AMD XC5VLX110-1FFG1760CES

Overview

XC5VLX110-1FFG1760CES from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 110,592 logic cells, 6.48 Gb/s transceiver capability, and 1760-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) packaging. It integrates 240 DSP48E slices, 4.5 Mb of block RAM, and supports PCIe Gen1 x8 endpoint functionality in high-performance embedded vision and radar signal processing systems.

For engineers reviewing the XC5VLX110-1FFG1760CES datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (24 lanes), maximum system clock frequency (550 MHz), and thermal design power (14.2 W at typical operating conditions).

Technical Context

The XC5VLX110-1FFG1760CES implements a hierarchical FPGA architecture with six distinct logic tile types-LUT-based CLBs, dedicated DSP48E blocks, block RAM columns, clock management tiles (CMT), PCI Express® integrated blocks, and multi-gigabit transceivers (MGTs). Each MGT operates up to 6.48 Gb/s with built-in 8B/10B encoding and elastic buffers.

It uses 65 nm copper process technology and supports SelectIO™ standards including LVCMOS, SSTL, HSTL, and differential signaling (LVDS, RSDS, BLVDS). Configuration occurs via Master SelectMAP, Slave SelectMAP, or JTAG, with bitstream encryption and HMAC authentication available for secure boot.

Key Specifications

Pinout & Package

XC5VLX110-1FFG1760CES is housed in a 1760-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via internal silicon die attach and solder ball thermal paths.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC5VLX110-1FFG1760CES, the XCVU9P offers higher throughput but demands more complex power delivery and thermal management, while the XC6VLX130T trades transceiver integration and security features for lower unit cost and simpler PCB routing.

Availability

XC5VLX110-1FFG1760CES is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentrators, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC5VLX110-1FFG1760CES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA portfolio for high-performance computing, aerospace, and defense applications.

The Virtex-5 family was engineered for demanding signal processing and high-bandwidth interconnect applications, emphasizing transceiver density, DSP efficiency, and system-level security in mission-critical platforms.

FAQ

What is the maximum supported transceiver data rate for XC5VLX110-1FFG1760CES?

The XC5VLX110-1FFG1760CES supports a maximum transceiver data rate of 6.48 Gb/s per lane. This rating is validated across all 24 MGTs under specified temperature and voltage conditions per Xilinx DS106 and DS122 documentation. The XC5VLX110-1FFG1760CES achieves this using adaptive equalization and embedded 8B/10B encoding to maintain signal integrity over FR4 backplanes.

Does XC5VLX110-1FFG1760CES include a hard PCIe endpoint block?

Yes, the XC5VLX110-1FFG1760CES integrates a dedicated PCIe Gen1 x8 endpoint hard IP block compliant with PCI Express Base Specification v1.1. This block includes physical layer (PHY), data link layer (DLL), and transaction layer (TL) logic, eliminating the need for soft-core implementation. The XC5VLX110-1FFG1760CES uses this block for low-latency, deterministic host communication in avionics and test equipment.

What I/O standards does XC5VLX110-1FFG1760CES support?

The XC5VLX110-1FFG1760CES supports LVCMOS (1.2 V to 3.3 V), SSTL-18/25, HSTL-I/II, LVDS, RSDS, and BLVDS across its 700 user I/O pins. Each I/O bank is independently configurable for voltage and standard. The XC5VLX110-1FFG1760CES leverages SelectIO™ technology to ensure timing closure across mixed-standard interfaces without external level shifters.

Is XC5VLX110-1FFG1760CES compatible with Xilinx ISE Design Suite?

Yes, the XC5VLX110-1FFG1760CES is fully supported by Xilinx ISE 14.7, the final official release for Virtex-5 devices. Synthesis, place-and-route, and bitstream generation are validated for this tool version. The XC5VLX110-1FFG1760CES requires ISE-specific device files and cannot be targeted by Vivado, which does not support Virtex-5 architecture.

What is the thermal design power (TDP) of XC5VLX110-1FFG1760CES at typical operating conditions?

The XC5VLX110-1FFG1760CES has a typical thermal design power of 14.2 W under worst-case utilization (100% logic, 24 transceivers active, 550 MHz system clock) at 85°C junction temperature. This value is derived from Xilinx XTP052 power estimation methodology and confirmed in DS106 Table 12. Accurate thermal modeling for the XC5VLX110-1FFG1760CES must account for VCCINT, VCCAUX, and VCCO current contributions separately.