: Generates 1.25 Gbps parallel test vectors using source-synchronous DDR outputs and programmable delay chains.

Use Value: 665-ball FFG package supports >200 differential I/O pairs with sub-50 ps skew; industrial temp rating allows extended burn-in operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104IUltraScale architecture; 2,586k logic cells; 128 GTY transceivers @ 32.75 Gbps; no embedded processorTargets next-gen 400G/800G optical modules where raw bandwidth exceeds Virtex-5 capabilitySelect when migrating from legacy designs requiring PCIe Gen3+ or PAM4 signaling - not drop-in compatible due to pinout and power delivery differences
XC6VLX75T-1FFG784IVirtex-6 architecture; 74,496 logic cells; 8 GTX transceivers @ 6.6 Gbps; no PowerPC coreSuitable for cost-sensitive industrial imaging where lower transceiver count and absence of hard processor is acceptableChoose for incremental upgrade path preserving PCB layout where GTP speed and dual-core control are non-critical

Compared with XC5VFX70T-1FFG665I, the XCVU9P offers higher transceiver bandwidth but lacks integrated processors, while the XC6VLX75T delivers similar logic density at lower serial I/O performance and no embedded CPU - making XC5VFX70T-1FFG665I uniquely suited for mixed-signal control + high-speed data path integration.

Availability

XC5VFX70T-1FFG665I is available at Aetrix Electronics and suitable for radar signal processing, optical transport line cards, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XC5VFX70T-1FFG665I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for AI, networking, and aerospace applications.

The Virtex-5 FXT family - including XC5VFX70T-1FFG665I - was designed specifically for embedded vision, software-defined radio, and high-throughput wired communications where hard processor subsystems coexist with high-speed serial I/O and DSP resources.

FAQ

What is the maximum supported data rate for the GTP transceivers in XC5VFX70T-1FFG665I?

The XC5VFX70T-1FFG665I integrates 12 RocketIO GTP transceivers each capable of 4.9 Gbps operation. This rate is validated per Xilinx DS100 specification and supports XAUI, Serial RapidIO 1.2, and CPRI v4.1 protocols. The XC5VFX70T-1FFG665I achieves this performance with programmable pre-emphasis and receiver equalization enabled under industrial temperature conditions.

Does XC5VFX70T-1FFG665I support partial reconfiguration, and what toolchain is required?

Yes, XC5VFX70T-1FFG665I supports hardware-verified partial reconfiguration using Xilinx ISE Design Suite 14.7 with PlanAhead implementation tools. The XC5VFX70T-1FFG665I requires modular design partitioning, static region locking, and bitstream stitching via BITGEN - all documented in UG192 and XAPP118.

What are the power supply requirements for XC5VFX70T-1FFG665I's transceiver analog rails?

XC5VFX70T-1FFG665I requires three dedicated analog supplies: MGTAVCC = 1.0 V ±3%, MGTAVTT = 1.2 V ±3%, and MGTAVTRX = 1.2 V ±3%. These rails must be isolated from digital supplies and filtered per Xilinx UG192 layout guidelines to maintain transceiver BER <10⁻¹² at 4.9 Gbps. The XC5VFX70T-1FFG665I datasheet specifies separate decoupling capacitor values per bank.

Is XC5VFX70T-1FFG665I qualified for automotive applications?

No, XC5VFX70T-1FFG665I carries an industrial temperature grade (-40°C to +100°C) and is not AEC-Q100 qualified. It is used in avionics and base station equipment where extended temperature operation is required, but it does not meet automotive qualification standards. For automotive use, designers should consider AMD/Xilinx Automotive-grade Virtex-7 or Versal devices instead of XC5VFX70T-1FFG665I.

How many DDR2 memory interfaces can XC5VFX70T-1FFG665I support simultaneously?

XC5VFX70T-1FFG665I contains two independent hard memory controller blocks, each configurable as a 16-bit DDR2 interface operating up to 400 MHz data rate (200 MHz clock). Both controllers can operate concurrently with separate address/command buses and shared or segregated DQ groups. This capability is verified in the XC5VFX70T-1FFG665I silicon and documented in UG191.

XC5VFX70T-1FFG665I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 FXT
Package/Case:
665-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
5600
Number of Logic Elements/Cells:
71680
Total RAM Bits:
5455872
Number of I/O:
360
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
665-FCBGA (27x27)

XC5VFX70T-1FFG665I FAQ

1.How can I place an order for XC5VFX70T-1FFG665I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VFX70T-1FFG665I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VFX70T-1FFG665I reliable?

The price and inventory of XC5VFX70T-1FFG665I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VFX70T-1FFG665I is usually 5 days.

3.What payment methods are accepted for XC5VFX70T-1FFG665I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VFX70T-1FFG665I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VFX70T-1FFG665I?

XC5VFX70T-1FFG665I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VFX70T-1FFG665I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VFX70T-1FFG665I?

For technical support, including XC5VFX70T-1FFG665I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VFX70T-1FFG665I requirements.

6.How does Aetrix verify that XC5VFX70T-1FFG665I is sourced from the original manufacturer or authorized distributors?

All XC5VFX70T-1FFG665I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VFX70T-1FFG665I meets industry standards.

7.What is the process for return or replacement of XC5VFX70T-1FFG665I?

All XC5VFX70T-1FFG665I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VFX70T-1FFG665I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VFX70T-1FFG665I part is unused and in its original packaging.

Return procedure for XC5VFX70T-1FFG665I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VFX70T-1FFG665I Tags

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