AMD XC5VLX110-1FFG676C

Overview

XC5VLX110-1FFG676C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 110,592 logic cells, 640 DSP48E slices, 4.9 Mb of block RAM, 48 GTX transceivers supporting up to 3.75 Gb/s, and operates at -1 speed grade. It is used in high-performance digital signal processing and reconfigurable computing systems requiring deterministic timing and multi-gigabit serial I/O.

For engineers reviewing the XC5VLX110-1FFG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), transceiver lane count and data rate, block RAM depth and width configuration, and thermal design implications of the FFG676 package.

Technical Context

The XC5VLX110-1FFG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates hardened IP including PCI Express® Endpoint v1.1, tri-mode Ethernet MAC, and embedded PowerPC 440 cores in certain Virtex-5 families - though not present in the LX110 variant.

Configuration occurs via Master SelectMAP, Slave SelectMAP, or JTAG modes using external PROM or processor-controlled interfaces. The device supports partial reconfiguration and uses 1.0 V core voltage with 2.5 V or 3.3 V I/O bank support across 16 selectable banks.

Key Specifications

Pinout & Package

The XC5VLX110-1FFG676C is housed in a 676-ball flip-chip BGA (FFG676) package with 480 user-configurable I/Os distributed across 16 banks. Power and ground balls are arranged in dedicated rows/columns per Xilinx Virtex-5 packaging conventions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC5VLX110-1FFG676C, the XC5VLX110T-1FFG1136C offers expanded I/O but same logic/DSP resources, while the XCVU3P-2FFVD1760E delivers order-of-magnitude improvements in transceiver speed and logic density at higher cost and complexity.

Availability

XC5VLX110-1FFG676C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentrators, and high-speed test equipment requiring stable component supply over extended product lifecycles.

Supply support for XC5VLX110-1FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering high-performance computing, graphics, and adaptive SoC solutions, formed through the acquisition of Xilinx in 2022.

The Virtex-5 family was originally developed by Xilinx to serve high-end reconfigurable computing needs in aerospace, defense, and instrumentation, emphasizing deterministic timing, multi-standard I/O, and transceiver integration.

FAQ

What is the maximum supported transceiver data rate for XC5VLX110-1FFG676C?

The XC5VLX110-1FFG676C integrates GTX transceivers rated for operation up to 3.75 Gb/s per lane. This rate is guaranteed under the -1 speed grade at 85°C junction temperature and 1.0 V core voltage. Applications such as PCIe Gen1 x8 and Serial RapidIO use this full bandwidth, and the transceivers support protocols including Aurora, CPRI, and custom 8B/10B encoded links. The XC5VLX110-1FFG676C does not include GTP or GTY transceivers.

Does XC5VLX110-1FFG676C support partial reconfiguration?

Yes, the XC5VLX110-1FFG676C supports partial reconfiguration through Xilinx ISE design tools and the PlanAhead implementation flow. This allows dynamic replacement of logic modules without resetting the entire device or interrupting active functions. Configuration is managed via ICAP (Internal Configuration Access Port), and the XC5VLX110-1FFG676C's frame-based architecture enables secure, time-deterministic updates. Partial bitstreams must be validated for timing and resource conflicts prior to deployment.

What I/O standards are supported by XC5VLX110-1FFG676C?

The XC5VLX110-1FFG676C supports 18 SelectIO standards per I/O bank, including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS, RSDS, and BLVDS. Each of its 16 I/O banks can be independently configured for 1.2 V to 3.3 V operation. Termination is programmable via on-die resistors, and VRN/VRP pins provide reference for differential signaling. The XC5VLX110-1FFG676C does not support MIPI or sub-1.0 V I/O standards.

Is PCI Express support integrated into XC5VLX110-1FFG676C?

Yes, the XC5VLX110-1FFG676C includes hard-wired PCI Express Endpoint v1.1 logic supporting Gen1 x1, x2, x4, and x8 configurations. This dedicated block reduces logic utilization and simplifies timing closure versus soft-core implementations. It handles link training, transaction layer packet (TLP) generation, and configuration space access. The XC5VLX110-1FFG676C does not support PCIe Gen2 or higher, nor does it include Root Complex functionality.

What is the operating temperature range for XC5VLX110-1FFG676C?

The XC5VLX110-1FFG676C is specified for commercial operation from 0°C to 85°C ambient temperature, corresponding to a maximum junction temperature of 100°C under typical thermal conditions. Its -1 speed grade defines timing parameters at this upper limit. The device is not qualified for industrial (-40°C to +100°C) or extended temperature ranges. Thermal management must ensure adequate heat dissipation from the FFG676 package to maintain reliable operation of the XC5VLX110-1FFG676C.