AMD XC5VLX110-1FFG1153CES
- Part No.:
- XC5VLX110-1FFG1153CES
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1153-BBGA, FCBGA
- Datasheet:
-
XC5VLX110-1FFG1153CES.pdf
- Description:
- IC FPGA 800 I/O 1153FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC5VLX110-1FFG1153CES from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 110,592 logic cells, 6.48 Mb of block RAM, and 240 DSP48E slices. It uses a 65 nm copper process, supports -1 speed grade (1.0 ns CLB delay), and is packaged in a 1153-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) with 1.0 V core voltage. It targets high-performance digital signal processing in radar baseband subsystems.
For engineers reviewing the XC5VLX110-1FFG1153CES datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (640 user I/Os), differential signaling support (LVDS, RSDS, BLVDS), transceiver line rate (up to 3.75 Gbps), and configuration interface (SelectMAP, JTAG, SPI).
Technical Context
The XC5VLX110-1FFG1153CES implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates 24 multi-gigabit transceivers supporting protocols including PCIe Gen1, SATA, and Serial RapidIO.
Configuration is performed via Master SelectMAP mode using external flash or through JTAG boundary-scan. The device supports partial reconfiguration and includes built-in clock management tiles (CMT) with DCMs and PLLs for jitter reduction and frequency synthesis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 110,592 - determines maximum combinational/sequential logic capacity for complex state machines or datapaths |
| Block RAM | 6.48 Mb - enables large on-chip buffering for video frame stores or FFT coefficient tables |
| DSP Slices | 240 × DSP48E - supports parallel multiply-accumulate operations at up to 550 MHz for real-time filtering |
| User I/O Pins | 640 - provides high-density interface routing for parallel buses, memory controllers, or sensor arrays |
| Transceiver Speed | Up to 3.75 Gbps - meets line-rate requirements for 3G-SDI video transport or 10G Ethernet PHY interfaces |
| Core Voltage | 1.0 V ±3% - defines power delivery tolerance and impacts dynamic power consumption scaling |
Pinout & Package
Package: 1153-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG), 35 mm × 35 mm, 1.0 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during master SelectMAP or slave serial modes |
| DIN | Configuration Data Input | Serial data input for JTAG or slave serial configuration |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| M0–M2 | Mode Selection Inputs | Define configuration mode (JTAG, Master/Slave SelectMAP, Serial) at power-up |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Clock Management (CMT) | Includes dual DCMs and PLL per CMT for low-jitter clock synthesis and phase alignment across multiple domains |
| Multi-Gigabit Transceivers | 24 transceivers with integrated 8B/10B encoding, elastic buffers, and PRBS generators for protocol-compliant serial links |
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reset, reducing system downtime in mission-critical applications |
| High-Density I/O Banking | 16 I/O banks with independent voltage support (1.2 V to 3.3 V) allow mixed-voltage interface integration |
Applications
| Radar Baseband Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs, CFAR detection, and digital down-conversion pipelines with deterministic latency. Use Value: 240 DSP48E slices enable concurrent 1024-point FFTs at 125 MHz, meeting sub-microsecond processing deadlines. | Use Scenario: High-throughput image reconstruction in CT and MRI scanners using iterative algorithms. IC Role / Device Role / Timing Role: Accelerates back-projection and filtered-back-projection kernels while managing DDR2/DDR3 memory bandwidth. Use Value: 6.48 Mb block RAM supports dual-frame buffering for pipelined reconstruction, eliminating external memory bottlenecks. |
| Avionics Data Concentrators | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 bus aggregation in flight control systems. IC Role / Device Role / Timing Role: Implements protocol engines, time-triggered scheduling, and deterministic packet switching logic. Use Value: 640 user I/Os enable simultaneous interfacing to 12+ avionics LRUs with isolated I/O banks for voltage domain separation. | Use Scenario: Bit-error-rate testing and protocol validation for 3G-SDI, HDMI, and PCIe Gen1 interfaces. IC Role / Device Role / Timing Role: Generates and analyzes high-speed serial patterns using embedded transceivers and PRBS logic. Use Value: 3.75 Gbps transceiver line rate covers full 3G-SDI (2.97 Gbps) and PCIe Gen1 (2.5 Gbps) compliance test margins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110T-1FFG1136C | Includes 8 RocketIO GTP transceivers (vs. 24 GT transceivers); same logic density and speed grade | Optimized for lower-power transceiver-intensive designs with fewer serial lanes | Select when transceiver count can be reduced by >60% and thermal envelope is constrained |
| XCVU3P-2FFVD1760E | UltraScale architecture; 355K logic cells, 16.5 Mb BRAM, 48 GTY transceivers, 15 Gbps line rate | Targets next-generation systems requiring higher throughput, lower latency, and PCIe Gen3/Gen4 support | Choose for new designs needing scalability beyond Virtex-5 capabilities and long-term roadmap alignment |
Compared with XC5VLX110T-1FFG1136C, the XC5VLX110-1FFG1153CES offers triple transceiver count for multi-lane serial aggregation; versus XCVU3P-2FFVD1760E, it provides proven qualification for legacy aerospace programs but lacks Gen3+ PCIe and hardened ECC.
