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AMD XC5VLX110-1FF676I

Part No.:
XC5VLX110-1FF676I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BBGA, FCBGA
Datasheet:
AetrixXC5VLX110-1FF676I.pdf
Description:
IC FPGA 440 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,685

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Product details

Overview

XC5VLX110-1FF676I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 110,592 logic cells, 640 DSP48E slices, 4.9 Mb of total block RAM, and a -1 speed grade with industrial temperature range (-40°C to +100°C). It is packaged in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FF676) and used in high-performance digital signal processing and reconfigurable computing systems.

For engineers reviewing the XC5VLX110-1FF676I datasheet, pinout, applications, or equivalent options, key selection factors include logic capacity, DSP slice count, I/O voltage support (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V), transceiver capability (up to 6.5 Gb/s per lane), and industrial-grade thermal reliability.

Technical Context

The XC5VLX110-1FF676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated routing for high-speed interconnect. It integrates SelectIO technology supporting single-ended and differential standards including LVCMOS, LVDS, and SSTL.

It includes integrated PCI Express® Gen1 x8 endpoint capability, RocketIO™ GTP transceivers with built-in clock correction and elastic buffers, and dual-register flip-flops per LUT for pipelined timing closure. Configuration is performed via Master SelectMAP or JTAG interface using external SPI flash or PROM.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells110,592 - determines maximum combinational and sequential logic density for complex state machines and datapaths
DSP48E Slices640 - enables parallel multiply-accumulate operations at up to 550 MHz for radar, video, and communications algorithms
Block RAM4.9 Mb - supports large on-chip data buffering, FIFOs, and coefficient storage without external memory
I/O StandardsLVCMOS, LVDS, SSTL, HSTL - allows direct interfacing with DDR2/DDR3 memory, ADCs, DACs, and FPGAs across mixed-voltage systems
GTP Transceivers12 lanes @ 1.6–6.5 Gb/s - provides serial connectivity for Serial RapidIO, Aurora, and custom protocols without external retimers
Speed Grade-1 - specifies worst-case propagation delay and maximum operating frequency under industrial temperature conditions
Operating Temp-40°C to +100°C - ensures reliable operation in base station, avionics, and industrial control environments

Pinout & Package

XC5VLX110-1FF676I is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FF676) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) solder balls. The package supports thermal dissipation up to 12 W with appropriate PCB layout and heatsinking.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supply1.0 V ±3% supply for FPGA fabric; requires low-noise regulation and local decoupling
VCCAUXAuxiliary power supply2.5 V supply for configuration logic, JTAG, and select I/O banks
VCCOI/O bank powerConfigurable per-bank voltage (1.2–3.3 V) enabling mixed-voltage I/O interfaces
CONFIG_IOConfiguration I/ODedicated pins for Master SelectMAP mode; supports parallel configuration at up to 333 Mbps
CLK_INGlobal clock inputConnects to internal DCM/PLL for clock synthesis, phase alignment, and jitter reduction
GTxP/NTransceiver differential pairHigh-speed serial I/O with programmable pre-emphasis and receiver equalization

Key Features

FeatureDesign Value
Advanced Clock ManagementFour DCMs and two PLLs per device enable multi-phase clock generation, dynamic reconfiguration, and system-level synchronization
SelectIO TechnologySupports 24 I/O standards with programmable drive strength, slew rate, and on-die termination for signal integrity optimization
PCI Express EndpointIntegrated Gen1 x8 endpoint eliminates need for external bridge chips in host-attached acceleration cards
Partial ReconfigurationAllows runtime modification of logic regions without resetting the entire FPGA, enabling adaptive hardware updates
Secure ConfigurationBitstream encryption via AES-256 and HMAC authentication prevent unauthorized cloning and IP theft

Applications

Radar Signal ProcessingMedical Imaging Acceleration

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: Configurable datapath orchestrator performing FFT, filtering, and threshold detection with deterministic latency.

Use Value: 640 DSP48E slices enable concurrent 1024-point FFTs at 100+ MHz clock rates, reducing reliance on external DSP processors.

Use Scenario: High-throughput image reconstruction in MRI and CT scanners using iterative algorithms.

IC Role / Device Role / Timing Role: Hardware-accelerated coprocessor offloading compute-intensive back-projection and denoising kernels.

Use Value: 4.9 Mb block RAM supports on-chip storage of projection datasets, minimizing DDR bandwidth bottlenecks and latency.

Avionics Data ConcentratorsIndustrial Protocol Gateways

Use Scenario: ARINC 429, MIL-STD-1553, and AFDX protocol bridging in flight control subsystems.

IC Role / Device Role / Timing Role: Deterministic real-time protocol engine with time-triggered scheduling and error-correction logic.

Use Value: Industrial temperature rating and radiation-tolerant design (per Xilinx qualification) ensure operation in unpressurized avionics bays.

Use Scenario: Translation between Modbus TCP, PROFINET, and EtherCAT in smart factory edge controllers.

IC Role / Device Role / Timing Role: Multi-protocol state machine with precise cycle-synchronized I/O timing and packet buffering.

