AMD XC5VLX110-1FFG676CES

Overview

XC5VLX110-1FFG676CES from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 110,592 logic cells, 480 DSP48E slices, and 6.9 Gb/s serial transceiver capability in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package. It targets high-performance digital signal processing and embedded vision systems requiring deterministic latency and multi-gigabit I/O.

For engineers reviewing the XC5VLX110-1FFG676CES datasheet, pinout, applications, or equivalent options, key selection factors include transceiver compliance with PCIe Gen1/2, Block RAM depth of 36 Kb per block, and support for DDR2/DDR3 memory interfaces at up to 533 MHz.

Technical Context

The XC5VLX110-1FFG676CES implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E slices for multiply-accumulate operations, and integrated RocketIO GTP transceivers. It supports SelectIO standards including LVDS, SSTL, and HSTL across 480 user I/O pins.

Configuration is performed via Master SPI or JTAG, with bitstream encryption supported through AES-256. The device operates at -1 speed grade (1.0 ns CLB delay) and requires dual-supply rails: 1.0 V core and 2.5 V auxiliary.

Key Specifications

Pinout & Package

XC5VLX110-1FFG676CES is housed in a 676-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, thermal lid, and standard JEDEC MO-271AC mechanical outline. The package supports thermal dissipation up to 12 W under typical operating conditions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC5VLX110-1FFG676CES, the -2 variant offers improved timing margin without architectural change, while the XCVU9P enables orders-of-magnitude higher bandwidth and compute density but requires full RTL and PCB redesign.

Availability

XC5VLX110-1FFG676CES is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, avionics data concentrators, and industrial machine vision controllers requiring stable component supply across extended product lifecycles.

Supply support for XC5VLX110-1FFG676CES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance embedded and datacenter applications.

The Virtex-5 family was designed for demanding signal processing, high-speed connectivity, and embedded vision applications where deterministic latency, multi-gigabit I/O, and hardware flexibility are critical.

FAQ

What is the maximum supported memory interface speed for XC5VLX110-1FFG676CES?

The XC5VLX110-1FFG676CES supports DDR2 SDRAM interfaces up to 533 MHz data rate (266 MHz clock) and DDR3 interfaces up to 400 MHz data rate (200 MHz clock) using its dedicated memory controller logic and I/O banks. These speeds are validated in Xilinx UG190 and require proper PCB layout with matched trace lengths and controlled impedance.

Does XC5VLX110-1FFG676CES support partial reconfiguration?

Yes, XC5VLX110-1FFG676CES supports partial reconfiguration through the ICAP (Internal Configuration Access Port) and dedicated PR boundary logic. This allows dynamic swapping of functional modules without resetting the entire device, enabling runtime adaptation in communication baseband or test equipment applications.

What configuration modes are supported by XC5VLX110-1FFG676CES?

XC5VLX110-1FFG676CES supports four primary configuration modes: Master SPI (using on-board serial flash), Slave Parallel (via external processor), JTAG (for programming and debugging), and Slave SelectMAP (high-speed parallel interface). Mode selection is controlled by M0–M2 pins at power-up.

Is XC5VLX110-1FFG676CES RoHS compliant and lead-free?

Yes, XC5VLX110-1FFG676CES is RoHS compliant and manufactured with lead-free (Pb-free) packaging. The "E" suffix in the part number denotes lead-free finish, and the device meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements.

What thermal management guidance applies to XC5VLX110-1FFG676CES?

XC5VLX110-1FFG676CES requires a thermal solution capable of dissipating up to 12 W under worst-case operating conditions. Xilinx recommends a 25 mm² copper thermal pad on the PCB, a 10 mm × 10 mm heatsink with ≥200 LFM airflow, and thermal interface material with ≤0.5 °C·in²/W resistance, per Xilinx UG193 thermal design guidelines.