AMD XC5VFX70T-2FF1136I

Overview

XC5VFX70T-2FF1136I from AMD is a Virtex-5 FPGA featuring 71,680 logic cells, 6.4 Gbps serial transceivers, 288 DSP48E slices, and embedded Block RAM totaling 4,096 kbits. It is configured in a 1136-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1136) package and targets high-performance digital signal processing in radar baseband subsystems.

For engineers reviewing the XC5VFX70T-2FF1136I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, DSP slice count, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), and thermal design power of 11.2 W under typical operation.

Technical Context

The XC5VFX70T-2FF1136I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E slices for multiply-accumulate operations, and RocketIO GTP transceivers supporting protocols including PCIe Gen1, SATA, and Serial RapidIO. It integrates SelectIO technology with programmable I/O standards and on-die termination.

Configuration is performed via Master SelectMAP or JTAG mode using external PROM or processor-controlled interface. The device supports partial reconfiguration and includes built-in system monitoring for on-chip temperature and supply voltage.

Key Specifications

Pinout & Package

XC5VFX70T-2FF1136I is housed in a 1136-ball Flip-Chip Fine-Pitch BGA (FFG1136) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid. Pin functions are organized into I/O banks, configuration pins, clock inputs, transceiver lanes, and power/ground terminals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC5VLX110-2FF1136I and XC6VLX130T-2FF1156I, the XC5VFX70T-2FF1136I uniquely balances transceiver count, DSP resources, and I/O flexibility for mixed-signal embedded systems where both high-speed serial and real-time arithmetic are required simultaneously.

Availability

XC5VFX70T-2FF1136I is available at Aetrix Electronics and suitable for radar subsystems, medical imaging platforms, avionics data concentrators, and high-speed test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC5VFX70T-2FF1136I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and aerospace applications.

The Virtex-5 family was engineered for demanding signal processing and high-bandwidth interconnect applications in defense, medical, and industrial systems where deterministic timing and mixed-signal integration are critical.

FAQ

What is the maximum supported transceiver line rate for XC5VFX70T-2FF1136I?

The XC5VFX70T-2FF1136I supports a maximum transceiver line rate of 6.4 Gbps per RocketIO GTP lane. This rating is validated across temperature and voltage corners per AMD's Virtex-5 DC and Switching Characteristics documentation. The XC5VFX70T-2FF1136I achieves this performance using internal PLLs locked to differential reference clocks within 100–625 MHz range.

Does XC5VFX70T-2FF1136I support partial reconfiguration?

Yes, the XC5VFX70T-2FF1136I supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated configuration logic. This capability allows runtime replacement of specific design modules without resetting the entire device. The XC5VFX70T-2FF1136I implements this using frame-based bitstream updates aligned to CLB column boundaries.

What I/O voltage standards are supported by XC5VFX70T-2FF1136I?

The XC5VFX70T-2FF1136I supports LVCMOS, LVTTL, SSTL, HSTL, and differential LVDS I/O standards across its 16 I/O banks. Each bank operates independently at 1.2 V, 1.5 V, 1.8 V, or 2.5 V. The XC5VFX70T-2FF1136I uses on-die termination calibrated via VRN/VRP pins to maintain signal integrity at these voltages.

How many DSP48E slices does XC5VFX70T-2FF1136I contain?

The XC5VFX70T-2FF1136I contains 288 DSP48E slices. Each slice provides a 25×18 multiplier, 48-bit accumulator, and optional pipeline registers. This count is fixed for the XC5VFX70T-2FF1136I and enables concurrent execution of up to 288 multiply-accumulate operations per clock cycle.

What is the thermal design power (TDP) of XC5VFX70T-2FF1136I under typical operating conditions?

The thermal design power (TDP) of XC5VFX70T-2FF1136I is 11.2 W under typical operating conditions, as specified in AMD's Virtex-5 Data Sheet DS100. This value assumes worst-case logic utilization, 6.4 Gbps transceiver activity, and ambient temperature of 85°C. The XC5VFX70T-2FF1136I requires a heatsink rated for ≥11.2 W dissipation with ≤15°C/W junction-to-ambient thermal resistance.