AMD XC5VLX110-1FF1760C
- Part No.:
- XC5VLX110-1FF1760C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC5VLX110-1FF1760C.pdf
- Description:
- IC FPGA 800 I/O 1760FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,337
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Product details
Overview
XC5VLX110-1FF1760C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 110,592 logic cells, 6.48 Mb of block RAM, 240 DSP48E slices, and 640 user I/Os in a 1760-pin Flip-Chip Fine-Pitch BGA package. It targets high-performance digital signal processing and reconfigurable computing in radar and communications infrastructure.
For engineers reviewing the XC5VLX110-1FF1760C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, embedded memory capacity, DSP slice availability, and thermal/power characteristics for high-speed serial interface implementation.
Technical Context
The XC5VLX110-1FF1760C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated 18×18 multipliers, and integrated RocketIO GTP transceivers supporting up to 3.75 Gbps. It uses 65 nm copper process technology and supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling.
Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces. The device includes internal clock management units (DCMs) and phase-locked loops (PLLs) for jitter reduction and frequency synthesis across multiple clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 110,592 - determines maximum combinational/sequential logic capacity for complex state machines or protocol stacks |
| Block RAM | 6.48 Mb - enables large on-chip data buffering for video frame storage or packet queuing without external memory |
| DSP Slices | 240 × DSP48E - supports parallel multiply-accumulate operations at up to 550 MHz for real-time FIR filtering |
| User I/O Pins | 640 - provides high pin-count flexibility for interfacing with ADCs, DACs, memory, and high-speed serial PHYs |
| Transceiver Speed | Up to 3.75 Gbps per GTP channel - enables PCIe Gen1, SATA, and Serial RapidIO physical layer implementation |
| Package | FF1760 - 1760-pin flip-chip BGA with 27×27 mm body and 1.0 mm ball pitch, optimized for thermal dissipation in dense PCB layouts |
| Speed Grade | -1 - specifies worst-case timing performance at commercial temperature range (0°C to 85°C) |
Pinout & Package
The XC5VLX110-1FF1760C is housed in a 1760-ball flip-chip fine-pitch BGA (FF1760) package with thermal lid and underfill support. Ball pitch is 1.0 mm; body size is 27 mm × 27 mm; height is 2.3 mm. Thermal design requires exposed pad soldering and controlled airflow per Xilinx UG192.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master Serial mode; must be stable before INIT_B deassertion |
| DIN | Configuration Data Input | Serial bitstream input for Master Serial configuration; synchronous to CCLK edge |
| INIT_B | Configuration Status Output | Open-drain active-low signal indicating configuration memory readiness or error condition |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts startup sequence |
| M0–M2 | Mode Selection Inputs | Set configuration mode (e.g., Master Serial, Slave SelectMAP) at power-up; sampled on PROGRAM_B release |
Key Features
| Feature | Design Value |
|---|---|
| Advanced 65 nm process | Enables higher logic density and lower dynamic power versus 90 nm Virtex-4, critical for thermally constrained systems |
| Dedicated PCI Express® endpoint logic | Hard IP blocks reduce RTL integration effort and ensure compliance with PCIe 1.1 electrical and protocol requirements |
| Integrated GTP transceivers | Eliminates need for external serializer/deserializer ICs in multi-gigabit backplane or optical interface designs |
| SelectIO technology with adjustable drive strength | Supports impedance-matched signaling across diverse memory and peripheral interfaces without external termination resistors |
| Dual-register flip-flops per CLB slice | Improves timing closure in high-frequency control paths by enabling pipelining within single logic cell |
Applications
| Radar Signal Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming in phased-array radar systems. IC Role / Device Role / Timing Role: Reconfigurable compute engine performing FFT, CFAR, and digital down-conversion at 100+ MSPS sample rates. Use Value: 240 DSP48E slices enable concurrent multi-channel filtering; 640 I/Os support direct connection to high-speed ADCs and DACs. | Use Scenario: Pattern generation and response analysis in automated test equipment for ASIC validation. IC Role / Device Role / Timing Role: Programmable stimulus generator and high-speed capture unit synchronized to 300+ MHz system clocks. Use Value: Block RAM depth allows storage of >1 M test vectors; GTP transceivers interface directly to DUT high-speed serial lanes. |
| Wireless Baseband Processing | Medical Imaging Acceleration |
Use Scenario: LTE and WiMAX baseband modulation/demodulation in small-cell and remote radio head designs. IC Role / Device Role / Timing Role: Soft-core processor host with hardware-accelerated channel coding (Turbo, Viterbi) and OFDM symbol processing. Use Value: Logic cell count supports dual-core MicroBlaze plus custom accelerators; SelectIO supports DDR2/DDR3 memory controllers. | Use Scenario: Real-time image reconstruction in portable ultrasound and CT scanner front-ends. IC Role / Device Role / Timing Role: Pipeline accelerator for back-projection, beamforming, and DICOM compression algorithms. Use Value: 6.48 Mb block RAM buffers full-frame echo data; DSP slices execute floating-point-intensive reconstruction kernels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110-2FF1760C | Faster speed grade (-2) with improved timing margins; higher static power consumption | Better suited for designs requiring >200 MHz system clocks or tighter setup/hold constraints | Select XC5VLX110-2FF1760C only if timing closure fails at -1 grade; verify thermal budget increase |
| XC6VLX130T-1FF784C | Virtex-6 family; 130K logic cells but smaller 784-pin BGA; includes GTX transceivers (up to 6.6 Gbps) | Offers higher serial bandwidth and lower power per logic cell, but reduced I/O count and different pin compatibility | XC6VLX130T-1FF784C supports migration to higher-speed serial protocols but requires PCB redesign |
Compared with XC5VLX110-1FF1760C, the -2 speed grade improves timing margin at cost of power, while the XC6VLX130T-1FF784C delivers higher transceiver performance and newer architecture but mandates layout changes and toolchain updates.