Availability
XC5VLX1153CES is available at Aetrix Electronics and suitable for radar baseband processing, medical imaging backend acceleration, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX110-1FFG1153CES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues to support the Virtex family for aerospace, defense, and industrial applications requiring long-term reliability and radiation-tolerant variants.
The Virtex-5 family was designed for high-performance logic and signal processing in infrastructure equipment, where deterministic timing, large on-chip memory, and multi-protocol serial connectivity are critical.
FAQ
What is the operating temperature range for XC5VLX110-1FFG1153CES?
The XC5VLX110-1FFG1153CES is rated for commercial temperature operation (0 °C to 85 °C case temperature). It is not qualified for extended or industrial temperature ranges. Thermal design must maintain junction temperature below 100 °C under full static and dynamic loading conditions. The XC5VLX110-1FFG1153CES datasheet specifies derating curves for ambient temperature vs. power dissipation.
Does XC5VLX110-1FFG1153CES support partial reconfiguration?
Yes, the XC5VLX110-1FFG1153CES supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated configuration logic. This capability allows runtime swapping of functional modules without resetting the entire device. Implementation requires Xilinx ISE Design Suite 13.4 or later and adherence to floorplanning constraints defined in UG192. The XC5VLX110-1FFG1153CES documentation confirms hardware-level support for this feature.
What configuration modes are supported by XC5VLX110-1FFG1153CES?
The XC5VLX110-1FFG1153CES supports Master SelectMAP, Slave SelectMAP, JTAG, and Slave Serial configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SelectMAP enables direct loading from external parallel flash; JTAG is used for debugging and programming during development. All modes are fully documented in the XC5VLX110-1FFG1153CES configuration user guide (UG191).
Is XC5VLX110-1FFG1153CES pin-compatible with other Virtex-5 LX devices?
No, the XC5VLX110-1FFG1153CES is not pin-compatible with other Virtex-5 LX devices due to differing package types and I/O bank arrangements. The FFG1153 package has unique ball map and power/ground pin distribution. Migration to XC5VLX110T-1FFG1136C requires PCB redesign because of different package size (31 mm × 31 mm vs. 35 mm × 35 mm) and incompatible pinout. Always verify against the XC5VLX110-1FFG1153CES specific pinout table.
What is the maximum supported memory interface speed for XC5VLX110-1FFG1153CES?
The XC5VLX110-1FFG1153CES supports DDR2 SDRAM interfaces up to 400 MHz data rate (200 MHz clock) and QDR II SRAM up to 333 MHz (666 Mbps). These speeds are achievable using dedicated memory controller logic and I/O timing calibration. The XC5VLX110-1FFG1153CES memory interface performance is validated in Xilinx UG388 and requires proper board-level termination and layout matching per JEDEC specifications.
XC5VLX110-1FFG1153CES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 1153-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 8640
- Number of Logic Elements/Cells:
- 110592
- Total RAM Bits:
- 4718592
- Number of I/O:
- 800
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1153-FCBGA (35x35)
XC5VLX110-1FFG1153CES FAQ
1.How can I place an order for XC5VLX110-1FFG1153CES through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX110-1FFG1153CES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX110-1FFG1153CES reliable?
The price and inventory of XC5VLX110-1FFG1153CES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX110-1FFG1153CES is usually 5 days.
3.What payment methods are accepted for XC5VLX110-1FFG1153CES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX110-1FFG1153CES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX110-1FFG1153CES?
XC5VLX110-1FFG1153CES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX110-1FFG1153CES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX110-1FFG1153CES?
For technical support, including XC5VLX110-1FFG1153CES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX110-1FFG1153CES requirements.
6.How does Aetrix verify that XC5VLX110-1FFG1153CES is sourced from the original manufacturer or authorized distributors?
All XC5VLX110-1FFG1153CES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX110-1FFG1153CES meets industry standards.
7.What is the process for return or replacement of XC5VLX110-1FFG1153CES?
All XC5VLX110-1FFG1153CES units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX110-1FFG1153CES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX110-1FFG1153CES part is unused and in its original packaging.
Return procedure for XC5VLX110-1FFG1153CES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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