Use Value: SelectIO flexibility enables simultaneous 2.5 V PROFINET PHY and 3.3 V EtherCAT PHY interfacing on shared PCB layers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-capacity reconfigurable logic applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC5VLX110T-1FF1136ISame logic resources but larger FF1136 package (1136-ball); includes additional GTX transceivers (24 vs. 12)Required when >12 high-speed serial lanes or higher I/O count (>640 user I/O) is neededSelect XC5VLX110T-1FF1136I only if transceiver count or I/O expansion justifies larger footprint and cost premium
XCVU9P-2FLGA2104IUltraScale architecture; 1,182,240 logic cells, 608 UltraScale DSP slices, 48.8 Mb BRAM, 100+ GTY transceiversTargets next-generation designs requiring >10× logic density, PCIe Gen3/Gen4, or 25+ Gb/s serial linksXC5VLX110-1FF676I remains optimal for legacy-compatible, cost-sensitive, or thermally constrained deployments where UltraScale features are unnecessary

Compared with XC5VLX110T-1FF1136I and XCVU9P-2FLGA2104I, the XC5VLX110-1FF676I delivers balanced performance, industrial reliability, and mature toolchain support-making it ideal for sustaining engineering and long-lifecycle embedded systems where upgrade path stability matters more than raw scalability.

Availability

XC5VLX110-1FF676I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentrators requiring stable component supply over extended production lifecycles.

Supply support for XC5VLX110-1FF676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops and supports the Virtex FPGA portfolio as part of its Adaptive SoC strategy for high-performance computing and AI acceleration.

The Virtex-5 family was originally designed by Xilinx for demanding applications in aerospace, defense, and wired infrastructure-emphasizing signal integrity, thermal robustness, and long-term manufacturability.

FAQ

What is the maximum operating frequency of the XC5VLX110-1FF676I?

The XC5VLX110-1FF676I has a -1 speed grade, meaning its guaranteed maximum operating frequency for internal logic is 550 MHz under industrial temperature conditions. This applies to critical paths meeting timing constraints with proper placement and routing; actual achievable frequency depends on design complexity, clock topology, and I/O interface requirements. The XC5VLX110-1FF676I supports 6.5 Gb/s transceiver line rates independent of core logic speed.

Does the XC5VLX110-1FF676I support partial reconfiguration?

Yes, the XC5VLX110-1FF676I supports partial reconfiguration through Xilinx ISE Design Suite tools. This allows dynamic replacement of specific logic modules while the rest of the design remains operational-enabling adaptive functionality in radar waveform updates or protocol stack switching. The XC5VLX110-1FF676I requires bitstream encryption keys and configuration memory partitioning to implement secure partial reconfiguration.

What configuration modes does the XC5VLX110-1FF676I support?

The XC5VLX110-1FF676I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Master SelectMAP enables autonomous boot from external flash memory at up to 333 Mbps, while JTAG is used for debugging and programming during development. The XC5VLX110-1FF676I also supports fallback configuration and multi-bitstream storage in external PROM devices.

Is the XC5VLX110-1FF676I RoHS compliant?

Yes, the XC5VLX110-1FF676I is RoHS-compliant and manufactured with lead-free (Pb-free) solder balls in its FF676 package. It meets EU Directive 2011/65/EU and is compatible with standard lead-free reflow profiles (peak temperature ≤ 260°C). The XC5VLX110-1FF676I is also qualified for industrial temperature operation (-40°C to +100°C), ensuring reliability in harsh environments.

Can the XC5VLX110-1FF676I interface directly with DDR2 or DDR3 memory?

Yes, the XC5VLX110-1FF676I supports DDR2 and DDR3 memory interfaces via its SelectIO technology and dedicated memory controller IP cores. It provides programmable I/O standards including SSTL_18 for DDR2 and SSTL_15 for DDR3, with on-die termination and adjustable drive strength. The XC5VLX110-1FF676I requires external memory controller logic or Xilinx MIG IP to manage timing calibration, refresh, and burst addressing.

XC5VLX110-1FF676I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 LX
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
8640
Number of Logic Elements/Cells:
110592
Total RAM Bits:
4718592
Number of I/O:
440
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FCBGA (27x27)

XC5VLX110-1FF676I FAQ

1.How can I place an order for XC5VLX110-1FF676I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VLX110-1FF676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VLX110-1FF676I reliable?

The price and inventory of XC5VLX110-1FF676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX110-1FF676I is usually 5 days.

3.What payment methods are accepted for XC5VLX110-1FF676I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX110-1FF676I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VLX110-1FF676I?

XC5VLX110-1FF676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VLX110-1FF676I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VLX110-1FF676I?

For technical support, including XC5VLX110-1FF676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX110-1FF676I requirements.

6.How does Aetrix verify that XC5VLX110-1FF676I is sourced from the original manufacturer or authorized distributors?

All XC5VLX110-1FF676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX110-1FF676I meets industry standards.

7.What is the process for return or replacement of XC5VLX110-1FF676I?

All XC5VLX110-1FF676I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX110-1FF676I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VLX110-1FF676I part is unused and in its original packaging.

Return procedure for XC5VLX110-1FF676I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VLX110-1FF676I Tags

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