Availability
XC5VLX110-1FF1760C is available at Aetrix Electronics and suitable for radar signal processing, high-speed test instrumentation, and wireless infrastructure applications requiring stable component supply over extended production lifecycles.
Supply support for XC5VLX110-1FF1760C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, aerospace, and industrial markets.
The Virtex-5 family was designed for high-performance reconfigurable logic in signal-intensive applications such as defense electronics, wired/wireless communications, and scientific computing.
FAQ
What is the maximum supported transceiver data rate for XC5VLX110-1FF1760C?
The XC5VLX110-1FF1760C integrates RocketIO GTP transceivers rated for operation up to 3.75 Gbps per channel. This enables compliance with PCIe Gen1, SATA I/II, and Serial RapidIO 1.2 physical layers. Actual achievable rate depends on board layout, reference clock stability, and signal integrity tuning per Xilinx UG191.
Does XC5VLX110-1FF1760C support JTAG-based configuration?
Yes, XC5VLX110-1FF1760C supports boundary-scan and configuration via IEEE 1149.1 JTAG interface. The TCK, TMS, TDI, and TDO pins allow programming, debugging, and verification without requiring external configuration PROM. JTAG mode is commonly used during development and field firmware updates.
What is the operating temperature range for XC5VLX110-1FF1760C?
XC5VLX110-1FF1760C is specified for commercial temperature operation from 0°C to +85°C ambient. The -1 speed grade defines timing parameters under these conditions. Industrial or extended temperature variants (e.g., -1I or -2E) are not available for this specific FF1760 package option.
How many clock management tiles does XC5VLX110-1FF1760C include?
XC5VLX110-1FF1760C contains 16 Digital Clock Managers (DCMs) and 4 Phase-Locked Loops (PLLs). These provide independent clock synthesis, multiplication, division, phase shifting, and duty-cycle correction across multiple domains-critical for mixed-clock systems like video pipelines or multi-standard radios.
Is XC5VLX110-1FF1760C compatible with Vivado Design Suite?
No, XC5VLX110-1FF1760C is supported exclusively by Xilinx ISE Design Suite v14.7 and earlier. Vivado does not support Virtex-5 devices. Users must maintain legacy ISE toolchains for synthesis, implementation, and bitstream generation of XC5VLX110-1FF1760C designs.
XC5VLX110-1FF1760C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 8640
- Number of Logic Elements/Cells:
- 110592
- Total RAM Bits:
- 4718592
- Number of I/O:
- 800
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XC5VLX110-1FF1760C FAQ
1.How can I place an order for XC5VLX110-1FF1760C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX110-1FF1760C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX110-1FF1760C reliable?
The price and inventory of XC5VLX110-1FF1760C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX110-1FF1760C is usually 5 days.
3.What payment methods are accepted for XC5VLX110-1FF1760C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX110-1FF1760C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX110-1FF1760C?
XC5VLX110-1FF1760C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX110-1FF1760C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX110-1FF1760C?
For technical support, including XC5VLX110-1FF1760C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX110-1FF1760C requirements.
6.How does Aetrix verify that XC5VLX110-1FF1760C is sourced from the original manufacturer or authorized distributors?
All XC5VLX110-1FF1760C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX110-1FF1760C meets industry standards.
7.What is the process for return or replacement of XC5VLX110-1FF1760C?
All XC5VLX110-1FF1760C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX110-1FF1760C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX110-1FF1760C part is unused and in its original packaging.
Return procedure for XC5VLX110-1FF1760C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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