AMD XC5VFX70T-2FFG1136I

Overview

XC5VFX70T-2FFG1136I from AMD is a Virtex-5 FPGA with 71,680 logic cells, 4.25 Gbps serial transceivers, and integrated PowerPC 440 processor cores. It features 6.4 Mb of block RAM, 240 DSP48E slices, and operates at -2 speed grade (1.0 V core, industrial temperature range). It is used in high-performance reconfigurable computing and radar signal processing systems.

For engineers reviewing the XC5VFX70T-2FFG1136I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, embedded processor availability, block RAM depth, DSP slice count, and FFG1136 package thermal performance.

Technical Context

The XC5VFX70T-2FFG1136I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E slices for arithmetic-intensive tasks, and RocketIO GTP transceivers supporting protocols including PCI Express Gen1 and Serial RapidIO. It integrates dual PowerPC 440 hard processor cores with 64 KB instruction and 64 KB data cache each.

Configuration is performed via SelectMAP or JTAG interface using external SPI/BPI flash or master serial mode. The device supports partial reconfiguration and includes built-in system monitoring (on-die temperature and supply voltage sensors) with I²C interface access.

Key Specifications

Pinout & Package

The XC5VFX70T-2FFG1136I is housed in a 1136-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and Pb-free/ROHS-compliant construction. Thermal design requires use of thermal vias under the die and compatible PCB stack-up per Xilinx UG196.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC5VLX110T-2FFG1136I, the XC5VFX70T-2FFG1136I trades logic capacity for embedded processing; compared with XC6VLX130T-2FFG1156I, it offers proven industrial qualification and drop-in compatibility in existing FFG1136 layouts but lacks GTX-level serial performance.

Availability

XC5VFX70T-2FFG1136I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend acceleration, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XC5VFX70T-2FFG1136I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD (acquired Xilinx in 2022) is a global semiconductor leader delivering adaptive computing platforms for data center, AI, and embedded applications.

The Virtex-5 family was designed for high-bandwidth, compute-intensive applications requiring both programmable logic and embedded processing, targeting defense, aerospace, and medical imaging markets.

FAQ

What is the maximum supported transceiver line rate for XC5VFX70T-2FFG1136I?

The XC5VFX70T-2FFG1136I supports RocketIO GTP transceivers rated up to 4.25 Gbps per lane. This line rate is guaranteed under industrial temperature conditions and with proper reference clock jitter compliance per Xilinx DS106. The XC5VFX70T-2FFG1136I achieves this using internal CDR circuitry and programmable equalization settings.

Does XC5VFX70T-2FFG1136I include embedded processor cores?

Yes, the XC5VFX70T-2FFG1136I integrates two hard PowerPC 440 processor cores, each with 64 KB instruction cache and 64 KB data cache. These cores are fully functional upon configuration and support boot-from-Flash, exception handling, and AXI bus interfacing. The XC5VFX70T-2FFG1136I uses these cores for real-time system management alongside FPGA fabric computation.

What package type does XC5VFX70T-2FFG1136I use?

The XC5VFX70T-2FFG1136I uses a 1136-ball Fine-Pitch Flip-Chip BGA (FFG) package with 1.0 mm ball pitch and 35 mm × 35 mm body size. It is RoHS-compliant and requires controlled thermal via placement beneath the die for industrial temperature operation. The XC5VFX70T-2FFG1136I package footprint matches other Virtex-5 FFG1136 devices.

Can XC5VFX70T-2FFG1136I perform partial reconfiguration?

Yes, the XC5VFX70T-2FFG1136I supports partial reconfiguration through its ICAP interface and frame-based bitstream loading. This allows dynamic replacement of logic modules without resetting the entire device or halting PowerPC core execution. The XC5VFX70T-2FFG1136I implements this using dedicated configuration logic and boundary-scan isolation between reconfigurable partitions.

What I/O standards are supported by XC5VFX70T-2FFG1136I?

The XC5VFX70T-2FFG1136I supports LVCMOS, SSTL, HSTL, differential LVDS, and TMDS across its configurable I/O banks. Each bank operates at independently selectable VCCO voltages from 1.2 V to 3.3 V. The XC5VFX70T-2FFG1136I uses these standards to interface directly with DDR2 memory, video encoders, and high-speed ADCs without level-shifting components.